摘要:
Boron containing phenol/formaldehyde resins can be isolated from their reaction media by evaporating said resins in a spiral flow evaporator which has a ratio between throughput and tube cross section from 0.1 to 1.5 and a ratio between throughput and evaporation surface from 100 to 400.
摘要:
Internally plasticized phenolic resins suitable for use in preparing laminates and the like excellent in electrical properties, heat resistance, solvent resistance as well as punchability are produced by reacting a phenol-formaldehyde resin containing less than 4% by weight of unreacted free monohydric phenol or phenols with an epoxidized vegetable oil, and if required with formaldehyde, with heating preferably in the presence of one or more secondary and/or tertiary amines.
摘要:
This invention relates to novel curative compositions for use in the production of cellular polyurethane elastomers having outstanding energy-absorbing properties. The curative compositions are composed of mixtures of organic diols and the reaction product of phenols which have at least one unsubstituted reactive position on the aromatic nucleus, aldehydes, and aromatic amines.
摘要:
A process for the preparation of multinuclear phenols alkylated in the nucleus, wherein bisphenol A is reacted with a phenyl alkenyl compound in the presence of a catalytic quantity of aluminium phenolate and resols obtained from said alkylated phenols.
摘要:
A heat-curable resin composition for a friction material includes a lignin-modified novolac-type phenol resin having a weight average molecular weight of equal to or more than 6,000, and a curing agent.
摘要:
The present invention relates to a method for increasing the reactivity of lignin, wherein the method comprises the following steps: a) forming, under heating at a temperature of 30-70° C., an aqueous dispersion comprising alkali and lignin, wherein the alkali comprises a hydroxide of an alkali metal; and b) heating the dispersion formed in step a) at a temperature of 50-95° C. for producing alkalated lignin.
摘要:
The invention provides: a dihydroxynaphthalene condensate which suppresses soft particle generation and is suitably usable for a composition excellent in filterability; and a method for producing the dihydroxynaphthalene condensate. In the method for producing a dihydroxynaphthalene condensate, dihydroxynaphthalene to be used has a sulfur element content of 100 ppm or less in terms of mass among constituent elements. The dihydroxynaphthalene and a condensation agent are condensed in presence of an acid or a base to produce the dihydroxynaphthalene condensate.
摘要:
The invention provides a novolak resin having excellent properties such as heat resistance, alkali developability, photosensitivity and resolution, a photosensitive composition including the novolak resin, a curable composition including the novolak resin, a cured product thereof, and a resist material which uses the photosensitive composition or the curable composition. The novolak resin is one obtained from a compound (A) having a tris(hydroxyaryl)methine group and an aldehyde compound (B) as essential reaction ingredients. The photosensitive composition includes the novolak resin. The curable composition includes the novolak resin, and the cured product is one obtained from such a composition. The resist material uses the photosensitive composition or the curable composition.
摘要:
The present invention provides a composition for forming an organic film, containing a polymer compound having one or more of repeating units shown by the general formulae (1) to (4) and an organic solvent containing one or more compounds selected from propylene glycol esters, ketones, and lactones, with a total concentration of more than 30 wt % with respect to the whole organic solvent. There can be provided a composition capable of forming an organic film that can be easily removed, together with a silicon residue modified by dry etching, in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process.
摘要:
A catalyst for use with a phenolic resins which imparts accelerated curing at reduced temperatures. The catalyst is selected from elemental halogen or opium polyhalide compounds of the general formula: O+X(2n+1)−, where 1≤n≤4, Q is onium group, preferably selected from ammonium, sulfonium and phosphonium; and X is a halide. Each X may be the same or different and may include mixed halides such a X═Br2Cl or Cl2Br.