公开(公告)号：US6042324A

公开(公告)日：2000-03-28

申请号：US277662

申请日：1999-03-26

申请人： Ravinder Aggarwal ,  Ronald R. Stevens

发明人： Ravinder Aggarwal ,  Ronald R. Stevens

IPC分类号： B65G49/07 ,  H01L21/673 ,  H01L21/677 ,  B65G47/06 ,  H01L21/68

CPC分类号： H01L21/67772 ,  Y10S414/137 ,  Y10S414/139

摘要： Two FOUPs are stacked and moved together towards an equipment wall by a horizontal actuator. FOUP doors are withdrawn as a unit by a horizontal actuator, and lowered as a unit by a vertical actuator to provide access to the interior of the FOUPs.

摘要翻译： 两个FOUP被堆叠并通过水平致动器一起移动到设备壁上。 FOUP门通过水平致动器作为一个单元撤回，并通过垂直致动器作为一个单元下降以提供对FOUP的内部的通路。

公开(公告)号：US06242718B1

公开(公告)日：2001-06-05

申请号：US09434030

申请日：1999-11-04

申请人： Armand Ferro ,  Ivo Raaijmakers ,  Ravinder Aggarwal ,  Ronald R. Stevens

发明人： Armand Ferro ,  Ivo Raaijmakers ,  Ravinder Aggarwal ,  Ronald R. Stevens

IPC分类号： A21B100

CPC分类号： H01L21/6835 ,  H01L21/6838 ,  H01L2221/68359 ,  Y10S414/135

摘要： A Bernoulli wand type semiconductor wafer pickup device that is adapted to regulate the temperature of a wafer while the wafer is being repositioned within a semiconductor processing system. In one embodiment, the device is comprised of a resistive heating element that is adapted to raise the temperature of the pickup device. In particular, by raising the temperature of the pickup device, a portion of the thermal radiation emitted from the device is absorbed by the wafer, thus providing a means for regulating the wafer temperature. In another embodiment, the device is adapted with the characteristics of a black body absorber so as to enable the device to optimally absorb thermal radiation from external radiant sources, thereby providing a means for increasing the temperature of the device. In another embodiment, the device is coated with reflective material that enables a large portion of thermal radiation emitted from the wafer to be reflected and absorbed back into the wafer. In another embodiment, the preexisting gas system of the pickup device is adapted with a gas beating device that is adapted to raise the temperature of the gas so as to regulate the temperature of the wafer.

摘要翻译： 一种伯努利棒状半导体晶片拾取装置，其适于在晶片在半导体处理系统内重新定位时调节晶片的温度。 在一个实施例中，该装置包括适于提升拾取装置的温度的电阻加热元件。 特别地，通过提高拾取装置的温度，从装置发射的热辐射的一部分被晶片吸收，从而提供调节晶片温度的装置。 在另一个实施例中，该装置适于具有黑体吸收体的特征，以便能够使装置最佳地吸收来自外部辐射源的热辐射，由此提供用于增加装置温度的装置。 在另一个实施例中，该装置涂覆有反射材料，其使得能够将从晶片发射的大部分热辐射反射并吸收回到晶片中。 在另一个实施例中，拾取装置的预先存在的气体系统适用于气体打浆装置，该气体打浆装置适于升高气体的温度以调节晶片的温度。

公开(公告)号：US6162006A

公开(公告)日：2000-12-19

申请号：US83833

申请日：1998-05-22

申请人： Ronald R. Stevens ,  Ravinder Aggarwal

发明人： Ronald R. Stevens ,  Ravinder Aggarwal

IPC分类号： B65B31/00 ,  H01L21/673 ,  B65G49/07

CPC分类号： H01L21/67346 ,  H01L21/67253 ,  H01L21/67353 ,  H01L21/67379 ,  Y10S414/137 ,  Y10S414/14

摘要： A stackable cassette for testing at least one separate wafer during the processing of a plurality of semiconductor wafers is disclosed. The stackable cassette includes a bottom surface which conforms to a top portion of a base cassette having a plurality of wafers. In addition, the stackable cassette includes two or more supports which extend vertically from the bottom surface and a top surface horizontally connected to the two supports. The supports include ribs which form channels for holding at least one wafer. When processing the plurality of wafers, the stackable cassette is placed on top of a base cassette. A specified processed wafer is placed within the stackable cassette. The stackable cassette is then removed for inspection of the test wafer.

