公开(公告)号：US20120161855A1

公开(公告)日：2012-06-28

申请号：US13413192

申请日：2012-03-06

申请人： Dan Moy ,  Stephen Wu ,  Peter Wang ,  Brian W. Messenger ,  Edwin Soler ,  Gabriel Chiulli

发明人： Dan Moy ,  Stephen Wu ,  Peter Wang ,  Brian W. Messenger ,  Edwin Soler ,  Gabriel Chiulli

IPC分类号： H01H37/76

CPC分类号： G11C17/18 ,  H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus for programming an electronically programmable semiconductor fuse applies a programming current to a fuse link as a series of multiple pulses. Application of the programming current as a series of multiple short pulses provides a level of programming current sufficiently high to ensure reliable and effective electromigration while avoiding exceeding temperature limits of the fuse link.

摘要翻译： 用于编程电子可编程半导体熔丝的装置将编程电流作为一系列多个脉冲施加到熔丝链路。 将编程电流应用为一系列多个短脉冲提供足够高的编程电流电平，以确保可靠且有效的电迁移，同时避免超过熔丝链的温度限制。

公开(公告)号：US08188759B2

公开(公告)日：2012-05-29

申请号：US12561160

申请日：2009-09-16

申请人： Peter Wang ,  Harry Smith Whitesell, III ,  Danny Cam Toan Lu ,  Tzay-Fa Su ,  Michael Marriott ,  Xue Hong Ma ,  Xiao Ning Li ,  Jie Ling

发明人： Peter Wang ,  Harry Smith Whitesell, III ,  Danny Cam Toan Lu ,  Tzay-Fa Su ,  Michael Marriott ,  Xue Hong Ma ,  Xiao Ning Li ,  Jie Ling

IPC分类号： G01R31/26

CPC分类号： H02S50/10

摘要： A method and apparatus for testing a photovoltaic substrate disposes the substrate on a support gantry with connection points such as vacuum cups. The gantry is actuated into a test position. A probe nest coupled to the gantry connects to a junction box on the substrate. A power supply applies voltage to the junction box, and an actuated frame contacts an edge region of the substrate to detect any breakthrough current. The actuated frame comprises a liner for maximizing contact with the edge of the substrate. The liner may be conductive, or may have a conductive surface. Current sensors coupled to the conductive liner of the frame detect any breakthrough current. A solar spectrum simulator provides solar spectrum radiation for testing the photovoltaic properties of the substrate.

摘要翻译： 用于测试光伏基板的方法和设备将基板布置在具有诸如真空杯的连接点的支撑台架上。 龙门架启动进入测试位置。 耦合到台架的探针嵌套连接到基板上的接线盒。 电源将电压施加到接线盒，并且致动框架接触衬底的边缘区域以检测任何穿透电流。 致动框架包括用于使与基板的边缘接触最大化的衬垫。 衬垫可以是导电的，或者可以具有导电表面。 耦合到框架的导电衬垫的电流传感器检测到任何突破电流。 太阳光谱模拟器提供用于测试基板的光伏特性的太阳光谱辐射。

公开(公告)号：US20110140726A1

公开(公告)日：2011-06-16

申请号：US12950599

申请日：2010-11-19

申请人： Jeffrey S. Sullivan ,  Danny C. Lu ,  Peter Wang ,  Kashif Maqsood ,  Todd W. Martin ,  Connie Meggs ,  Kim Vellore

发明人： Jeffrey S. Sullivan ,  Danny C. Lu ,  Peter Wang ,  Kashif Maqsood ,  Todd W. Martin ,  Connie Meggs ,  Kim Vellore

IPC分类号： G01R31/00

CPC分类号： H02S50/10

摘要： Methods and apparatus for moving and evaluating the performance of solar cell modules are described. Specifically, embodiments of the invention are directed to apparatus and methods including a transparent plate having a plurality of fluid conduits therethrough, where the fluid conduits are configured to direct a fluid with sufficient force to elevate/support a solar cell module during measurement of the solar cell performance.

摘要翻译： 描述了用于移动和评估太阳能电池模块性能的方法和装置。 具体地，本发明的实施例涉及包括透明板的设备和方法，该透明板具有穿过其中的多个流体导管，其中流体导管被配置成在测量太阳能期间以足够的力引导流体来升高/支撑太阳能电池模块 电池性能。

公开(公告)号：US07715415B1

公开(公告)日：2010-05-11

申请号：US11809844

申请日：2007-06-01

申请人： Donald Pannell ,  Yosef Meyouhas ,  Peter Wang ,  Maxim Mondaeev

发明人： Donald Pannell ,  Yosef Meyouhas ,  Peter Wang ,  Maxim Mondaeev

IPC分类号： H04L12/28 ,  H04L12/56

CPC分类号： H04L45/60 ,  H04L12/2852 ,  H04L45/66

摘要： A network device for transferring data from a first network to a second network comprises a switch comprising a first port adapted to receive a frame of the data from the first network and a second port adapted to transmit the frame to the second network. The frame comprises a plurality of words including a first word comprising a first portion of an internet protocol address and a second word comprising a second portion of the internet protocol address. The switch adds one or more bits to the frame so that the first and second portions of the internet protocol address appear within a single word of the frame. A processor receives the frame from the switch, and to modify the internet protocol address in the frame. The switch receives the frame from the processor, and removes the one or more bits from the frame before the second port transmits the frame to the second network.

