公开(公告)号：US06645266B2

公开(公告)日：2003-11-11

申请号：US09983137

申请日：2001-10-23

申请人： Ping Huang

发明人： Ping Huang

IPC分类号： B01D5000

CPC分类号： B01D46/10 ,  B01D46/001 ,  B01D2273/30 ,  F24F2001/0096 ,  Y10S55/34

摘要： An air purifier has a housing, a motor, a fan, a filtering net, and a power plug. The motor and the fan are positioned in the housing. The filtering net is joined to the front of the housing. The power plug includes a rotatable member and a pair of conductive members; the conductive members have ring-shaped portions concentrically arranged in a chamber of the housing, and are electrically connected to the motor; the rotatable member is rotatably received in the chamber, and has a pair of copper strips, which stick out at outer ends for connection with a power socket, and which constantly touch a respective one of the concentric ring-shaped portions from inner ends in the rotation of the rotatable member for adjustment of the position of the air purifier.

公开(公告)号：US06579333B2

公开(公告)日：2003-06-17

申请号：US09899254

申请日：2001-07-06

申请人： Ping Huang

发明人： Ping Huang

IPC分类号： B01D3530

CPC分类号： B01D46/4245 ,  B01D46/42 ,  F24F3/1603

摘要： An air purifier has a rotatable power plug capable to be inserted directly into a common socket and to be turned around to suit to different directions and positions of various sockets to increase facility in use. Besides, the body of the air purifier is provided with a bulb inside and a bulb switch on an upper side to turn on or turn off the bulb, thus also serving as a lamp lighting at night.

公开(公告)号：USD435097S

公开(公告)日：2000-12-12

申请号：US122728

申请日：2000-05-03

申请人： Ping Huang

设计人： Ping Huang

公开(公告)号：USD434128S

公开(公告)日：2000-11-21

申请号：US122726

申请日：2000-05-03

申请人： Ping Huang

设计人： Ping Huang

公开(公告)号：US5610946A

公开(公告)日：1997-03-11

申请号：US378337

申请日：1995-01-26

申请人： Kiyoshi Tanaka ,  Ping Huang

发明人： Kiyoshi Tanaka ,  Ping Huang

IPC分类号： H04L27/02 ,  H04B1/16 ,  H04J1/00 ,  H04J1/05 ,  H04L27/18 ,  H04J9/00 ,  H04L27/06 ,  H04L27/32

CPC分类号： H04L27/18 ,  H04J1/05

摘要： A radio communication apparatus comprises a first/second modulator for modulating a first/second signal according to a first/second frequency, a first demodulator for detecting the received first modulation signal and regenerating the carrier, a clock regenerator for regenerating a clock from the detection output from the first demodulator, an amplitude sampler for sampling the amplitude of the received first modulation signal according to the regenerated clock, a second demodulator for controlling the frequency of the received second modulation signal and executing demodulation for the signal, and a gain controller for executing gain control for the output from the second demodulator according to the output from the amplitude sampler.

摘要翻译： 一种无线电通信装置，包括用于根据第一/第二频率调制第一/第二信号的第一/第二调制器，用于检测所接收的第一调制信号并再生载波的第一解调器，用于从检测中再生时钟的时钟再生器 从所述第一解调器输出的振幅采样器，用于根据所述再生时钟对所接收的第一调制信号的振幅进行采样的振幅采样器，用于控制所接收的第二调制信号的频率并执行所述信号的解调的第二解调器， 根据振幅采样器的输出对第二解调器的输出执行增益控制。

公开(公告)号：US20150056900A1

公开(公告)日：2015-02-26

申请号：US14530534

申请日：2014-10-31

申请人： Rajeev Bajaj ,  Ping Huang ,  Robert Kerprich ,  William C. Allison ,  Richard Frentzel ,  Diane Scott

发明人： Rajeev Bajaj ,  Ping Huang ,  Robert Kerprich ,  William C. Allison ,  Richard Frentzel ,  Diane Scott

IPC分类号： B24B37/26 ,  B29C39/12 ,  B24B37/24 ,  B24D18/00 ,  B24B37/20 ,  B24B37/22

CPC分类号： B24B37/26 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24D18/0009 ,  B29C39/123 ,  B29K2075/00 ,  B29L2009/00 ,  B29L2031/736

摘要： Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.

摘要翻译： 描述具有其上具有离散突起的均匀体的抛光垫。 在一个实例中，用于抛光衬底的抛光垫包括具有抛光侧和背面的均匀体。 均质体由具有第一硬度的材料构成。 多个分立的突起设置在同质体的抛光侧上并与之共同地结合。 多个离散突起由具有与第一硬度不同的第二硬度的材料构成。 还描述了制造具有其上具有离散突起的均匀体的抛光垫的方法。

公开(公告)号：US08747526B2

公开(公告)日：2014-06-10

申请号：US13370351

申请日：2012-02-10

申请人： Ping Huang ,  Ying-Pin Huang ,  Chia-Chang Lee

发明人： Ping Huang ,  Ying-Pin Huang ,  Chia-Chang Lee

IPC分类号： B03C3/016

CPC分类号： B03C3/32 ,  B03C3/368 ,  B03C3/38 ,  F24F3/166 ,  F24F6/14 ,  F24F2003/1635 ,  F24F2003/1667 ,  Y02A50/21 ,  Y02B30/545

摘要： A vertical type air humidifying and purifying machine, comprising a front casing, a rear casing, a humidifying unit, an ultraviolet light purifying unit, a motor-fan unit and a negative ion generator; in which the front casing and the rear casing are assembled correspondingly with each other, and the humidifying unit, the UV light purifying unit, and the motor-fan unit are disposed orderly between the front and the rear casings, and the negative ion generator is installed at an air outlet of the motor-fan unit; ON-OFF switches being respectively provided on the humidifying unit, the UV purifying unit and the negative ion generator for ON-OFF switching.