摘要翻译： 公开了一种用于在多个半导体晶片的处理期间测试至少一个单独晶片的可堆叠盒。 可堆叠盒包括与具有多个晶片的基座的顶部一致的底表面。 此外，可堆叠盒包括从底表面垂直延伸的两个或更多个支撑件和与两个支撑件水平连接的顶表面。 支撑件包括形成用于保持至少一个晶片的通道的肋。 当处理多个晶片时，可堆叠盒被放置在基座的顶部上。 将指定的经处理的晶片放置在可堆叠盒内。 然后拆下可堆叠盒以检查测试晶片。

公开(公告)号：US08262287B2

公开(公告)日：2012-09-11

申请号：US12330096

申请日：2008-12-08

申请人： Buz Darabnia ,  Andy Yednak ,  Mike Halpin ,  Loren Jacobs ,  Ravinder Aggarwal

发明人： Buz Darabnia ,  Andy Yednak ,  Mike Halpin ,  Loren Jacobs ,  Ravinder Aggarwal

IPC分类号： G05D23/00 ,  G01K7/02

CPC分类号： G01K7/04 ,  C23C16/46 ,  G01K13/00

摘要： A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.

摘要翻译： 描述了用于半导体加工反应的热电偶。 热电偶包括具有测量尖端和在相对端的开口的护套。 接收第一线和第二线的一部分的支撑构件被容纳在护套内。 第一和第二线形成在测量尖端处接触鞘的内表面的接合点。 间隔构件固定在护套的开口处并接收支撑构件。 间隔构件允许支撑构件，第一线和第二线自由地相对于彼此热膨胀而不在其中引入压缩或拉伸应力。

公开(公告)号：US20120031340A1

公开(公告)日：2012-02-09

申请号：US13276515

申请日：2011-10-19

申请人： Ravinder Aggarwal ,  Jeroen Stoutjesdijk

发明人： Ravinder Aggarwal ,  Jeroen Stoutjesdijk

IPC分类号： C23C16/455 ,  C23C16/458 ,  C23C16/52 ,  B01J19/00

CPC分类号： C23C16/4412 ,  C23C16/455 ,  C23C16/45502 ,  C23C16/45504 ,  C23C16/45563 ,  C23C16/458 ,  C23C16/4582 ,  C23C16/4583 ,  C23C16/4584

摘要： A reaction apparatus for a semiconductor fabrication apparatus, wherein the reaction apparatus includes at least two adjustable outlet ports for withdrawing reactant gases from the reaction chamber. Adjustment of the flow rate through each of the outlet ports selectively modifies the flow pattern of the reactant gases within the reaction chamber to maintain a desired flow pattern therewithin, such as a substantially uniform flow over the surface of a substrate being processed, and/or minimization of turbulence within the reactor.

摘要翻译： 一种用于半导体制造装置的反应装置，其中反应装置包括至少两个可调节的出口，用于从反应室中抽出反应气体。 通过每个出口端口的流量的调节选择性地修改反应室内的反应气体的流动模式，以在其中维持所需的流动模式，例如在正被处理的基底的表面上的基本均匀的流动，和/或 反应器内湍流的最小化。

公开(公告)号：US08088225B2

公开(公告)日：2012-01-03

申请号：US12641712

申请日：2009-12-18

申请人： Matt G. Goodman ,  Jereon Stoutyesdijk ,  Ravinder Aggarwal ,  Mike Halpin ,  Tony Keeton ,  Mark Hawkins ,  Lee Haen ,  Armand Ferro ,  Paul Brabant ,  Robert Vyne ,  Gregory M. Bartlett ,  Joseph P. Italiano ,  Bob Haro

发明人： Matt G. Goodman ,  Jereon Stoutyesdijk ,  Ravinder Aggarwal ,  Mike Halpin ,  Tony Keeton ,  Mark Hawkins ,  Lee Haen ,  Armand Ferro ,  Paul Brabant ,  Robert Vyne ,  Gregory M. Bartlett ,  Joseph P. Italiano ,  Bob Haro

IPC分类号： C23C16/458 ,  C23C16/00 ,  H01L21/306

CPC分类号： H01L21/68735 ,  H01J37/32871 ,  H01L21/67028

摘要： A substrate support system comprises a substrate holder having a plurality of passages extending between top and bottom surfaces thereof. The substrate holder supports a peripheral portion of the substrate backside so that a thin gap is formed between the substrate and the substrate holder. A hollow support member provides support to an underside of, and is configured to convey gas upward into one or more of the passages of, the substrate holder. The upwardly conveyed gas flows into the gap between the substrate and the substrate holder. Depending upon the embodiment, the gas then flows either outward and upward around the substrate edge (to inhibit backside deposition of reactant gases above the substrate) or downward through passages of the substrate holder, if any, that do not lead back into the hollow support member (to inhibit autodoping by sweeping out-diffused dopant atoms away from the substrate backside).

