摘要:
An optical transmitting/receiving apparatus capable of suppressing electrical crosstalk and magnetic crosstalk, includes: a laser diode/photo diode (LD/PD) integrated module that terminates a single-core bidirectional optical fiber; a circuit board electrically connected to a lead pin led out of the LD/PD integrated module; and a plastic case that accommodates the circuit board. At least a part of the plastic case abuts against the LD/PD integrated module, and impedance of the plastic case is controlled by mixing a conductive filler into the plastic case.
摘要:
The present invention provides a method for manufacturing a semiconductor device including the steps of forming a flash memory cell provided with a floating gate, an intermediate insulating film, and a control gate, forming first and second impurity diffusion regions, thermally oxidizing surfaces of a silicon substrate and the floating gate, etching a tunnel insulating film in a partial region through a window of a resist pattern; forming a metal silicide layer on the first impurity diffusion region in the partial region, forming an interlayer insulating film covering the flash memory cell, and forming, in a first hole of the interlayer insulating film, a conductive plug connected to the metal silicide layer.
摘要:
A monitoring apparatus and a monitoring system monitor a person who removed an output sheet for a print job or a copy job from an image forming apparatus that can be used by a plurality of users. With the use of a job-start notification, a job-end notification, and a sheet-removal notification received from the image forming apparatus, a video image during a period including the time at which the sheet output from the image forming apparatus was removed by a person can be recorded, and the video image can be managed in association with job information.
摘要:
A semiconductor integrated circuit is constituted to include a circuit block having a predetermined function, a power switch capable of supplying an operating power to the circuit block, and a current measuring circuit for obtaining a current flowing to the circuit block based on a voltage between terminals of the power switch in a state in which the power switch is turned on and an on-resistance of the power switch. The current flowing to the circuit block is obtained based on the voltage between terminals of the power switch in the state in which the power switch is turned on and the on-resistance of the power switch. Thus, it is possible to measure a current of the circuit block in a state in which a chip is normally operated.
摘要:
There is provided a semiconductor integrated circuit device which consumes less power and enables real-time processing. The semiconductor integrated circuit device comprises: thermal sensors which can detect temperature, determine whether the detection result exceeds each of the above reference values and output the result; and a control block capable of controlling the operations of arithmetic blocks based on the output signals of the thermal sensors, wherein the control block returns to an operation state from a suspended state with an interrupt signal based on the output signals of the thermal sensors and determines the operation conditions of the arithmetic blocks to ensure that the temperature conditions of the arithmetic blocks are satisfied. Thereby, power consumption is reduced and real-time processing efficiency is improved.
摘要:
In a light detector that is a semiconductor integrated circuit, a wiring structure is disposed on a semiconductor substrate along a periphery of a rectangular region that corresponds to a light receiver, and an interlayer insulating film composed of an SOG film is layered over the wiring structure. In this structure, the interlayer insulating film is thicker at a corner than at a center part of the light receiver. In order to increase efficiency of the incidence of light on the light receiver, the planar shape of the open part is formed so that the corners of the rectangle that surrounds the wiring structure are removed when the interlayer insulating film is etched and the open part is formed (i.e., yielding an octagonal shape). Accordingly, the effects of differences in the thickness of the interlayer film at the center part and corners of the light receiver are avoided, a bottom surface of the open part is formed in a flat manner, and uniformity in the incidence of light from the open part to the light receiver is improved.
摘要:
A step for etching a wiring-structure layer and the like on a light-receiving part of a light detector and forming an apertured part is simplified. A silicon nitride film 86 is formed on a semiconductor substrate 60 by CVD or the like, and a layered structure 88 that has the wiring-structure layer is then formed. A photoresist film 122 having an aperture above the light-receiving part is formed on the layered structure 88, and the layered structure 88 is etched using the photoresist layer as an etching mask. The type of etching and the conditions under which the etching is performed are such that the etching selectivity of the interlayer insulating film with respect to a silicon nitride film will be maintained. In the etching process, the silicon nitride film 86 functions as an etching stopper. The silicon nitride film 86 that has been exposed at a bottom part of the apertured part 116 constitutes an antireflective film.
摘要:
A Sweeney Robertson Tocher (SRT) divider and a square root extractor of floating point double-precision bit width, including a selector of single-precision and double-precision, a carry propagation adder (CPA) for conducting carry propagation of a partial remainder, a quotient digit selector circuit for making selection on a quotient digit, and a selector of a divisor or a partial square root extractor circuit, in a lower side thereof. A selector for selecting the propagation of carry between a carry save adder (CSA) in the upper side and the lower side thereof is provided, and a selector of a starting position within a quotient production circuit is provided, thereby enabling the execution of two (2) calculations, such as, division or square root extraction of the floating point single-precision, at the same time, but without increasing the bit width of a computing unit. Also, with the square root extraction, it is possible to execute two (2) calculations of single-precision in parallel, in a similar manner, by adding a partial square root extraction circuit thereinto.
摘要:
An exemplary hot rolled steel sheet can included, in terms of percent by mass, C of 0.01 to 0.2%; Si of 0.01 to 2%; Mn of 0.1 to 2%; P of ≦0.1%; S of ≦0.03%; Al of 0.001 to 0.1%; N of ≦0.01%; and as a remainder, Fe and unavoidable impurities. For example, a microstructure can be substantially a homogeneous continuous-cooled microstructure, and an average grain size of the microstructure may be more than 8 mm and 30 mm or less. An exemplary method for manufacturing a hot rolled steel sheet can include subjecting a slab having the above composition to a rough rolling so as to obtain a rough rolled bar, subjecting the rough rolled bar to a finish rolling so as to obtain a rolled steel under conditions in which a finishing temperature is (Ar3 transformation point +50° C.) or more; and starting cooling the rolled steel after 0.5 seconds or more pass from the end of the finish rolling at a temperature of the Ar3 transformation point or more. At least in the temperature range from the Ar3 transformation point can be cooled to 500° C. at a cooling rate of 80° C./sec or more, a further cooling can be effectuated until the temperature is 500° C. or less to obtain a hot rolled steel sheet and coiling the hot rolled steel sheet.
摘要翻译:作为热轧钢板,可以以质量%计含有0.01〜0.2%的C, Si为0.01〜2% Mn为0.1〜2% P <0.1%; S <0.03%; Al为0.001〜0.1%; N <0.01%; 作为余量,Fe和不可避免的杂质。 例如,微结构可以是基本上均匀的连续冷却微结构,并且微结构的平均晶粒尺寸可以大于8mm和30mm或更小。 用于制造热轧钢板的示例性方法可以包括对具有上述组成的板坯进行粗轧以获得粗轧条,对粗轧条进行精轧,以在条件下获得轧制钢 其中终轧温度为(Ar3相变点+ 50℃)以上; 在Ar3相变点以上的温度下,从精轧结束0.5秒钟以上开始冷却轧制钢。 至少在Ar 3相变点的温度范围内,可以以80℃/秒以上的冷却速度将其冷却至500℃,进一步冷却至500℃以下 得到热轧钢板并卷取热轧钢板。
摘要:
It is possible to provide a user with an operation screen having settings with which the user is familiar, such as an operation screen that has been used in the past for this external input/output device. When a external input/output device is connected to a information processing apparatus, specific information for specifying the device is acquired. Then, from a storage device that associates and stores an operation screen for processing an image that has been handled by the external device and the specific information, a corresponding operation screen is selected based upon the specific information that has been acquired. By displaying the selected operation screen on a touch-sensitive panel display, various setting operations can be performed with regard to an image that has been input from the external input/output device.