Phenol-aldehyde-amine resin/glycol curative compositions
    63.
    发明授权
    Phenol-aldehyde-amine resin/glycol curative compositions 失效
    苯酚醛胺树脂/乙二醇固化剂组合物

    公开(公告)号:US4195151A

    公开(公告)日:1980-03-25

    申请号:US911523

    申请日:1978-06-01

    CPC分类号: C08G18/544 C08G18/6505

    摘要: This invention relates to novel curative compositions for use in the production of cellular polyurethane elastomers having outstanding energy-absorbing properties. The curative compositions are composed of mixtures of organic diols and the reaction product of phenols which have at least one unsubstituted reactive position on the aromatic nucleus, aldehydes, and aromatic amines.

    摘要翻译: 本发明涉及用于生产具有突出的能量吸收特性的多孔聚氨酯弹性体的新型固化剂组合物。 固化剂组合物由有机二醇和在芳族核,醛和芳族胺上具有至少一个未取代的反应性位置的酚的反应产物的混合物组成。

    Novolak resins and resist materials

    公开(公告)号:US11254778B2

    公开(公告)日:2022-02-22

    申请号:US16080837

    申请日:2017-03-23

    申请人: DIC Corporation

    摘要: The invention provides a novolak resin having excellent properties such as heat resistance, alkali developability, photosensitivity and resolution, a photosensitive composition including the novolak resin, a curable composition including the novolak resin, a cured product thereof, and a resist material which uses the photosensitive composition or the curable composition. The novolak resin is one obtained from a compound (A) having a tris(hydroxyaryl)methine group and an aldehyde compound (B) as essential reaction ingredients. The photosensitive composition includes the novolak resin. The curable composition includes the novolak resin, and the cured product is one obtained from such a composition. The resist material uses the photosensitive composition or the curable composition.

    Composition for forming organic film

    公开(公告)号:US11042090B2

    公开(公告)日:2021-06-22

    申请号:US16044015

    申请日:2018-07-24

    摘要: The present invention provides a composition for forming an organic film, containing a polymer compound having one or more of repeating units shown by the general formulae (1) to (4) and an organic solvent containing one or more compounds selected from propylene glycol esters, ketones, and lactones, with a total concentration of more than 30 wt % with respect to the whole organic solvent. There can be provided a composition capable of forming an organic film that can be easily removed, together with a silicon residue modified by dry etching, in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process.