摘要:
A resistor circuit includes n-stage unit circuits, each of which includes a first resistor element provided between first and second terminals, a first disconnection element provided between the second and third terminals, and a second disconnection element and a second resistor element provided in series between the second and fourth terminals. The first terminal of each of the n-stage unit circuits is connected with a first interconnect, the fourth terminal of each of the n-stage unit circuits is connected with a second interconnect, the third terminal of the first-stage unit circuit is connected with a third interconnect, and the third terminal of the mth-stage unit circuit is connected with the second terminal of the (m−1)th-stage unit circuit.
摘要:
The arrays of independently-addressable resistors are commonly used to control miniature elements. The invention proposes solving the problem caused by the loss of power dissipated in the addressed resistor by choosing, for this resistor, a material with a negative thermal coefficient resistance, which enables the addressing output of this resistor to be increased.
摘要:
According to a first preferred embodiment, a resistor arrangement with resistor elements is specified whose first electrodes are conductively connected to each other by means of a flexible, conductive connection element that is curved. The connection element has changes in curvature in the regions arranged between two adjacent resistor elements. According to a second preferred embodiment, a resistor arrangement with resistor elements is specified that are connected to each other by a flexible connection element. The resistor elements each have an arrangement of slot-like recesses.
摘要:
A binary bidirectional trimming circuit is disclosed. The trimming circuit includes: a first resistor set having 4 resistors in parallel connected and a first fuse bridged two ends thereto provide one trimming step; a second resistor set having 2 resistors in series connected and a second fuse bridged two ends thereto provide eight trimming steps; a third resistor set having 2 resistors in parallel connected and a third fuse bridged two ends thereto provide two trimming steps; a fourth resistor set having 1 resistor and a fourth fuse bridged two ends thereto provide four trimming steps; a first loading resistor; and a second loading resistor. The first resistor set, second resistor set, first loading resistor, third resistor set, the fourth resistor set, and the second loading resistor are in series connected. The output terminal is located at the nodes of the third resistor set and the first loading resistor so that the trimming steps provided by the third resistor set and the fourth resistor set are opposite to that of the first resistor set and the second resistor set.
摘要:
The arrays of independently-addressable resistors are commonly used to control miniature elements. The invention proposes solving the problem caused by the loss of power dissipated in the addressed resistor by choosing, for this resistor, a material with a negative thermal coefficient resistance, which enables the addressing output of this resistor to be increased. A production method is also described.
摘要:
A combination run capacitor/positive temperature coefficient resistor/overload (CAP/PTCR/OL) module is described. The cover of the combination housing includes a capacitor compartment and terminal openings for receiving blade terminals of a run capacitor. The terminal openings in the cover align with blade receiving receptacles coupled to the PTCR start circuit. The blade terminals of a run capacitor are inserted into the receptacle openings and into electrical engagement with the blade receiving receptacles. The capacitor is supported and protected by a potting mixture filling the capacitor compartment.
摘要:
A ball grid array resistor network that has a ground plane to reduce noise and improve signal integrity. The ball grid array resistor network includes a substrate having a first and a second surface and vias that extending through the substrate between the first and second surfaces. Resistors are located on the first surface between the vias. Conductors are located over the vias and are electrically connected to ends of the resistors. A cover coat covers the conductors and resistors. A ground plane is located on the second surface. An insulating layer is located over the ground plane. Ball pads are located over the vias. The ball pads are electrically connected to the vias. Solder spheres are attached to the ball pads.
摘要:
A ball grid array resistor network that has a ground plane to reduce noise and improve signal integrity. The ball grid array resistor network includes a substrate having a first and a second surface and vias that extending through the substrate between the first and second surfaces. Resistors are located on the first surface between the vias. Conductors are located over the vias and are electrically connected to ends of the resistors. A cover coat covers the conductors and resistors. A ground plane is located on the second surface. An insulating layer is located over the ground plane. Ball pads are located over the vias. The ball pads are electrically connected to the vias. Solder spheres are attached to the ball pads.
摘要:
On the surface of a ceramic sinter, at least an external electrode for input, an external electrode for output, and external electrodes for grounding are disposed, and the ceramic sinter includes an inductor electrically connected to the external electrode for input and external electrode for output, and a varistor electrically connected to the external electrode for input and external electrodes for grounding. By connecting the inductor to the signal line of the circuit of an electronic appliance and connecting the varistor between the input side of the signal line and the ground, electrostatic discharge pulses of about 0.5 to 2 nanoseconds can be suppressed efficiently.
摘要:
A method and apparatus provides resistor network packages with some of the resistor sub-package positions remain open, which may accommodate different circuit configurations with a common circuit assembly. Also, the present invention provides a packaging method using resistor network packages as connecting and disconnecting mechanisms for the signal lines on the package.