公开(公告)号：US07394150B2

公开(公告)日：2008-07-01

申请号：US10996148

申请日：2004-11-23

申请人： Mohammed Kasem ,  King Owyang ,  Frank Kuo ,  Serge Robert Jaunay ,  Sen Mao ,  Oscar Ou ,  Peter Wang ,  Chang-Sheng Chen

发明人： Mohammed Kasem ,  King Owyang ,  Frank Kuo ,  Serge Robert Jaunay ,  Sen Mao ,  Oscar Ou ,  Peter Wang ,  Chang-Sheng Chen

IPC分类号： H01L23/52 ,  H01L29/40 ,  H01L21/302

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/84385 ,  H01L2224/84801 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor package includes a die that is interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame has contacts that are aligned with terminals on the bottom surface of the die. The upper lead frame contacts a terminal on the top side of the die, and the edges of the upper lead frame are bent downward around the edges of the die, giving the upper lead frame a cup shape. The edge of the upper lead frame contact another portion of the lower lead frame, so that all of the contacts of the package are coplanar and can be surface-mounted on a printed circuit board. The terminals of the die are electrically connected to the lead frames by means of solder layers. The thicknesses of the respective solder layers that connect the die to the lead frames are predetermined to optimize the performance of the package through numerous thermal cycles. This is done by fabricating the lower lead frame with a plurality of mesas and using a double solder reflow process.

摘要翻译： 半导体封装包括在上引线框架和下引线框架之间插入倒装芯片的管芯。 下引线框架具有与芯片底表面上的端子对准的触点。 上引线框架接触管芯顶部的端子，并且上引线框架的边缘围绕模具的边缘向下弯曲，使上引线框架成杯形。 上引线框架的边缘接触下引线框架的另一部分，使得封装的所有触点是共面的，并且可以表面安装在印刷电路板上。 芯片的端子通过焊料层电连接到引线框架。 预定了将管芯与引线框架连接的各个焊料层的厚度，以通过许多热循环来优化封装的性能。 这是通过用多个台面制造下引线框架并使用双重回流焊工艺来完成的。

公开(公告)号：US07238551B2

公开(公告)日：2007-07-03

申请号：US10996149

申请日：2004-11-23

申请人： Mohammed Kasem ,  King Owyang ,  Frank Kuo ,  Serge Robert Jaunay ,  Sen Mao ,  Oscar Ou ,  Peter Wang ,  Chang-Sheng Chen

发明人： Mohammed Kasem ,  King Owyang ,  Frank Kuo ,  Serge Robert Jaunay ,  Sen Mao ,  Oscar Ou ,  Peter Wang ,  Chang-Sheng Chen

IPC分类号： H01L21/00

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16245 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A semiconductor package includes a die that is interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame has contacts that are aligned with terminals on the bottom surface of the die. The upper lead frame contacts a terminal on the top side of the die, and the edges of the upper lead frame are bent downward around the edges of the die, giving the upper lead frame a cup shape. The edge of the upper lead frame contact another portion of the lower lead frame, so that all of the contacts of the package are coplanar and can be surface-mounted on a printed circuit board. The terminals of the die are electrically connected to the lead frames by means of solder layers. The thicknesses of the respective solder layers that connect the die to the lead frames are predetermined to optimize the performance of the package through numerous thermal cycles. This is done by fabricating the lower lead frame with a plurality of mesas and using a double solder reflow process.

