公开(公告)号：USRE38854E1

公开(公告)日：2005-10-25

申请号：US10142980

申请日：2002-05-13

申请人： Masamichi Nakashiba ,  Norio Kimura ,  Isamu Watanabe ,  Kaori Yoshida

发明人： Masamichi Nakashiba ,  Norio Kimura ,  Isamu Watanabe ,  Kaori Yoshida

IPC分类号： B24B5/00 ,  B24B37/04 ,  B24B49/16

CPC分类号： B24B37/042 ,  B24B37/30 ,  B24B49/16

摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.

公开(公告)号：US06939208B2

公开(公告)日：2005-09-06

申请号：US09787121

申请日：2001-01-22

申请人： Kenji Kamimura ,  Norio Kimura ,  Satoshi Okamura ,  Hideo Aizawa ,  Makoto Akagi ,  Katsuhiko Tokushige ,  Hisanori Matsuo ,  Manabu Tsujimura

发明人： Kenji Kamimura ,  Norio Kimura ,  Satoshi Okamura ,  Hideo Aizawa ,  Makoto Akagi ,  Katsuhiko Tokushige ,  Hisanori Matsuo ,  Manabu Tsujimura

IPC分类号： B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/306

CPC分类号： B24B53/017 ,  B24B29/005 ,  B24B53/003 ,  H01L21/30625

摘要： The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring, and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.

摘要翻译： 本发明涉及一种用于将诸如半导体晶片的工件抛光成平面镜面抛光的抛光装置。 抛光装置包括具有抛光表面的抛光台和顶环，并且将工件插入在抛光台和顶环之间，并以预定压力按压以抛光工件。 抛光装置包括至少两个修整单元，用于通过与作为抛光布表面的抛光表面接触来修整抛光表面。

公开(公告)号：US06722964B2

公开(公告)日：2004-04-20

申请号：US09824644

申请日：2001-04-04

申请人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

发明人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

IPC分类号： B24B100

CPC分类号： B24B37/345 ,  B24B9/065 ,  B24B37/12 ,  H01L21/67046

摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

摘要翻译： 抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属 电影。 抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光 用于抛光衬底的外周部分的机构。

公开(公告)号：US06645053B1

公开(公告)日：2003-11-11

申请号：US09622638

申请日：2000-11-08

申请人： Norio Kimura ,  You Ishii ,  Yoshikuni Tateyama

发明人： Norio Kimura ,  You Ishii ,  Yoshikuni Tateyama

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B53/02

摘要： A polishing apparatus has a turntable with a polishing cloth attached thereto and a top ring for holding and pressing a workpiece to be polished against the polishing cloth under a certain pressure. The polishing apparatus also has a first dressing unit having a contact-type dresser for dressing the polishing cloth by bringing the contact-type dresser in contact with the polishing cloth, and a second dressing unit having a noncontact-type dresser for dressing the polishing cloth with a fluid jet applied therefrom to the polishing cloth. The contact-type dresser comprises a diamond dresser or an SiC dresser.

摘要翻译： 抛光装置具有安装有抛光布的转台和用于在一定压力下将待抛光的工件保持并压在抛光布上的顶环。 抛光装置还具有第一修整单元，其具有接触型修整器，用于通过使接触型修整器与抛光布接触来修整抛光布;以及第二修整单元，具有用于修整抛光布的非接触式修整器 其中流体喷射从其施加到抛光布上。 接触式修整器包括钻石修整器或SiC修整器。

公开(公告)号：US06579152B1

公开(公告)日：2003-06-17

申请号：US09422802

申请日：1999-10-22

申请人： Norio Kimura

发明人： Norio Kimura

IPC分类号： B24B722

CPC分类号： B24B37/16 ,  B24B37/11

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface, and a top ring having a pressing surface for holding a workpiece to be polished and pressing the workpiece against the polishing surface of the turntable. At least one of the polishing surface of the turntable and the pressing surface of the top ring is a curved surface such as a convex surface or a concave surface.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有抛光表面的转台和具有用于保持要抛光的工件的按压表面并将工件压靠在转台的抛光表面上的顶环。 转台的研磨面和顶环的按压面中的至少一个是弯曲表面，例如凸面或凹面。

