公开(公告)号：US5653624A

公开(公告)日：1997-08-05

申请号：US527422

申请日：1995-09-13

申请人： Seiji Ishikawa ,  Norio Kimura ,  Katsuyuki Aoki

发明人： Seiji Ishikawa ,  Norio Kimura ,  Katsuyuki Aoki

IPC分类号： B24B37/10 ,  B24B5/00 ,  B24B29/00

CPC分类号： B24B37/105

摘要： A compact polishing apparatus requires less operating space than a conventional polishing apparatus generally used for polishing semiconductor wafers. The present apparatus has a swing shaft to provide a swing motion to a pressing device including a top ring member. There are three ranges of swing motion, i.e. a polishing range which is a small motion range used for polishing a wafer within the confined area of a turntable, a receiving range which is a medium motion range used for loading/unloading of a wafer in an area beyond the turntable, and a standby range which is a large motion range used for moving the top ring member to a standby or rinsing position in an area beyond the turntable. Because of the swing-based arrangement of the components in the present apparatus, isolation of critical components is easily achieved, thus resulting in low maintenance costs and long service life of the present apparatus. These advantages offer significant cost savings in the management of polishing operations.

摘要翻译： 紧凑的抛光装置比通常用于抛光半导体晶片的常规抛光装置需要较少的操作空间。 本装置具有摆动轴，以向包括顶环构件的按压装置提供摆动运动。 有三个摆动运动范围，即抛光范围，该抛光范围是用于在转台的受限区域内抛光晶片的小运动范围，作为用于将晶片加载/卸载的介质运动范围的接收范围 以及用于将顶环构件移动到转台之外的区域中的待机或冲洗位置的大的运动范围的待机范围。 由于本装置中的部件的基于摆动的布置，容易实现关键部件的隔离，因此导致本装置的维护成本低和使用寿命长。 这些优点为抛光操作的管理提供了显着的成本节约。

公开(公告)号：US5584959A

公开(公告)日：1996-12-17

申请号：US291530

申请日：1994-08-16

申请人： Norio Kimura ,  Katsuyuki Aoki ,  Kiyotaka Kawashima ,  Seiji Ishikawa

发明人： Norio Kimura ,  Katsuyuki Aoki ,  Kiyotaka Kawashima ,  Seiji Ishikawa

IPC分类号： B01D53/14 ,  B01D53/50 ,  B01D53/58 ,  B24B55/03 ,  C02F1/52 ,  H01L21/00

CPC分类号： C02F1/5236 ,  B01D53/14 ,  B01D53/1456 ,  B01D53/50 ,  B01D53/58 ,  B24B55/03 ,  C02F1/52 ,  C02F2103/18 ,  Y10S438/909

摘要： A waste treatment system in a polishing apparatus treats waste gas and waste liquid discharged from the polishing apparatus. The waste treatment system comprises an exhaust duct provided in a partition wall enclosing the polishing apparatus, a scrubber connected to the exhaust duct through an exhauster for scrubbing waste gas discharged from the polishing apparatus, a waste liquid receiver provided below an abrasive cloth of the polishing apparatus for receiving waste liquid generated by a polishing operation and a waste liquid treatment apparatus connected to the waste liquid receiver for treating the waste liquid discharged from the polishing apparatus.

摘要翻译： 抛光装置中的废物处理系统处理从抛光装置排出的废气和废液。 废物处理系统包括设置在包围抛光装置的分隔壁中的排气管道，通过用于洗涤从抛光装置排出的废气的排气器连接到排气管道的洗涤器，设置在抛光装置的研磨布下方的废液接收器 用于接收由抛光操作产生的废液的设备和连接到废液接收器的废液处理设备，用于处理从抛光设备排出的废液。

公开(公告)号：US5651724A

公开(公告)日：1997-07-29

申请号：US524824

申请日：1995-09-07

申请人： Norio Kimura ,  Takayoshi Kawamoto ,  You Ishii ,  Katsuyuki Aoki ,  Kunio Tateishi ,  Hozumi Yasuda ,  Keisuke Namiki