摘要翻译： 半导体封装包括在上引线框架和下引线框架之间插入倒装芯片的管芯。 下引线框架具有与芯片底表面上的端子对准的触点。 上引线框架接触管芯顶部的端子，并且上引线框架的边缘围绕模具的边缘向下弯曲，使上引线框架成杯形。 上引线框架的边缘接触下引线框架的另一部分，使得封装的所有触点是共面的，并且可以表面安装在印刷电路板上。 芯片的端子通过焊料层电连接到引线框架。 预定了将管芯与引线框架连接的各个焊料层的厚度，以通过许多热循环来优化封装的性能。 这是通过用多个台面制造下引线框架并使用双重回流焊工艺来完成的。

公开(公告)号：US20060108671A1

公开(公告)日：2006-05-25

申请号：US10996148

申请日：2004-11-23

申请人： Mohammed Kasem ,  King Owyang ,  Frank Kuo ,  Serge Jaunay ,  Sen Mao ,  Oscar Ou ,  Peter Wang ,  Chang-Sheng Chen

发明人： Mohammed Kasem ,  King Owyang ,  Frank Kuo ,  Serge Jaunay ,  Sen Mao ,  Oscar Ou ,  Peter Wang ,  Chang-Sheng Chen

IPC分类号： H01L23/495

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/84385 ,  H01L2224/84801 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor package includes a die that is interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame has contacts that are aligned with terminals on the bottom surface of the die. The upper lead frame contacts a terminal on the top side of the die, and the edges of the upper lead frame are bent downward around the edges of the die, giving the upper lead frame a cup shape. The edge of the upper lead frame contact another portion of the lower lead frame, so that all of the contacts of the package are coplanar and can be surface-mounted on a printed circuit board. The terminals of the die are electrically connected to the lead frames by means of solder layers. The thicknesses of the respective solder layers that connect the die to the lead frames are predetermined to optimize the performance of the package through numerous thermal cycles. This is done by fabricating the lower lead frame with a plurality of mesas and using a double solder reflow process.

摘要翻译： 半导体封装包括在上引线框架和下引线框架之间插入倒装芯片的管芯。 下引线框架具有与芯片底表面上的端子对准的触点。 上引线框架接触管芯顶部的端子，并且上引线框架的边缘围绕模具的边缘向下弯曲，使上引线框架成杯形。 上引线框架的边缘接触下引线框架的另一部分，使得封装的所有触点是共面的，并且可以表面安装在印刷电路板上。 芯片的端子通过焊料层电连接到引线框架。 预定了将管芯与引线框架连接的各个焊料层的厚度，以通过许多热循环来优化封装的性能。 这是通过用多个台面制造下引线框架并使用双重回流焊工艺来完成的。

公开(公告)号：US20060110856A1

公开(公告)日：2006-05-25

申请号：US10996149

申请日：2004-11-23

申请人： Mohammed Kasem ,  King Owyang ,  Frank Kuo ,  Serge Jaunay ,  Sen Mao ,  Oscar Ou ,  Peter Wang ,  Chang-Sheng Chen

发明人： Mohammed Kasem ,  King Owyang ,  Frank Kuo ,  Serge Jaunay ,  Sen Mao ,  Oscar Ou ,  Peter Wang ,  Chang-Sheng Chen

IPC分类号： H01L21/44

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16245 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A semiconductor package includes a die that is interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame has contacts that are aligned with terminals on the bottom surface of the die. The upper lead frame contacts a terminal on the top side of the die, and the edges of the upper lead frame are bent downward around the edges of the die, giving the upper lead frame a cup shape. The edge of the upper lead frame contact another portion of the lower lead frame, so that all of the contacts of the package are coplanar and can be surface-mounted on a printed circuit board. The terminals of the die are electrically connected to the lead frames by means of solder layers. The thicknesses of the respective solder layers that connect the die to the lead frames are predetermined to optimize the performance of the package through numerous thermal cycles. This is done by fabricating the lower lead frame with a plurality of mesas and using a double solder reflow process.

