公开(公告)号：US20030134044A1

公开(公告)日：2003-07-17

申请号：US10308964

申请日：2002-12-03

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Taiichiro Aoki ,  Seiji Ohishi ,  Hiroshi Yamabe ,  Hitoshi Obata

IPC分类号： B05C005/00

CPC分类号： H01L21/67346 ,  B05C5/0279 ,  H01L21/67046 ,  H01L21/67051

摘要： The object of the present invention is to provide an apparatus suitable for forming a thick film having a thickness on a surface of a substrate such as a glass substrate, a semiconductor wafer or the like. In the apparatus according to the present invention, a stock station for a substrate and a treatment station for a substrate are adjacent to each other, portions for coating, film-forming, cleaning and drying are provided in the treatment station, a tray having a concave portion for accommodating a substrate defined on the surface thereof is provided, and a transfer device circulates the tray around the portions for coating, film-forming, cleaning and drying.

摘要翻译： 本发明的目的是提供一种适合于在诸如玻璃基板，半导体晶片等的基板的表面上形成厚度的厚膜的装置。 在根据本发明的装置中，用于基板的储存站和基板的处理站彼此相邻，在处理站中设置用于涂覆，成膜，清洁和干燥的部分，具有 设置用于容纳形成在其表面上的基板的凹部，并且转印装置使托盘围绕用于涂布，成膜，清洁和干燥的部分循环。

公开(公告)号：US06582221B1

公开(公告)日：2003-06-24

申请号：US10200573

申请日：2002-07-19

申请人： Theodurus Gerardus Maria Oosterlaken

发明人： Theodurus Gerardus Maria Oosterlaken

IPC分类号： F27D500

CPC分类号： H01L21/67309 ,  C30B25/12 ,  C30B31/14 ,  H01L21/67109 ,  H01L21/67346

摘要： A substrate holder for vertical furnaces is configured to support substrates in slots at inner portions of the substrates, rather than solely at the edges. The holder allows sufficient clearance above substantially the entire front face of the substrate that a substrate deflection or bow, induced by thermal stresses during loading and unloading of the substrate holder into and out of the furnace, can be accommodated without the substrate touching the support members of the substrate holder. A relationship is established such that, for given loading/unloading temperatures, a minimum amount of free space in the wafer slots is provided to avoid substrate scratching. Conversely, for a given amount of free space in the wafer slots, the relationship provides maximum loading and/or unloading temperatures to avoid scratching.

摘要翻译： 用于垂直炉的衬底保持器被配置为在衬底的内部部分的槽中支撑衬底，而不是仅在边缘处支撑衬底。 保持器允许在基板的整个前表面上方具有足够的间隙，使得可以容纳在衬底夹持器进入和离开炉子期间由热应力引起的衬底偏转或弓形，而基板接触支撑构件 的衬底保持器。 建立关系，使得对于给定的加载/卸载温度，提供晶片槽中的最小量的自由空间以避免基板刮擦。 相反，对于给定量的晶片槽中的自由空间，该关系提供了最大的加载和/或卸载温度以避免划伤。

公开(公告)号：US20020192059A1

公开(公告)日：2002-12-19

申请号：US09881093

申请日：2001-06-15

发明人： James E. Foster JR. ,  Damon Ashman ,  Stanley Janisiewicz ,  John Burgin JR. ,  Ronald Tokarz

IPC分类号： B65B069/00

CPC分类号： H01L21/67132 ,  H01L21/67144 ,  H01L21/67346 ,  H01L21/68728 ,  Y10T29/53178

摘要： A mechanism for handling semiconductor wafers includes a feed section which comprises a vertically movable elevator able to hold a number of vertically spaced carriers. Each carrier has a film frame mounted thereon for supporting a wafer. A pulling mechanism pulls a selected carrier out of the elevator along a first axis and into a pick and place section. A transfer mechanism removes individual dies from the wafer and moves them to a flip station along a second axis oriented perpendicularly to the first axis. The transfer mechanism can move different distances along the second axis to be able to remove dies arranged in a row along the second axis. The flip station is driven by a single motor to both lower and invert the dies.

