摘要:
A semiconductor memory device includes a memory cell array, a data bus, a reference voltage generating circuit, a voltage down converter, a VPP generating circuit, a circuit group, and a test circuit. The reference voltage generating circuit, voltage down converter, and VPP generating circuit include thick film transistors having a gate oxide film thickness suitable to a power supply voltage of 3.3 V. Circuits included in the circuit group include thin film transistors having a gate oxide film thickness suitable to a power supply voltage of 1.5 V. The reference voltage generating circuit, voltage down converter, and VPP generating circuit including the thick film transistors are arranged to form units corresponding to the position of the memory cell array.
摘要:
In a voltage down converter, an internal power supply potential can be made equal to an external power supply potential by rendering an output driving transistor included in differential amplifiers conductive in accordance with an activation of a burn-in mode detection signal. The differential amplifiers include a comparison circuit having an output changed to an inactive state in response to the burn-in mode detection signal and a transistor setting a level of a gate voltage of the drive transistor to a fixed level.
摘要:
A voltage generating circuit of the present invention includes a charge pump regulator and a voltage converting circuit. Charge pump regulator receives Ext.Vcc and a ground voltage as inputs and outputs a negative voltage Vbb1. Charge pump regulator receives Int.Vcc and negative voltage Vbb1 as inputs and outputs negative voltage Vbb2(
摘要:
The interlayer capacitance between a first metal interconnection through which a control signal is transmitted to the gate of a drive transistor and respective power supply interconnections through which a power supply potential and a ground potential is supplied is sufficiently smaller than the interlayer capacitance between an interconnection connecting a drain of the drive transistor and the first metal interconnection. The power supply interconnection is not coupled to a signal input to the gate of the drive transistor.
摘要:
In a dynamic random access memory, at a time of body-refresh operation, a bit-line potential VBL is set to a body-refresh-potential VBR, and the body-refresh-potential VBR is supplied to bit-line pairs via a bit-line precharging/equalizing circuit 111c, thereby the charge accumulated in the body of the n channel MOS transistor 72cb in a memory cell is drained to the bit-line pairs.
摘要:
For each of pads for control clock signals and address signals included in a DRAM, an n type well region is provided, and each n type well region is connected to an upper power supply source only by means of a first lower power supply line. Therefore, compared with the conventional device in which n type wells are connected to each other by a second lower power supply line, current flowing from the resistance element in a p type well to the upper power supply line is reduced. Therefore, damage to the resistance element 8 can be prevented, and surge immunity of the DRAM is increased.
摘要:
A current source is provided between a first p channel MOS transistor and a ground node, and a current/voltage converting element is provided isolatedly from the current source between the ground node and a second p channel MOS transistor having a conductance coefficient sufficiently larger than that of the first MOS transistor. The second MOS transistor is connected through a resistive element to an external power supply node. A voltage produced by the current/voltage converting element is converted into current by a voltage/current converting portion. Thus, constant current free from both vibration and a deadlock phenomenon and with small external power supply voltage dependency is supplied.
摘要:
A semiconductor integrated circuit device has a negative voltage generation circuit provided at each power supply circuit unit for six memory macros. Therefore, the response with respect to variation in a negative voltage is increased. In a standby mode, a negative voltage supply line for the six memory macros is connected by a switch circuit, and only a negative voltage generation circuit of one power supply circuit unit among six negative voltage generation circuits of the six power supply circuit units is rendered active. Thus, increase in standby current can be prevented.
摘要:
There is provided a semiconductor device supplied with internal power generated by an internal power generation circuit to perform a stable operation and, also, suppress power consumption. A control circuit, a row/column decoder and a sense amplifier are driven by an internal buck voltage. On the other hand, a data path with high power consumption is driven by an external power supply voltage. A level conversion circuit receives an address signal or a command signal having a voltage level of the external power supply voltage, converts the voltage level to the internal buck voltage, and outputs a resultant signal to the control circuit. A level conversion circuit receives a control signal having a voltage level of the internal buck voltage from the control circuit, converts the voltage level to the external power supply voltage, and outputs a resultant signal to the data path.
摘要:
The present invention provides a current-limited oscillator capable of performing stable operation even when it is driven with a low power-supply voltage, and a charge pump circuit using the oscillator. A current-limited oscillator has a delay section that includes a plurality of series-connected inverters to delay an output pulse on the basis of a current limiting level indication signal, and the oscillator further includes at least one first transistor that limits a first current between the inverters and a high potential power supply and at least one second transistor that limits a second current between the inverters and a low potential power supply, wherein at least one of the plurality of inverters is configured as a first inverter that is connected with the first transistor and is not connected with the second transistor, and at least another of the plurality of inverters is configured as a second inverter that is not connected with the first transistor and is connected with the second transistor.