摘要翻译： 半导体封装包括在上引线框架和下引线框架之间插入倒装芯片的管芯。 下引线框架具有与芯片底表面上的端子对准的触点。 上引线框架接触管芯顶部的端子，并且上引线框架的边缘围绕模具的边缘向下弯曲，使上引线框架成杯形。 上引线框架的边缘接触下引线框架的另一部分，使得封装的所有触点是共面的，并且可以表面安装在印刷电路板上。 芯片的端子通过焊料层电连接到引线框架。 预定了将管芯与引线框架连接的各个焊料层的厚度，以通过许多热循环来优化封装的性能。 这是通过用多个台面制造下引线框架并使用双重回流焊工艺来完成的。

公开(公告)号：US09093359B2

公开(公告)日：2015-07-28

申请号：US11479619

申请日：2006-06-30

申请人： King Owyang ,  Mohammed Kasem ,  Yuming Bai ,  Frank Kuo ,  Sen Mao ,  Sam Kuo

发明人： King Owyang ,  Mohammed Kasem ,  Yuming Bai ,  Frank Kuo ,  Sen Mao ,  Sam Kuo

IPC分类号： H05K1/11 ,  H05K1/14 ,  H01L25/16 ,  H01L23/36 ,  H01L23/498 ,  H01L23/00 ,  H02M3/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/20 ,  H05K3/28 ,  H05K3/34

CPC分类号： G05F3/08 ,  H01L23/36 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H02M3/00 ,  H02M3/04 ,  H05K1/0206 ,  H05K1/0218 ,  H05K1/141 ,  H05K1/181 ,  H05K3/202 ,  H05K3/284 ,  H05K3/3436 ,  H05K7/20409 ,  H05K7/205 ,  H05K2201/10166 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.

摘要翻译： 在单个表面贴装封装中实现的完整的电源管理系统。 该系统可被绘制到DC-DC转换器系统，并且在无引线表面贴装封装中包括驱动器/控制器，MOSFET晶体管，无源元件（例如，电感器，电容器，电阻器）和可选的二极管。 在各种实施例中，MOSFET晶体管可以由绝缘栅双极晶体管，IGBT替代。 该系统还可以是电源管理系统，智能电源模块或运动控制系统。 无源组件可以连接在引线框连接之间。 可以使用金属夹接合技术将有源部件耦合到引线框架。 在一个实施例中，暴露的金属底部可以用作有效散热器。

公开(公告)号：US20100219519A1

公开(公告)日：2010-09-02

申请号：US12779815

申请日：2010-05-13

申请人： King Owyang ,  Mohammed Kasem ,  Yuming Bai ,  Frank Kuo ,  Sen Mao ,  Sam Kuo

发明人： King Owyang ,  Mohammed Kasem ,  Yuming Bai ,  Frank Kuo ,  Sen Mao ,  Sam Kuo

IPC分类号： H01L23/52 ,  H01L23/28 ,  H01L23/538 ,  H01L23/34

CPC分类号： G05F3/08 ,  H01L23/36 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H02M3/00 ,  H02M3/04 ,  H05K1/0206 ,  H05K1/0218 ,  H05K1/141 ,  H05K1/181 ,  H05K3/202 ,  H05K3/284 ,  H05K3/3436 ,  H05K7/20409 ,  H05K7/205 ,  H05K2201/10166 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.

摘要翻译： 在单个表面贴装封装中实现的完整的电源管理系统。 该系统可被绘制到DC-DC转换器系统，并且在无引线表面贴装封装中包括驱动器/控制器，MOSFET晶体管，无源元件（例如，电感器，电容器，电阻器）和可选的二极管。 在各种实施例中，MOSFET晶体管可以由绝缘栅双极晶体管，IGBT替代。 该系统还可以是电源管理系统，智能电源模块或运动控制系统。 无源组件可以连接在引线框连接之间。 可以使用金属夹接合技术将有源部件耦合到引线框架。 在一个实施例中，暴露的金属底部可以用作有效散热器。

公开(公告)号：US20070063341A1

公开(公告)日：2007-03-22

申请号：US11479671

申请日：2006-06-30

申请人： King Owyang ,  Mohammed Kasem ,  Yuming Bai ,  Frank Kuo ,  Sen Mao ,  Sam Kuo

发明人： King Owyang ,  Mohammed Kasem ,  Yuming Bai ,  Frank Kuo ,  Sen Mao ,  Sam Kuo

IPC分类号： H01L23/34

CPC分类号： G05F3/08 ,  H01L23/36 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H02M3/00 ,  H02M3/04 ,  H05K1/0206 ,  H05K1/0218 ,  H05K1/141 ,  H05K1/181 ,  H05K3/202 ,  H05K3/284 ,  H05K3/3436 ,  H05K7/20409 ,  H05K7/205 ,  H05K2201/10166 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.