摘要翻译： 一种用于处理半导体晶片的机构包括一个馈送部分，它包括一个能够保持多个垂直间隔的载体的垂直移动的电梯。 每个载体具有安装在其上的胶片框架，用于支撑晶片。 拉动机构沿着第一轴将选定的行星架拉出电梯并进入拾取和放置部分。 传送机构从晶片移除各个管芯，并沿着垂直于第一轴线定向的第二轴线将它们移动到翻转站。 传送机构可以沿着第二轴线移动不同的距离，以便能够沿着第二轴线移除排列成一排的管芯。 翻转站由单个电机驱动，以降低和反转模具。

公开(公告)号：US06318957B1

公开(公告)日：2001-11-20

申请号：US09256743

申请日：1999-02-24

申请人： Paul R. Carr ,  Paul T. Jacobson ,  James F. Kusbel ,  James S. Roundy ,  Ravinder K. Aggarwal ,  Ivo Raaijmakers ,  Rod Lenz ,  Nilesh Rajbharti

发明人： Paul R. Carr ,  Paul T. Jacobson ,  James F. Kusbel ,  James S. Roundy ,  Ravinder K. Aggarwal ,  Ivo Raaijmakers ,  Rod Lenz ,  Nilesh Rajbharti

IPC分类号： B65G4907

CPC分类号： H01L21/68735 ,  H01L21/67346 ,  H01L21/67778 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68764 ,  H01L21/68771 ,  Y10S414/137 ,  Y10S414/141

摘要： The invention is a carrier comprising three support elements connected by an underlying frame. The periphery of a wafer rests upon the support elements. The invention also comprises a wafer handler with a plurality of arms. Spacers space the carrier above a base plate associated with a station in a wafer handling area. An arm slides beneath the frame and between the spacers, but the handler does not contact the wafer. A method of using the handler and carrier is provided where the handler lifts and rotates the carrier with the wafer through various stations in a wafer handling area. A control device reduces the handler speed only at critical points of the processing cycle. The handler is capable of moving a plurality of carriers and wafers simultaneously.

摘要翻译： 本发明是一种载体，其包括由下面的框架连接的三个支撑元件。 晶片的周边位于支撑元件上。 本发明还包括具有多个臂的晶片处理器。 隔板将载体放置在与晶片处理区域中的站相关联的基板上方。 手臂在框架下方和间隔件之间滑动，但是处理器不接触晶片。 提供了一种使用处理器和载体的方法，其中处理器通过晶片处理区域中的各个工位来提升和旋转载体与晶片。 控制装置仅在处理周期的关键点降低处理器速度。 处理器能够同时移动多个载体和晶片。

公开(公告)号：US6162006A

公开(公告)日：2000-12-19

申请号：US83833

申请日：1998-05-22

申请人： Ronald R. Stevens ,  Ravinder Aggarwal

发明人： Ronald R. Stevens ,  Ravinder Aggarwal

IPC分类号： B65B31/00 ,  H01L21/673 ,  B65G49/07

CPC分类号： H01L21/67346 ,  H01L21/67253 ,  H01L21/67353 ,  H01L21/67379 ,  Y10S414/137 ,  Y10S414/14

摘要： A stackable cassette for testing at least one separate wafer during the processing of a plurality of semiconductor wafers is disclosed. The stackable cassette includes a bottom surface which conforms to a top portion of a base cassette having a plurality of wafers. In addition, the stackable cassette includes two or more supports which extend vertically from the bottom surface and a top surface horizontally connected to the two supports. The supports include ribs which form channels for holding at least one wafer. When processing the plurality of wafers, the stackable cassette is placed on top of a base cassette. A specified processed wafer is placed within the stackable cassette. The stackable cassette is then removed for inspection of the test wafer.