摘要翻译： 衬底支撑系统包括具有在其顶表面和底表面之间延伸的多个通道的衬底保持器。 衬底保持器支撑衬底背面的周边部分，使得在衬底和衬底保持器之间形成薄的间隙。 中空的支撑构件为衬底的下侧提供支撑，并且构造成将气体向上输送到衬底保持器的一个或多个通道中。 向上输送的气体流入基板和基板支架之间的间隙。 根据实施例，气体然后围绕衬底边缘向外和向上流动（以阻止反应物气体在衬底上方的背面沉积）或向下穿过衬底保持器的通道（如果有的话），其不会引回到中空支撑件 （通过从扩散的掺杂​​剂原子远离衬底背面来抑制自掺杂）。

公开(公告)号：US20070209593A1

公开(公告)日：2007-09-13

申请号：US11369773

申请日：2006-03-07

申请人： Ravinder Aggarwal ,  Jim Kusbel

发明人： Ravinder Aggarwal ,  Jim Kusbel

IPC分类号： H01L21/677 ,  C23C16/00

CPC分类号： C23C16/54 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/68707

摘要： This invention relates to an apparatus and a method for cooling a semiconductor wafer while it is being transferred from one station to another. More particularly, the invention relates to an active cooling system in the end effecter of a robot used for moving a semiconductor wafer from one process station to another.

摘要翻译： 本发明涉及一种半导体晶片在从一个工位转移到另一个工位时进行冷却的装置和方法。 更具体地，本发明涉及用于将半导体晶片从一个处理站移动到另一个处理站的机器人的末端执行器中的主动冷却系统。

公开(公告)号：US20060154385A1

公开(公告)日：2006-07-13

申请号：US11031479

申请日：2005-01-07

申请人： Ravinder Aggarwal

发明人： Ravinder Aggarwal

IPC分类号： H01L21/66

CPC分类号： H01L21/67253 ,  H01L21/67167 ,  H01L21/67724 ,  H01L21/67775 ,  H01L22/20

摘要： An in-line, non-freestanding substrate measurement system is integrated into the substrate fabrication pathway. One embodiment includes a metrology device integrated into a guided vehicle. Another embodiment provides a system for simultaneously measuring both sides of a substrate. A metrology device may be integrated into the front handling chamber of a process tool. Other embodiments provide methods for the measurement of substrates using pathway integrated metrology devices.

摘要翻译： 在衬底制造途径中集成了一种在线非独立式衬底测量系统。 一个实施例包括集成到引导车辆中的计量装置。 另一实施例提供一种用于同时测量衬底的两侧的系统。 计量装置可以集成到处理工具的前处理室中。 其他实施例提供了使用路径集成测量装置来测量衬底的方法。

公开(公告)号：US20060045663A1

公开(公告)日：2006-03-02

申请号：US10912299

申请日：2004-08-05

申请人： Ravinder Aggarwal ,  James Kusbel

发明人： Ravinder Aggarwal ,  James Kusbel

IPC分类号： H01L21/677

CPC分类号： H01L21/67772 ,  H01L21/67775

摘要： A load port comprises a platform for receiving a FOUP. The platform includes features for manually removing a FOUP door. The platform also includes features for placing the FOUP in operative relation to a wafer transfer robot configured to transfer wafers between first and second containers.

摘要翻译： 负载端口包括用于接收FOUP的平台。 该平台包括手动取出FOUP门的功能。 平台还包括用于将FOUP放置在操作关系中的功能，该晶片传送机器人被配置为在第一和第二容器之间传送晶片。

公开(公告)号：US20050184270A1

公开(公告)日：2005-08-25

申请号：US11112166

申请日：2005-04-22

申请人： Ravinder Aggarwal ,  Jim Kusbel ,  Jerry Davis

发明人： Ravinder Aggarwal ,  Jim Kusbel ,  Jerry Davis

IPC分类号： F16K3/02 ,  F16K51/00 ,  F16K3/00

CPC分类号： F16K51/00 ,  F16K3/0209

摘要： A slit valve for a semiconductor processing apparatus, for fluidly sealing a passage connecting two chambers of the apparatus, such as a substrate reaction chamber and a region outside the reaction chamber. The slit valve comprises an actuator plate movable within a slot in one wall of the passage, the actuator plate and the slot oriented generally transverse to the passage. The actuator plate has a first position in which the valve is open, permitting the transfer of a substrate through the passage. The actuator plate also has a second position in which the valve is closed, and in which the actuator plate fluidly seals the passage such that fluid cannot flow through the passage across the actuator plate. A protective cover is configured to prevent debris within the passage (e.g., broken wafers, shards, particulate contaminants, etc.) from flowing into the slot when the actuator plate occupies its second position. In one embodiment, the cover is pivotably secured to the first wall of the passage, proximate the slot. In another embodiment, the cover is secured to the actuator plate, proximate an end thereof. In a preferred embodiment, the cover comprises a plate.