公开(公告)号：US06139677A

公开(公告)日：2000-10-31

申请号：US787916

申请日：1997-01-23

申请人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

发明人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B55/04 ,  C23F1/02

CPC分类号： B24B53/017 ,  B24B55/045

摘要： A polishing apparatus 70 is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable 73 with a polishing 74 cloth mounted on an upper surface thereof, a top ring 75 for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool 79 for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover 10 which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes 17 and 21 formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.

摘要翻译： 抛光装置70用于通过化学抛光和机械抛光的组合将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括：转台73，其上表面安装有抛光74布;顶环75，用于支撑待抛光的工件并将工件压靠在抛光布上;以及修整工具79，用于将抛光布修整在 转盘。 抛光装置还包括覆盖转台上表面以防止转台上的液体散落的盖10，以及形成在盖的上壁中的插入孔17和21，用于将顶环和修整工具穿过其中 。

公开(公告)号：US6024633A

公开(公告)日：2000-02-15

申请号：US18459

申请日：1998-02-04

申请人： Norio Kimura ,  Toshiya Takeuchi

发明人： Norio Kimura ,  Toshiya Takeuchi

IPC分类号： B24B41/06 ,  B24B45/00 ,  B24B29/00

CPC分类号： B24B37/30 ,  B24B41/06 ,  B24B45/00

摘要： A workpiece holding device enables stable polishing to be performed without sacrificing the structural strength of a top ring or the space necessary for machining a through hole or implanting engaging pins while allowing close contact to be made between a workpiece to a polishing cloth on a polishing tool. The top ring includes a top ring member having a holder plate for holding the workpiece on a front surface and a cover plate attached to a back surface of the holder plate by engaging a depression section formed on a back surface of the holder plate with a protrusion section formed on a front surface of the cover plate. A curved surface bearing unit provided between an end portion of a drive shaft and a back surface of the cover plate couples the drive shaft and the top ring member while permitting motion of the top ring member relative to the polishing tool. At least a portion of the curved surface bearing unit is positioned within the depression section.

摘要翻译： 工件保持装置能够进行稳定的抛光，而不会牺牲顶环的结构强度或加工通孔所需的空间或植入接合销，同时允许在工件与抛光工具上的抛光布之间进行紧密接触 。 顶环包括顶环构件，其具有用于将工件保持在前表面上的保持板和通过将形成在保持器板的后表面上的凹陷部分接合到保持器板的后表面的盖板而具有突起 形成在盖板的前表面上。 设置在驱动轴的端部和盖板的后表面之间的曲面轴承单元在允许顶环构件相对于抛光工具的运动的同时将驱动轴和顶环构件相耦合。 曲面承载单元的至少一部分位于凹部内。

公开(公告)号：US5839947A

公开(公告)日：1998-11-24

申请号：US795511

申请日：1997-02-05

申请人： Norio Kimura ,  Kunihiko Sakurai ,  Tetsuji Togawa ,  Seiji Katsuoka ,  Toyomi Nishi

发明人： Norio Kimura ,  Kunihiko Sakurai ,  Tetsuji Togawa ,  Seiji Katsuoka ,  Toyomi Nishi

IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B5/00 ,  B24B29/00

CPC分类号： B24B53/017

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, a top ring, for holding a workpiece to be polished and pressing the workpiece against the polishing surface, which is movable between a polishing position inside of the turntable and a standby position outside of the turntable, and a first device for keeping at least a lower surface of the top ring wet while the top ring is in the standby position. The polishing apparatus further includes a dressing tool for dressing the polishing surface on the turntable, and a second device for keeping at least a lower surface of the dressing tool wet while the dressing tool is in a standby position.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括其上具有抛光表面的转台，用于保持要抛光的工件的顶环，并将工件压靠在抛光表面上，该抛光表面可在转盘内部的抛光位置和位于转盘外部的待机位置之间移动 转盘和用于在顶环处于待机位置时保持顶环的至少下表面湿润的第一装置。 抛光装置还包括用于修整转台上的抛光表面的修整工具，以及用于在修整工具处于待机位置时保持敷料工具的至少下表面湿润的第二装置。

公开(公告)号：US5716264A

公开(公告)日：1998-02-10

申请号：US683424

申请日：1996-07-18

申请人： Norio Kimura ,  Ritsuo Kikuta ,  You Ishii ,  Masayoshi Hirose

发明人： Norio Kimura ,  Ritsuo Kikuta ,  You Ishii ,  Masayoshi Hirose

IPC分类号： B24B37/00 ,  B24B53/007 ,  B24B21/18

CPC分类号： B24B53/017

摘要： A polishing apparatus is employed to polish an object to be polished by urging the surface of the object to be polished against the surface of a polishing cloth and causing a relative movement therebetween, while supplying a polishing liquid into an area between the object to be polished and the polishing cloth. A plurality of nozzles spray respective fluid jets to strike against the surface of the cloth. The plurality of nozzles include more than one type of nozzle which vary flow velocity, flow rate, angle of spray, and cross-sectional configuration of a jet. The plurality of nozzles have axes positioned at a location at different distances from the rotation axis of the polishing cloth.

摘要翻译： 抛光装置用于通过将待抛光物体的表面推压在抛光布的表面上并在其之间相对移动，同时将抛光液体提供到待抛光对象之间的区域中来抛光待抛光物体 和抛光布。 多个喷嘴喷射相应的流体射流以抵靠布的表面。 多个喷嘴包括不止一种类型的喷嘴，其改变流速，流速，喷射角度和射流的横截面构造。 多个喷嘴具有位于与抛光布的旋转轴线不同的距离处的轴线。

公开(公告)号：US5653624A

公开(公告)日：1997-08-05

申请号：US527422

申请日：1995-09-13

申请人： Seiji Ishikawa ,  Norio Kimura ,  Katsuyuki Aoki

发明人： Seiji Ishikawa ,  Norio Kimura ,  Katsuyuki Aoki

IPC分类号： B24B37/10 ,  B24B5/00 ,  B24B29/00

CPC分类号： B24B37/105

摘要： A compact polishing apparatus requires less operating space than a conventional polishing apparatus generally used for polishing semiconductor wafers. The present apparatus has a swing shaft to provide a swing motion to a pressing device including a top ring member. There are three ranges of swing motion, i.e. a polishing range which is a small motion range used for polishing a wafer within the confined area of a turntable, a receiving range which is a medium motion range used for loading/unloading of a wafer in an area beyond the turntable, and a standby range which is a large motion range used for moving the top ring member to a standby or rinsing position in an area beyond the turntable. Because of the swing-based arrangement of the components in the present apparatus, isolation of critical components is easily achieved, thus resulting in low maintenance costs and long service life of the present apparatus. These advantages offer significant cost savings in the management of polishing operations.

摘要翻译： 紧凑的抛光装置比通常用于抛光半导体晶片的常规抛光装置需要较少的操作空间。 本装置具有摆动轴，以向包括顶环构件的按压装置提供摆动运动。 有三个摆动运动范围，即抛光范围，该抛光范围是用于在转台的受限区域内抛光晶片的小运动范围，作为用于将晶片加载/卸载的介质运动范围的接收范围 以及用于将顶环构件移动到转台之外的区域中的待机或冲洗位置的大的运动范围的待机范围。 由于本装置中的部件的基于摆动的布置，容易实现关键部件的隔离，因此导致本装置的维护成本低和使用寿命长。 这些优点为抛光操作的管理提供了显着的成本节约。