发明人： Norio Kimura ,  Takayoshi Kawamoto ,  You Ishii ,  Katsuyuki Aoki ,  Kunio Tateishi ,  Hozumi Yasuda ,  Keisuke Namiki

IPC分类号： B24B37/30 ,  B24B7/00

CPC分类号： B24B37/30

摘要： A predetermined amount of liquid such as water is supplied to a backside surface of a workpiece such as a semiconductor wafer. Such liquid is a workpiece retaining liquid and is attached to a concave workpiece holding surface of a top ring. The workpiece is positioned between a turntable and the top ring and is polished by an abrasive cloth on the turntable while the workpiece is being pressed against the turntable by the top ring. While polishing, the workpiece is deformed toward the concave workpiece holding surface of the top ring, and a curvature of the deformed workpiece is controlled by the amount of liquid between the workpiece holding surface and the backside surface of the workpiece.

摘要翻译： 将诸如水的预定量的液体供应到诸如半导体晶片的工件的背面。 这种液体是工件保持液体，并且附接到顶环的凹入的工件保持表面。 工件位于转盘和顶环之间，并通过研磨布在转台上抛光，同时工件被顶环压在转台上。 在抛光时，工件朝着顶环的凹入工件保持面变形，并且变形的工件的曲率由工件保持面与工件的背面之间的液体量控制。

公开(公告)号：US5641054A

公开(公告)日：1997-06-24

申请号：US362451

申请日：1995-03-07

申请人： Satoshi Mori ,  Masao Matsumura ,  Yoichi Kanemitsu ,  Takeshi Yoshioka ,  Masaaki Kajiyama ,  Fumio Kondo ,  Yuji Shirao ,  Masato Eguchi ,  Hiroyuki Shinozaki ,  Yukio Ikeda ,  Masayoshi Hirose ,  Masaru Nakaniwa ,  Norio Kimura ,  Katsuaki Usui ,  Katsuyuki Aoki

发明人： Satoshi Mori ,  Masao Matsumura ,  Yoichi Kanemitsu ,  Takeshi Yoshioka ,  Masaaki Kajiyama ,  Fumio Kondo ,  Yuji Shirao ,  Masato Eguchi ,  Hiroyuki Shinozaki ,  Yukio Ikeda ,  Masayoshi Hirose ,  Masaru Nakaniwa ,  Norio Kimura ,  Katsuaki Usui ,  Katsuyuki Aoki

IPC分类号： H01L21/00 ,  H01L21/677 ,  B65G35/00

CPC分类号： H01L21/67167 ,  H01L21/67184 ,  H01L21/67709 ,  H01L21/67736

摘要： A magnetic levitation conveyor apparatus has levitation electromagnets, linear motors, and displacement sensors which are disposed outside of a tunnel, and a carriage of simple structure which is movable in the tunnel. The carriage is of canned structure for preventing gases from being generated. The carriage of canned structure allows the tunnel to have a reduced cross-sectional area and to be filled with a highly purified atmosphere such as of a high vacuum. The tunnel has substantially orthogonal branches at a branched point. In the branched point, the carriage can move, while being lifted out of contact with the tunnel partition, with a directional change from a main conveyor passage into a branched conveyor passage. The magnetic levitation conveyor apparatus is highly practical as it can control the carriage to be lifted and moved as described above.