摘要翻译： 公开了一种用于在多个半导体晶片的处理期间测试至少一个单独晶片的可堆叠盒。 可堆叠盒包括与具有多个晶片的基座的顶部一致的底表面。 此外，可堆叠盒包括从底表面垂直延伸的两个或更多个支撑件和与两个支撑件水平连接的顶表面。 支撑件包括形成用于保持至少一个晶片的通道的肋。 当处理多个晶片时，可堆叠盒被放置在基座的顶部上。 将指定的经处理的晶片放置在可堆叠盒内。 然后拆下可堆叠盒以检查测试晶片。

公开(公告)号：US6158951A

公开(公告)日：2000-12-12

申请号：US113441

申请日：1998-07-10

申请人： Paul R. Carr ,  Paul T. Jacobson ,  James F. Kusbel ,  James S. Roundy ,  Ravinder K. Aggarwal ,  Ivo Raaijmakers

发明人： Paul R. Carr ,  Paul T. Jacobson ,  James F. Kusbel ,  James S. Roundy ,  Ravinder K. Aggarwal ,  Ivo Raaijmakers

IPC分类号： H01L21/673 ,  H01L21/677 ,  H01L21/687 ,  B65G1/06

CPC分类号： H01L21/68721 ,  H01L21/67346 ,  H01L21/67778 ,  H01L21/68728 ,  H01L21/68764 ,  H01L21/68771 ,  Y10S414/137 ,  Y10S414/141

摘要： The invention is a carrier comprising three support elements connected by an underlying frame. The periphery of a wafer rests upon the support elements. The invention also comprises a wafer handler with a plurality of arms. Spacers space the carrier above a base plate associated with a station in a wafer handling area. An arm slides beneath the frame and between the spacers, but the handler does not contact the wafer. A method of using the handler and carrier is provided where the handler lifts and rotates the carrier with the wafer through various stations in a wafer handling area. The handler is capable of moving a plurality of carriers and wafers simultaneously.

摘要翻译： 本发明是一种载体，其包括由下面的框架连接的三个支撑元件。 晶片的周边位于支撑元件上。 本发明还包括具有多个臂的晶片处理器。 隔板将载体放置在与晶片处理区域中的站相关联的基板上方。 手臂在框架下方和间隔件之间滑动，但是处理器不接触晶片。 提供了一种使用处理器和载体的方法，其中处理器通过晶片处理区域中的各个工位来提升和旋转载体与晶片。 处理器能够同时移动多个载体和晶片。

公开(公告)号：US6140253A

公开(公告)日：2000-10-31

申请号：US146691

申请日：1998-09-03

申请人： Bruce L. Hayes ,  Greg Montanino

发明人： Bruce L. Hayes ,  Greg Montanino

IPC分类号： H01L21/00 ,  H01L21/673 ,  H01L21/31

CPC分类号： H01L21/67313 ,  H01L21/67075 ,  H01L21/67086 ,  H01L21/6715 ,  H01L21/67346

摘要： Methods are disclosed for processing a semiconductor wafer. The methods may include removing first and second amounts of liquid from the lower surface of the wafer. The subject invention may also comprise methods for removing a liquid from a semiconductor wafer surface that include contacting the semiconductor wafer surface with an annular barrier formed in a ring member and draining the liquid contacting the annular barrier from the ring member. Other methods are disclosed for applying a solvent to a surface coating to remove excess therefrom and draining the solvent and liquid from a wafer support member.

摘要翻译： 公开了用于处理半导体晶片的方法。 该方法可以包括从晶片的下表面去除第一和第二量的液体。 本发明还可以包括从半导体晶片表面去除液体的方法，包括使半导体晶片表面与形成在环形构件中的环形阻挡层接触并将与环形构件接触的液体排出。 公开了用于将溶剂施加到表面涂层以除去其中的其它方法以及从晶片支撑构件排出溶剂和液体的其它方法。

公开(公告)号：US6062795A

公开(公告)日：2000-05-16

申请号：US940427

申请日：1997-09-30

申请人： Shigeru Fuke ,  Tsuneharu Arai ,  Eiji Kikuchi

发明人： Shigeru Fuke ,  Tsuneharu Arai ,  Eiji Kikuchi

IPC分类号： H01L21/683 ,  B65G49/07 ,  H01L21/677

CPC分类号： H01L21/67346 ,  H01L21/67778 ,  Y10S414/136

摘要： A device for preventing wafer rings from being caught on a pair of guide rails of a wafer ring conveying apparatus, including an open-and-close mechanism which moves the pair of guide rails in a closing direction when a wafer ring is supplied onto the guide rails from the wafer ring cassette so as to correct the rotational orientation and/or offset of the wafer ring.