公开(公告)号：US08928138B2

公开(公告)日：2015-01-06

申请号：US12779815

申请日：2010-05-13

申请人： King Owyang ,  Mohammed Kasem ,  Yuming Bai ,  Frank Kuo ,  Sen Mao ,  Sam Kuo

发明人： King Owyang ,  Mohammed Kasem ,  Yuming Bai ,  Frank Kuo ,  Sen Mao ,  Sam Kuo

IPC分类号： H01L23/34 ,  H01L25/16 ,  H01L23/36 ,  H01L23/498 ,  H01L23/00 ,  H05K1/14 ,  H02M3/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/20 ,  H05K3/28 ,  H05K3/34

CPC分类号： G05F3/08 ,  H01L23/36 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H02M3/00 ,  H02M3/04 ,  H05K1/0206 ,  H05K1/0218 ,  H05K1/141 ,  H05K1/181 ,  H05K3/202 ,  H05K3/284 ,  H05K3/3436 ,  H05K7/20409 ,  H05K7/205 ,  H05K2201/10166 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.

公开(公告)号：US08471381B2

公开(公告)日：2013-06-25

申请号：US11479671

申请日：2006-06-30

申请人： King Owyang ,  Mohammed Kasem ,  Yuming Bai ,  Frank Kuo ,  Sen Mao ,  Sam Kuo

发明人： King Owyang ,  Mohammed Kasem ,  Yuming Bai ,  Frank Kuo ,  Sen Mao ,  Sam Kuo

IPC分类号： H01L23/34

CPC分类号： G05F3/08 ,  H01L23/36 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H02M3/00 ,  H02M3/04 ,  H05K1/0206 ,  H05K1/0218 ,  H05K1/141 ,  H05K1/181 ,  H05K3/202 ,  H05K3/284 ,  H05K3/3436 ,  H05K7/20409 ,  H05K7/205 ,  H05K2201/10166 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.

公开(公告)号：US20070063340A1

公开(公告)日：2007-03-22

申请号：US11479619

申请日：2006-06-30

申请人： King Owyang ,  Mohammed Kasem ,  Yuming Bai ,  Frank Kuo ,  Sen Mao ,  Sam Kuo

发明人： King Owyang ,  Mohammed Kasem ,  Yuming Bai ,  Frank Kuo ,  Sen Mao ,  Sam Kuo

IPC分类号： H01L23/34

CPC分类号： G05F3/08 ,  H01L23/36 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H02M3/00 ,  H02M3/04 ,  H05K1/0206 ,  H05K1/0218 ,  H05K1/141 ,  H05K1/181 ,  H05K3/202 ,  H05K3/284 ,  H05K3/3436 ,  H05K7/20409 ,  H05K7/205 ,  H05K2201/10166 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.

摘要翻译： 在单个表面贴装封装中实现的完整的电源管理系统。 该系统可被绘制到DC-DC转换器系统，并且在无引线表面贴装封装中包括驱动器/控制器，MOSFET晶体管，无源元件（例如，电感器，电容器，电阻器）和可选的二极管。 在各种实施例中，MOSFET晶体管可以由绝缘栅双极晶体管，IGBT替代。 该系统还可以是电源管理系统，智能电源模块或运动控制系统。 无源组件可以连接在引线框连接之间。 可以使用金属夹接合技术将有源部件耦合到引线框架。 在一个实施例中，暴露的金属底部可以用作有效散热器。