公开(公告)号：US09399574B2

公开(公告)日：2016-07-26

申请号：US14632428

申请日：2015-02-26

申请人： Knowles Electronic LLC

发明人： Peter V. Loeppert ,  Denise P. Czech ,  Lawrence A. Grunert ,  Kurt B. Friel ,  Qing Wang

IPC分类号： B81C1/00 ,  B81B7/00 ,  H01L21/56 ,  H01L23/00

CPC分类号： B81C1/00888 ,  B81B7/0061 ,  B81B7/0064 ,  B81B2201/0257 ,  B81C2203/0109 ,  B81C2203/019 ,  H01L21/56 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plurality of MEMS transducer packages is manufactured by placement of a plurality of transducers onto a panel of undivided package substrates, attachment of a plurality of individual covers onto a panel and over the transducers, depositing an epoxy into the channels between the covers, and then singulating the panel into individual MEMS transducer packages.

摘要翻译： 通过将多个换能器放置在未分割的封装基板的面板上，将多个单独的盖子附接到面板上并在换能器上方，将环氧树脂沉积到盖子之间的通道中，然后再制造多个MEMS换能器封装 将面板分成单独的MEMS换能器封装。

公开(公告)号：US20150166335A1

公开(公告)日：2015-06-18

申请号：US14632428

申请日：2015-02-26

申请人： Knowles Electronic LLC

发明人： Peter V. Loeppert ,  Denise P. Czech ,  Lawrence A. Grunert ,  Kurt B. Friel ,  Qing Wang

IPC分类号： B81C1/00

CPC分类号： B81C1/00888 ,  B81B7/0061 ,  B81B7/0064 ,  B81B2201/0257 ,  B81C2203/0109 ,  B81C2203/019 ,  H01L21/56 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plurality of MEMS transducer packages is manufactured by placement of a plurality of transducers onto a panel of undivided package substrates, attachment of a plurality of individual covers onto a panel and over the transducers, depositing an epoxy into the channels between the covers, and then singulating the panel into individual MEMS transducer packages.

摘要翻译： 通过将多个换能器放置在未分割的封装基板的面板上，将多个单独的盖子附接到面板上并在换能器上方，将环氧树脂沉积到盖子之间的通道中，然后再制造多个MEMS换能器封装 将面板分成单独的MEMS换能器封装。

公开(公告)号：US20150128412A1

公开(公告)日：2015-05-14

申请号：US14118732

申请日：2012-05-18

申请人： James L. Say

发明人： James L. Say

IPC分类号： H05K3/00

CPC分类号： H05K3/00 ,  B81C1/00317 ,  B81C1/00333 ,  B81C1/00888 ,  G01N27/3272 ,  H01L21/306 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/82 ,  Y10T29/49155

摘要： Certain processes for manufacturing an electrochemical sensor module include etching a Silicon wafer to form precursor sensor bodies, disposing sensor fibers along rows of the precursor sensor bodies, securing a rigid layer over the sensor fibers, dividing the wafer, rigid layer, and sensor fibers into individual precursor sensor bodies, and joining each precursor sensor body to a component body to form sensor modules.

摘要翻译： 用于制造电化学传感器模块的某些方法包括蚀刻硅晶片以形成前体传感器主体，沿着前体传感器主体的行布置传感器光纤，将刚性层固定在传感器光纤上，将晶片，刚性层和传感器光纤分成 单独的前体传感器体，并将每个前体传感器主体连接到组件主体以形成传感器模块。

公开(公告)号：US20150054095A1

公开(公告)日：2015-02-26

申请号：US14298195

申请日：2014-06-06

申请人： Samsung Electronics Co., Ltd.

发明人： Byung-gil JEONG ,  Seog-woo HONG

IPC分类号： B81C1/00 ,  B81B7/00

CPC分类号： B81C1/00888 ,  B06B1/0292 ,  B81B2201/0271 ,  H04R19/005

摘要： A capacitive micro-machined ultrasonic transducer (CMUT) and a method of singulating the same. Singulating CMUTs may include forming first trenches in regions of a device wafer defining a plurality of ultrasonic transducer structures, the device wafer including a plurality of the ultrasonic transducer structures, forming an ultrasonic transducer wafer having a plurality of ultrasonic transducers by bonding an electrode pad wafer supplying electricity to the plurality of ultrasonic transducers and the device wafer, and dicing the ultrasonic transducer wafer to form the plurality of ultrasonic transducers by cutting the plurality of ultrasonic transducer structures on the first trench and the electrode pad wafer below the first trench.

摘要翻译： 一种电容微加工超声波换能器（CMUT）及其分离方法。 编码CMUT可以包括在限定多个超声换能器结构的器件晶片的区域中形成第一沟槽，器件晶片包括多个超声波换能器结构，通过将电极焊盘晶片结合形成具有多个超声换能器的超声换能器晶片 向所述多个超声波换能器和所述装置晶片供电;以及通过在所述第一沟槽下方的所述第一沟槽和所述电极焊盘晶片上切割所述多个超声波换能器结构来切割所述超声波换能器晶片以形成所述多个超声换能器。

公开(公告)号：US20150037921A1

公开(公告)日：2015-02-05

申请号：US14341927

申请日：2014-07-28

申请人： Murata Manufacturing Co., Ltd.