摘要翻译： 用于将数据从第一网络传送到第二网络的网络设备包括交换机，其包括适于从第一网络接收数据帧的第一端口和适于将帧发送到第二网络的第二端口。 该帧包括多个单词，包括包括因特网协议地址的第一部分的第一个单词和包含因特网协议地址的第二部分的第二单词。 交换机将一个或多个比特添加到该帧，使得互联网协议地址的第一和第二部分出现在帧的单个单词内。 处理器从交换机接收帧，并修改帧中的因特网协议地址。 交换机从处理器接收帧，并且在第二端口将帧发送到第二网络之前从帧中移除一个或多个比特。

公开(公告)号：US07564857B1

公开(公告)日：2009-07-21

申请号：US11809823

申请日：2007-06-01

申请人： Donald Pannell ,  Yosef Meyouhas ,  Peter Wang ,  Maxim Mondaeev

发明人： Donald Pannell ,  Yosef Meyouhas ,  Peter Wang ,  Maxim Mondaeev

IPC分类号： H04L12/28 ,  H04L12/56

CPC分类号： H04L45/00 ,  H04L45/302 ,  H04L45/60

摘要： A router comprises a processor, a single media access controller connected to the processor; and a switch comprising a plurality of ports, wherein one of the ports is connected to the single media access controller.

摘要翻译： 路由器包括处理器，连接到处理器的单个媒体访问控制器; 以及包括多个端口的交换机，其中一个端口连接到单个媒体访问控制器。

公开(公告)号：US20090128225A1

公开(公告)日：2009-05-21

申请号：US11941308

申请日：2007-11-16

申请人： Dan Moy ,  Stephen Wu ,  Peter Wang ,  Brian W. Messenger ,  Edwin Soler ,  Gabriel Chiulli

发明人： Dan Moy ,  Stephen Wu ,  Peter Wang ,  Brian W. Messenger ,  Edwin Soler ,  Gabriel Chiulli

IPC分类号： H01H37/76

CPC分类号： H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： A design structure for an apparatus for programming an electronically programmable semiconductor fuse. The apparatus applies a programming current to a fuse link as a series of multiple pulses. Application of the programming current as a series of multiple short pulses provides a level of programming current sufficiently high to ensure reliable and effective electromigration while avoiding exceeding temperature limits of the fuse link.

摘要翻译： 一种用于编程电子可编程半导体保险丝的装置的设计结构。 该装置将编程电流作为一系列多个脉冲施加到熔丝链路。 将编程电流应用为一系列多个短脉冲提供足够高的编程电流电平，以确保可靠且有效的电迁移，同时避免超过熔丝链的温度限制。

公开(公告)号：US07394150B2

公开(公告)日：2008-07-01

申请号：US10996148

申请日：2004-11-23

申请人： Mohammed Kasem ,  King Owyang ,  Frank Kuo ,  Serge Robert Jaunay ,  Sen Mao ,  Oscar Ou ,  Peter Wang ,  Chang-Sheng Chen

发明人： Mohammed Kasem ,  King Owyang ,  Frank Kuo ,  Serge Robert Jaunay ,  Sen Mao ,  Oscar Ou ,  Peter Wang ,  Chang-Sheng Chen

IPC分类号： H01L23/52 ,  H01L29/40 ,  H01L21/302

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/84385 ,  H01L2224/84801 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor package includes a die that is interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame has contacts that are aligned with terminals on the bottom surface of the die. The upper lead frame contacts a terminal on the top side of the die, and the edges of the upper lead frame are bent downward around the edges of the die, giving the upper lead frame a cup shape. The edge of the upper lead frame contact another portion of the lower lead frame, so that all of the contacts of the package are coplanar and can be surface-mounted on a printed circuit board. The terminals of the die are electrically connected to the lead frames by means of solder layers. The thicknesses of the respective solder layers that connect the die to the lead frames are predetermined to optimize the performance of the package through numerous thermal cycles. This is done by fabricating the lower lead frame with a plurality of mesas and using a double solder reflow process.