摘要翻译： 一种用于防止晶片环被卡在晶片环输送装置的一对导轨上的装置，包括一开闭机构，当将晶片环供应到导向件上时，关闭方向使一对导轨移动 轨道从晶片环盒中校正晶圆环的旋转取向和/或偏移。

公开(公告)号：US6026589A

公开(公告)日：2000-02-22

申请号：US18021

申请日：1998-02-02

申请人： Jack Chihchieh Yao ,  Robert Jeffrey Bailey

发明人： Jack Chihchieh Yao ,  Robert Jeffrey Bailey

IPC分类号： B65G1/00 ,  B65G49/07 ,  C23C16/00 ,  C23C16/458 ,  C23C16/54 ,  H01L21/205 ,  H01L21/673 ,  H01L21/677 ,  F26B21/06

CPC分类号： H01L21/68735 ,  C23C16/4583 ,  C23C16/54 ,  H01L21/67346

摘要： A wafer carrier is provided comprised of a circular plate having a flat edge region extending around the circumference of the plate. The plate has a circular recessed center region with a recessed bottom surface and includes an upwardly inclined surface around the periphery of the recessed bottom surface. A substrate is placed in the center region where it is supported by a portion of the upwardly inclined surface and is spaced apart form the recessed bottom surface such that the substrate is supported only around its edge. The wafer carrier minimizes surface contact with the substrate thereby minimizing metal contamination and surface damage to the backside of a substrate and prevents deposition on the backside of the substrate.

摘要翻译： 提供的晶片载体包括圆形板，该圆形板具有围绕板的圆周延伸的平坦边缘区域。 该板具有凹入的底面的圆形凹入中心区域，并且包括围绕凹入的底面周边的向上倾斜的表面。 基板被放置在中心区域中，在该区域中，该中心区域被向上倾斜的表面的一部分支撑，并且从凹入的底部表面间隔开，使得基板仅在其边缘附近被支撑。 晶片载体最小化与基板的表面接触，从而最小化金属污染和对基板背面的表面损伤，并防止沉积在基板的背面。

公开(公告)号：US5164905A

公开(公告)日：1992-11-17

申请号：US806121

申请日：1991-12-12

申请人： Takemasa Iwasaki ,  Sadao Shimoyashiro ,  Haruo Ohya ,  Hiroshi Kikuchi ,  Tsutomu Takahashi ,  Masahiro Watanabe

发明人： Takemasa Iwasaki ,  Sadao Shimoyashiro ,  Haruo Ohya ,  Hiroshi Kikuchi ,  Tsutomu Takahashi ,  Masahiro Watanabe

IPC分类号： H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67727 ,  G06Q10/087 ,  H01L21/67346 ,  H01L21/67353 ,  H01L21/67383 ,  H01L21/67386 ,  H01L21/67778 ,  H01L21/6838 ,  H01L21/68707 ,  Y10S414/135

摘要： The present invention provides a carrier jig for use in processing, transporting and stocking a wafer-like material used in manufacture processes of semiconductor products, and a semiconductor production system using the carrier jig. The carrier jig of the present invention comprises a holder for holding and storing therein one wafer, for example, and a container box for loading therein the holder. A mechanism for transferring wafers by the use of the carrier jig is provided in each process, with the result the period of production time can be shortened and the production speed can be enhanced.

摘要翻译： 本发明提供一种用于加工，运输和放养半导体产品的制造工艺中使用的晶片状材料的载体夹具，以及使用载体夹具的半导体生产系统。 本发明的载体夹具包括用于容纳和存储其中的一个晶片的保持器和用于在其中装载保持器的容器盒。 在每个处理中提供了通过使用载体夹具转移晶片的机构，结果可以缩短生产时间的周期并且可以提高生产速度。