发明人： Yohei KONAKA ,  Seiji KAI

IPC分类号： B81C1/00

CPC分类号： B81C1/00888 ,  B81C1/00095 ,  B81C2203/0118

摘要： A method for manufacturing acoustic wave devices includes forming power supply lines along boundaries between chip regions on a main surface of a collective substrate on which interdigital transducer (IDT) electrodes and pad electrodes are formed; providing substantially frame-shaped first support members, each including a first opening in which one of the IDT electrodes is located and including first through-holes in a region in which the pad electrodes are formed; providing second support members outside the first support members; providing a lid member including second through-holes at positions overlapping the first through-holes on top surfaces of the first support members; and forming terminal electrodes in the first through-holes and the second through-holes by electroplating. The collective substrate, the first support members, the second support members, and the lid member form enclosed spaces in which the power supply lines are sealed.

摘要翻译： 制造声波器件的方法包括：在集合衬底的主表面上的芯片区域之间沿着形成交叉指型变换器（IDT）电极和焊盘电极的主表面的边界形成电源线; 提供基本上框架的第一支撑构件，每个支撑构件包括其中一个IDT电极位于其中并且在其中形成焊盘电极的区域中的第一通孔的第一开口; 在第一支撑构件之外提供第二支撑构件; 在所述第一支撑构件的顶表面上设置与所述第一通孔重叠的位置处的第二通孔， 以及通过电镀在第一通孔和第二通孔中形成端子电极。 集合基板，第一支撑构件，第二支撑构件和盖构件形成密封电源线的封闭空间。

公开(公告)号：US20130214370A1

公开(公告)日：2013-08-22

申请号：US13695972

申请日：2011-05-03

申请人： Javed Hussain ,  Mohammad Yunus ,  James T. Suminto

发明人： Javed Hussain ,  Mohammad Yunus ,  James T. Suminto

IPC分类号： B81B7/00

CPC分类号： B81B7/0058 ,  B81C1/00888 ,  B81C2201/053 ,  G01L9/0055 ,  H01L21/78

摘要： A Micro-Electro-Mechanical System (MEMS) pressure sensor is disclosed, comprising a gauge wafer, comprising a micromachined structure comprising a membrane region and a pedestal region, wherein a first surface of the micromachined structure is configured to be exposed to a pressure medium that exerts a pressure resulting in a deflection of the membrane region. The gauge wafer also comprises a plurality of sensing elements patterned on the electrical insulation layer on a second surface in the membrane region, wherein a thermal expansion coefficient of the material of the sensing elements substantially matches with a thermal expansion coefficient of the material of the gauge wafer. The pressure sensor comprises a cap wafer coupled to the gauge wafer, which includes a recess on an inner surface of the cap wafer facing the gauge wafer that defines a sealed reference cavity that encloses and prevents exposure of the sensing elements to an external environment.

摘要翻译： 公开了一种微机电系统（MEMS）压力传感器，其包括量规晶片，其包括微加工结构，其包括膜区域和基座区域，其中微机械加工结构的第一表面被配置为暴露于压力介质 其施加导致膜区域偏转的压力。 测量晶片还包括在膜区域中的第二表面上在电绝缘层上图案化的多个感测元件，其中感测元件的材料的热膨胀系数基本上与量规材料的热膨胀系数相匹配 晶圆。 压力传感器包括联接到量规晶片的盖子晶片，其包括位于盖晶片的内表面上的面向量规晶片的凹部，该凹槽限定封闭并防止感测元件暴露于外部环境的密封参考腔。

公开(公告)号：US20130130424A1

公开(公告)日：2013-05-23

申请号：US13695980

申请日：2011-05-03

申请人： Roger Horton ,  Javed Hussain

发明人： Roger Horton ,  Javed Hussain

IPC分类号： H01L21/78

CPC分类号： B81B7/0058 ,  B81C1/00888 ,  B81C2201/053 ,  G01L9/0055 ,  H01L21/78

摘要： A method for separating a plurality of dies on a Micro-Electro-Mechanical System (MEMS) wafer comprising scribing a notch on a first side of the wafer between at least two of the plurality of dies on a first surface and depositing a metal on the first surface of the plurality of dies. The method further comprises scribing a second side of the wafer between at least two of the plurality of dies from a second surface thereof through the notch. The first side and second side are substantially parallel and opposite each other and the first surface and the second surface are substantially parallel and opposite each other. In a process in accordance with the present invention, a method to minimize chipping of the bonding portion of a MEMs device during sawing of the wafer is provided, which minimally affects the process steps associated with separating the die on a wafer.