摘要翻译： PCT No.PCT / JP93 / 00930 Sec。 371日期：1995年3月7日 102（e）1995年3月7日PCT PCT 1993年7月6日PCT公布。 第WO94 / 01354号公报 日期1994年1月20日磁悬浮输送装置具有设置在隧道外部的悬浮电磁体，线性电动机和位移传感器，以及可在隧道中移动的简单结构的滑架。 滑架是用于防止产生气体的罐头结构。 罐头结构的支架允许隧道具有减小的横截面积，并且填充有高度净化的气氛，例如高真空。 隧道在分支点处具有大致正交的分支。 在分支点，托架可以在与主输送机通道分支输送通道的方向改变的同时被提升而不与隧道隔板接触。 磁悬浮输送装置是高度实用的，因为它可以如上所述地控制滑架被提升和移动。

公开(公告)号：USRE38228E1

公开(公告)日：2003-08-19

申请号：US08789304

申请日：1997-01-30

申请人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Kiyotaka Kawashima ,  You Ishii

发明人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Kiyotaka Kawashima ,  You Ishii

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B37/26

摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereto for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.

公开(公告)号：US5643056A

公开(公告)日：1997-07-01

申请号：US550117

申请日：1995-10-30

申请人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Yoshimi Sasaki ,  Kouki Yamada ,  Fujio Aoyama ,  Noburu Shimizu ,  Katsuya Okumura

发明人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Yoshimi Sasaki ,  Kouki Yamada ,  Fujio Aoyama ,  Noburu Shimizu ,  Katsuya Okumura

IPC分类号： B24B7/22 ,  B24B29/02 ,  B24B37/07 ,  B24B37/10 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B7/228 ,  B24B29/02 ,  B24B37/04

摘要： A drum-type polishing apparatus for producing a flat mirror polish on an object such as a semiconductor wafer, is capable of three degrees of freedom of movement of a drum member with respect to the wafer. The relative movements can be made, successively or simultaneously, at right angles to an axis of the drum, parallel to the surface of the wafer, as well as at any desired angular orientations. Combined with a follower device to provide automatic compensation for unevenness in pressing pressure applied to the wafer during polishing, the polishing apparatus offers outstanding uniformity in polishing quality and high productivity, even for large diameter wafers, with a comparatively modest investment in both facility space and equipment cost.

摘要翻译： 用于在诸如半导体晶片的物体上制造平面镜抛光的滚筒式抛光装置能够使鼓构件相对于晶片具有三个自由度的移动。 相对运动可以连续或同时地与滚筒的轴线成直角，平行于晶片的表面以及任何期望的角度取向。 结合跟随装置，为抛光期间对晶片施加的压力压力的不均匀性提供自动补偿，抛光装置即使对于大直径晶片也具有优异的抛光质量均匀性和高生产率，在设备空间和 设备成本

公开(公告)号：US5616063A

公开(公告)日：1997-04-01

申请号：US309193

申请日：1994-09-20

申请人： Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Masako Kodera ,  Shirou Mishima ,  Atsushi Shigeta ,  Masayoshi Hirose ,  Norio Kimura ,  Seiji Ishikawa

发明人： Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Masako Kodera ,  Shirou Mishima ,  Atsushi Shigeta ,  Masayoshi Hirose ,  Norio Kimura ,  Seiji Ishikawa

IPC分类号： H01L21/302 ,  B08B1/04 ,  B24B27/00 ,  B24B37/04 ,  B24B37/34 ,  B24B51/00 ,  B24B55/12 ,  H01L21/00 ,  H01L21/677 ,  B24B49/00

CPC分类号： H01L21/67167 ,  B08B1/04 ,  B08B13/00 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/67745

摘要： A polishing apparatus is a cluster type of apparatus having a plurality of units which perform various operations. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and including a loading unit for receiving the workpiece to be polished, at least one polishing unit for polishing the workpiece, at least one washing unit for washing the workpiece which has been polished and an unloading unit for receiving the cleaned workpiece. Discrete mechanisms respectively transfer a clean workpiece and a dirty workpiece amongst the units.