摘要翻译： 半导体封装包括在上引线框架和下引线框架之间插入倒装芯片的管芯。 下引线框架具有与芯片底表面上的端子对准的触点。 上引线框架接触管芯顶部的端子，并且上引线框架的边缘围绕模具的边缘向下弯曲，使上引线框架成杯形。 上引线框架的边缘接触下引线框架的另一部分，使得封装的所有触点是共面的，并且可以表面安装在印刷电路板上。 芯片的端子通过焊料层电连接到引线框架。 预定了将管芯与引线框架连接的各个焊料层的厚度，以通过许多热循环来优化封装的性能。 这是通过用多个台面制造下引线框架并使用双重回流焊工艺来完成的。

公开(公告)号：US20080080399A1

公开(公告)日：2008-04-03

申请号：US11866612

申请日：2007-10-03

申请人： Peter Wang ,  Ulises Olvera-Hernandez ,  James Miller

发明人： Peter Wang ,  Ulises Olvera-Hernandez ,  James Miller

IPC分类号： H04L12/28

CPC分类号： H04W24/02 ,  H04W88/08 ,  H04W92/045

摘要： A method for configuring an enhanced Node B (eNB) in a long term evolution (LTE) wireless communication network includes providing information to the eNB, wherein the eNB can perform a self-configuration process based on the provided information. An eNB for use in an LTE wireless communication network includes a universal integrated circuit card and a service control module. The universal integrated circuit card includes information that the eNB can use to perform a self-configuration process. The service control module is configured to receive the circuit card and read the information on the circuit card.

摘要翻译： 一种用于在长期演进（LTE）无线通信网络中配置增强型节点B（eNB）的方法包括向eNB提供信息，其中eNB可以基于所提供的信息执行自配置过程。 用于LTE无线通信网络的eNB包括通用集成电路卡和业务控制模块。 通用集成电路卡包括eNB可以用来执行自配置过程的信息。 服务控制模块被配置为接收电路卡并读取电路卡上的信息。

公开(公告)号：US20080003281A1

公开(公告)日：2008-01-03

申请号：US11718571

申请日：2005-11-02

申请人： Niclas Clemmensen ,  Jan-Erik Lofroth ,  Henrik Sahlen ,  Katrin Walter ,  Peter Wang ,  Martin Wikberg

发明人： Niclas Clemmensen ,  Jan-Erik Lofroth ,  Henrik Sahlen ,  Katrin Walter ,  Peter Wang ,  Martin Wikberg

IPC分类号： A61K31/4439 ,  A61K9/24 ,  A61K9/54 ,  A61P1/00

CPC分类号： A61K31/4439 ,  A61K9/1623 ,  A61K9/1652 ,  A61K9/1694 ,  A61K9/2072 ,  A61K9/209 ,  A61K9/2813 ,  A61K9/2846 ,  A61K9/2866 ,  A61K9/4808

摘要： An oral solid pharmaceutical dosage form comprising an acid sensitive proton pump inhibitor (PPI) as single active drug, releasing the PPI in two separate pulses, one immediate and one delayed. The PPI is formulated into a core material in the form of tablets, which are coated i.a. with a combination of a delay release modifying layer and a lag time controlling layer that together achieves beneficial release properties. The tablets are further provided with an enteric coating layer. The application also relates to processes for preparing the dosage forms as well as their use in the treatment of gastrointestinal diseases.

摘要翻译： 包含酸敏感质子泵抑制剂（PPI）作为单一活性药物的口服固体药物剂型，以两个分开的脉冲释放PPI，一次立即和一次延迟。 将PPI配制成片剂形式的核心材料，其包衣为 具有延迟释放修饰层和延迟时间控制层的组合，其一起实现有利的释放性质。 片剂还具有肠溶衣层。 本申请还涉及制备剂型及其在治疗胃肠疾病中的应用的方法。

公开(公告)号：US07238551B2

公开(公告)日：2007-07-03

申请号：US10996149

申请日：2004-11-23

申请人： Mohammed Kasem ,  King Owyang ,  Frank Kuo ,  Serge Robert Jaunay ,  Sen Mao ,  Oscar Ou ,  Peter Wang ,  Chang-Sheng Chen

发明人： Mohammed Kasem ,  King Owyang ,  Frank Kuo ,  Serge Robert Jaunay ,  Sen Mao ,  Oscar Ou ,  Peter Wang ,  Chang-Sheng Chen

IPC分类号： H01L21/00

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16245 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A semiconductor package includes a die that is interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame has contacts that are aligned with terminals on the bottom surface of the die. The upper lead frame contacts a terminal on the top side of the die, and the edges of the upper lead frame are bent downward around the edges of the die, giving the upper lead frame a cup shape. The edge of the upper lead frame contact another portion of the lower lead frame, so that all of the contacts of the package are coplanar and can be surface-mounted on a printed circuit board. The terminals of the die are electrically connected to the lead frames by means of solder layers. The thicknesses of the respective solder layers that connect the die to the lead frames are predetermined to optimize the performance of the package through numerous thermal cycles. This is done by fabricating the lower lead frame with a plurality of mesas and using a double solder reflow process.

摘要翻译： 半导体封装包括在上引线框架和下引线框架之间插入倒装芯片的管芯。 下引线框架具有与芯片底表面上的端子对准的触点。 上引线框架接触管芯顶部的端子，并且上引线框架的边缘围绕模具的边缘向下弯曲，使上引线框架成杯形。 上引线框架的边缘接触下引线框架的另一部分，使得封装的所有触点是共面的，并且可以表面安装在印刷电路板上。 芯片的端子通过焊料层电连接到引线框架。 预定了将管芯与引线框架连接的各个焊料层的厚度，以通过许多热循环来优化封装的性能。 这是通过用多个台面制造下引线框架并使用双重回流焊工艺来完成的。