摘要翻译： 一种用于在微电子机械系统（MEMS）晶片上分离多个管芯的方法，包括在第一表面上的多个管芯中的至少两个之间划定晶片的第一侧上的缺口并在其上沉积金属 多个管芯的第一表面。 该方法还包括在多个管芯中的至少两个从其第二表面通过凹口划线晶片的第二侧。 第一侧面和第二侧面基本上平行且彼此相对，并且第一表面和第二表面基本上平行且彼此相对。 在根据本发明的方法中，提供了一种在晶片锯切期间最小化MEM器件的接合部分的破损的方法，其最小程度地影响与在晶片上分离晶片相关的工艺步骤。

公开(公告)号：US08227909B2

公开(公告)日：2012-07-24

申请号：US12969952

申请日：2010-12-16

申请人： Hideaki Sakaguchi ,  Mitsutoshi Higashi ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama

发明人： Hideaki Sakaguchi ,  Mitsutoshi Higashi ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama

IPC分类号： H01L23/04

CPC分类号： H01L24/94 ,  B81B2207/096 ,  B81C1/00269 ,  B81C1/00301 ,  B81C1/00888 ,  B81C2203/0118 ,  H01L21/50 ,  H01L23/10 ,  H01L24/81 ,  H01L2224/83805 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00

摘要： There is provided a method of manufacturing a semiconductor package. The method includes: (a) providing a silicon wafer comprising a first surface and a second surface opposite to the first surface; (b) forming vias through the silicon wafer in its thickness direction; (c) forming wiring patterns on the first surface of the silicon wafer such that the wiring patterns are electrically connected to the vias; (d) bonding a MEMS element wafer comprising MEMS elements onto the second surface of the silicon wafer such that the MEMS elements are electrically connected to the vias; (e) dividing the MEMS element wafer into the respective MEMS elements; (f) bonding a lid having concave portions therein onto the second surface of the silicon wafer such that the respective MEMS elements face a corresponding one of the concave portions; and (g) dicing the lid and the silicon wafer.

摘要翻译： 提供了制造半导体封装的方法。 该方法包括：（a）提供包括与第一表面相对的第一表面和第二表面的硅晶片; （b）在硅晶片的厚度方向上形成通孔; （c）在所述硅晶片的所述第一表面上形成布线图案，使得所述布线图形电连接到所述通孔; （d）将包含MEMS元件的MEMS元件晶片接合到所述硅晶片的所述第二表面上，使得所述MEMS元件电连接到所述通孔; （e）将MEMS元件晶片分成相应的MEMS元件; （f）将其中具有凹部的盖结合到硅晶片的第二表面上，使得各MEMS元件面对相应的一个凹部; 和（g）切割盖子和硅晶片。

公开(公告)号：US20080026491A1

公开(公告)日：2008-01-31

申请号：US11550426

申请日：2006-10-18

申请人： Shun-Ta Wang

发明人： Shun-Ta Wang

IPC分类号： H01L21/66

CPC分类号： H01L22/14 ,  B81C1/00888 ,  B81C99/004 ,  H01L21/78

摘要： A method of wafer segmenting is provided. Initially, a wafer having a plurality of devices on a top surface thereof is provided. A passivation layer is formed on the top surface of the wafer to cover the devices. A bottom surface of the first bonding layer is attached to a lower surface of the wafer. In addition, a carrier wafer is provided. A second bonding layer is attached to the first bonding layer to bond the wafer to the support wafer. A segment process is performed to form a plurality of dies. Each die is maintained at the same distance between each other as the distance between the dies before the segment process. The passivation layer is removed and the devices are exposed. A wafer-level testing is performed upon the devices. The second bonding layer and the carrier wafer are removed thereafter.

摘要翻译： 提供了一种晶片分割方法。 首先，提供在其顶面具有多个器件的晶片。 在晶片的顶表面上形成钝化层以覆盖器件。 第一接合层的底表面附接到晶片的下表面。 另外，提供载体晶片。 第二接合层附着到第一接合层，以将晶片接合到支撑晶片。 执行段处理以形成多个管芯。 每个模具之间的距离保持在彼此相同的距离处，因为在段过程之前的模具之间的距离。 钝化层被去除并且这些装置被暴露。 对器件执行晶圆级测试。 此后除去第二结合层和载体晶片。

公开(公告)号：US20070184633A1

公开(公告)日：2007-08-09

申请号：US11459933

申请日：2006-07-25

申请人： Chen-Hsiung Yang

发明人： Chen-Hsiung Yang

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  B81C1/00888 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336

摘要： A wafer is provided and a front scribe line pattern is defined on a front surface of the wafer. A back scribe line pattern corresponding to the front scribe line pattern is defined on a back surface of the wafer. Then the wafer is attached to an extendable film and a wafer breaking process is performed to form a plurality of dies by virtue by extending the extendable film.

摘要翻译： 提供晶片，并且在晶片的前表面上限定前划线图案。 对应于前划线图案的背面划线图案被限定在晶片的后表面上。 然后将晶片连接到可延伸的薄膜上，通过延伸可延展薄膜，进行晶片断裂处理以形成多个模具。