Abstract:
A method and apparatus for profiling surfaces, such as sidewalls of a trench or line, using a scanning force microscope provides improved measurement accuracy by controlling the position of the tip responsive to the real-time measured local slope of the surface.
Abstract:
A method is described for producing ultrafine silicon tips for the AFM/STM profilometry comprising:1. providing a silicon substrate and applying a silicon dioxide layer thereto;2. producing a mask in said silicon dioxide layer by photolithography and wet or dry etching;3. producing a tip shaft by transferring the mask pattern, produced in step 2, by reactive ion etching into the silicon substrate;4. thinning the shaft and forming a base by isotropic wet etching; and5. removing the mask by etching.The resulting tip shaft with a rectangular end may be pointed by argon ion milling.In a second embodiment there is an anisotropic wet etching step, prior to step 5, through the intact silicon dioxide mask, producing a negative profile of the shaft immediately below the mask. After this etching step the mask is removed by etching.
Abstract:
An offshore platform of the weighted base kind has a castellated contour at the base of the skirts, the shape of the contour being such as to produce, at the first impact with the ground, a contact line appreciably shorter than the average length of the contour.
Abstract:
A gas turbine engine shroud includes a plurality of shroud segments disposed circumferentially one adjacent to another to form a full, circumferentially segmented ring about the rotor. The radial seal between each pair of adjacent shroud segments is positioned on the back side of the shroud platform. Cooling underneath the radial seals may be done by conduction heath transfer through the platform of the shroud segments.
Abstract:
Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.
Abstract:
A mirror includes a first layer including reflective material to reflect incident light, an adhesive backing disposed at a rear of the first layer, a second layer connected to the adhesive backing and including one or more layers of a cloth or a non woven fiber matrix and polymer composite to encompass the cloth other non woven fiber matrix and a third layer disposed at a rear of the second layer and including polystyrene foam spheres encompassed within a polymer matrix.
Abstract:
The gas turbine engine shroud comprises a plurality of circumferentially-disposed and concentric shroud segments. Each shroud segment has an arc-shaped platform with opposite ends, each end comprising an inter-segment seal slot, at least one slot extending substantially across each corresponding end and having a lengthwise-variable depth.
Abstract:
Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.
Abstract:
Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.
Abstract:
The support (1) includes a working deck (2) and floatation members (3) supporting this deck (2). According to the invention, the spacing between the vertical axes (Z) passing through the centre of the floatation members (3) is such that the sum of the moments, taken in relation to the horizontal axis passing through the centre of the support (1) is perpendicular to the swell direction, of the vertical excitation forces of the swell on the floatation members (3) situated on one side of the vertical plane (P) passing through this horizontal axis is equal to the corresponding sum associated with the floatation members (3) situated on the other side of this plane, when the swell period is equal to the period of a swell having this direction and of which the yearly probability of being encountered on the site or the support where it is installed is 1/100.