摘要翻译： 抛光装置是具有执行各种操作的多个单元的集群类型的装置。 抛光装置包括具有用于传送工件的至少一个臂的通用传送机器人，设置在通用传送机器人周围的多个单元，并且包括用于接收被抛光工件的装载单元，用于抛光工件的至少一个抛光单元 至少一个用于清洗已经被抛光的工件的洗涤单元和用于接收清洁的工件的卸载单元。 离散机构分别在单元之间传送清洁的工件和脏工件。

公开(公告)号：US5476414A

公开(公告)日：1995-12-19

申请号：US124550

申请日：1993-09-22

申请人： Masayoshi Hirose ,  Manabu Tsujimura ,  Seiji Ishikawa ,  Norio Kimura ,  You Ishii

发明人： Masayoshi Hirose ,  Manabu Tsujimura ,  Seiji Ishikawa ,  Norio Kimura ,  You Ishii

IPC分类号： B24B37/10 ,  B24B37/30 ,  H01L21/304 ,  B24B7/22

CPC分类号： H01L21/02024 ,  B24B37/107 ,  B24B37/30

摘要： A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.

摘要翻译： 诸如半导体晶片的工件被支撑在顶环上并且通过研磨布在转盘上抛光，同时顶环被压靠在转台上，并且转台和顶环正在旋转。 顶环联接到顶环驱动轴，联接到用于按压顶环的压力缸，以及用于旋转顶环的电动机。 在顶环和顶环驱动轴之间插入有球面轴承，用于允许顶环与活动转台的上表面对准。 扭矩传递机构可操作地联接在顶环和顶环驱动轴之间，用于与顶环驱动轴同步地旋转顶环。

公开(公告)号：USRE38878E1

公开(公告)日：2005-11-15

申请号：US08993893

申请日：1997-12-18

申请人： Masayoshi Hirose ,  Manabu Tsujimura ,  Seiji Ishikawa ,  Norio Kimura ,  You Ishii

发明人： Masayoshi Hirose ,  Manabu Tsujimura ,  Seiji Ishikawa ,  Norio Kimura ,  You Ishii

IPC分类号： B24B7/22 ,  B24B37/04

CPC分类号： B24B37/107 ,  B24B37/30

摘要： A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.

摘要翻译： 诸如半导体晶片的工件被支撑在顶环上并且通过研磨布在转盘上抛光，同时顶环被压靠在转台上，并且转台和顶环正在旋转。 顶环联接到顶环驱动轴，联接到用于按压顶环的压力缸，以及用于旋转顶环的电动机。 在顶环和顶环驱动轴之间插入有球面轴承，用于允许顶环与活动转台的上表面对准。 扭矩传递机构可操作地联接在顶环和顶环驱动轴之间，用于与顶环驱动轴同步地旋转顶环。

公开(公告)号：US5653623A

公开(公告)日：1997-08-05

申请号：US357176

申请日：1994-12-13

申请人： Norio Kimura ,  Seiji Ishikawa ,  Masako Kodera ,  Atsushi Shigeta ,  Riichirou Aoki

发明人： Norio Kimura ,  Seiji Ishikawa ,  Masako Kodera ,  Atsushi Shigeta ,  Riichirou Aoki

IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B7/04 ,  B24B29/02

CPC分类号： B24B53/017

摘要： A polishing apparatus for polishing a surface of a workpiece such as a semiconductor wafer is installed in a clean room. The polishing apparatus includes a polishing section having a turntable with an abrasive cloth mounted on an upper surface thereof, a top ring for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, a loading section for loading the workpiece to be polished onto the top ring, and an unloading section for unloading the workpiece which has been polished from the top ring. A cover covers an entire area of movement of the top ring including the polishing section, the loading section and the unloading section. An exhaust duct discharges air of an interior space of the cover to an outside of an installation space of the polishing apparatus.

摘要翻译： 用于抛光诸如半导体晶片的工件的表面的抛光装置安装在洁净室中。 抛光装置包括具有安装在其上表面上的研磨布的转台的抛光部分，用于支撑待抛光工件的顶环，并将工件压靠在研磨布上，用于将待抛光工件加载的装载部分 以及用于卸载已经从顶环抛光的工件的卸载部分。 盖子覆盖包括抛光部分，装载部分和卸载部分在内的顶环的整个运动区域。 排气管将盖的内部空间的空气排出到抛光装置的安装空间的外部。