摘要翻译： 一种垂直式空气加湿净化机，包括前壳体，后壳体，加湿单元，紫外线净化单元，电动机风扇单元和负离子发生器; 其中前壳体和后壳体彼此组装，并且加湿单元，UV光净化单元和电动机风扇单元有序地设置在前壳体和后壳体之间，负离子发生器是 安装在电机风扇单元的出风口处; ON-OFF开关分别设置在加湿单元，UV净化单元和负离子发生器上用于ON-OFF切换。

公开(公告)号：US08645583B2

公开(公告)日：2014-02-04

申请号：US13075617

申请日：2011-03-30

申请人： Hoa Vu ,  Ping Huang

发明人： Hoa Vu ,  Ping Huang

IPC分类号： H01H37/76

CPC分类号： G01R31/2884

摘要： A method for controlling performance of an integrated circuit using a zero-pin serial interface is provided. The method comprises identifying a desired performance characteristic of the circuit, and transmitting a first change mode signal to the circuit on a first pin to cause the circuit to enter an instruction reception mode, with the first pin performing differently during a normal operation mode. The method also comprises transmitting a performance adjusting instruction to the circuit on a second pin when the circuit is in the instruction reception mode, with the second pin performing differently during the normal operation mode, and transmitting a second change mode signal to the circuit on the first pin to cause the circuit to enter the normal operation mode. An output performance of the circuit is compared to the desired performance characteristic, with the output performance being the performance of the circuit during the normal operation mode. The circuit is set to permanently provide the output performance when the output performance is within a desired tolerance of the desired performance characteristic.

摘要翻译： 提供了一种使用零引脚串行接口来控制集成电路的性能的方法。 该方法包括识别电路的期望性能特征，以及在第一引脚上向第一引脚上的电路发送第一改变模式信号以使电路进入指令接收模式，其中第一引脚在正常操作模式期间执行不同的操作。 该方法还包括当电路处于指令接收模式时，向第二引脚上的电路发送性能调整指令，第二引脚在正常操作模式期间执行不同的操作，并且向第二引脚上的电路发送第二改变模式信号 第一个引脚使电路进入正常工作模式。 将电路的输出性能与期望的性能特性进行比较，输出性能是正常操作模式期间电路的性能。 当输出性能在期望的性能特性的期望公差内时，电路被设置为永久地提供输出性能。

公开(公告)号：US08628384B2

公开(公告)日：2014-01-14

申请号：US12895465

申请日：2010-09-30

申请人： William C. Allison ,  Diane Scott ,  Ping Huang ,  Richard Frentzel ,  Alexander William Simpson

发明人： William C. Allison ,  Diane Scott ,  Ping Huang ,  Richard Frentzel ,  Alexander William Simpson

IPC分类号： B24D3/28

CPC分类号： B24D11/001 ,  B24B37/013 ,  B24B37/205 ,  B24B49/105

摘要： Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

摘要翻译： 描述了使用涡流端点检测来研磨半导体衬底的抛光垫。 还描述了使用涡流端点检测来制造用于研磨半导体衬底的抛光垫的方法。

公开(公告)号：US08486803B2

公开(公告)日：2013-07-16

申请号：US13273168

申请日：2011-10-13

申请人： Ping Huang ,  Ruisheng Wu ,  Lei Duan ,  Yi Chen ,  Yuping Gong

发明人： Ping Huang ,  Ruisheng Wu ,  Lei Duan ,  Yi Chen ,  Yuping Gong

IPC分类号： H01L21/30

CPC分类号： H01L23/3171 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/02379 ,  H01L2224/12105 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/00

摘要： A chip-scale packaging method, with bottom and side of a semiconductor chip encapsulated, includes the following steps: attaching backside of a thinned semiconductor wafer to a dicing tape; separating individual chips by cutting from front side of the wafer at scribe line but not cut through the dicing tape; flipping and attaching the wafer onto a top surface of a double-sided tape, then removing the dicing tape; attaching bottom surface of the double-sided tape on a supporting plate; filling the space between adjacent chips and covering the whole wafer backside with a molding material; flipping the whole structure and remove the supporting plate; placing solder balls at corresponding positions on electrodes of each chip and performing backflow treatment; finally separating individual chip packages by cutting through molding material at the space between adjacent chip packages with molding material encapsulating the bottom and side of each individual semiconductor chip.

摘要翻译： 封装了半导体芯片的底部和侧面的芯片级封装方法包括以下步骤：将薄化的半导体晶片的背面安装到切割带上; 通过在切割线处切割晶片的正面而不切割切割带来分离各个芯片; 翻转并将晶片连接到双面胶带的顶表面上，然后移除切割胶带; 将双面胶带的底面附着在支撑板上; 填充相邻芯片之间的空间并用模制材料覆盖整个晶片背面; 翻转整个结构并拆下支撑板; 将焊球放置在每个芯片的电极上的相应位置，并执行回流处理; 最后通过在封装每个单独的半导体芯片的底部和侧面的成型材料之间切割相邻芯片封装之间的空间处的模制材料来分离单个芯片封装。