公开(公告)号：US20130244400A1

公开(公告)日：2013-09-19

申请号：US13790684

申请日：2013-03-08

申请人： GREGORY GEORGE ,  Stefan Lutter

发明人： GREGORY GEORGE ,  Stefan Lutter

IPC分类号： H01L21/02

CPC分类号： B32B37/0046 ,  B32B37/1284 ,  B32B37/18 ,  B32B2307/202 ,  B32B2457/14 ,  H01L21/0201 ,  H01L21/2007 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/17

摘要： A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with the cured first adhesive layer faces down. Next, inserting the second wafer into the bonder module and placing the second wafer upon a lower chuck assembly so that the second adhesive layer faces up and is opposite to the first adhesive layer. Next, moving the lower chuck assembly upwards and bringing the second adhesive layer in contact with the cured first adhesive layer, and then curing the second adhesive layer.

摘要翻译： 临时粘合第一和第二晶片的方法包括：在第一晶片的第一表面上施加第一粘合剂层，然后固化第一粘合剂层。 接下来，将第二粘合剂层施加到第二晶片的第一表面上。 接下来，将第一晶片插入粘合剂模块中，并通过上卡盘组件保持第一晶片，使得其第一表面与固化的第一粘合剂层面朝下。 接下来，将第二晶片插入到接合器模块中，并将第二晶片放置在下卡盘组件上，使得第二粘合剂层面向上并与第一粘合剂层相对。 接下来，向下移动下卡盘组件并使第二粘合剂层与固化的第一粘合剂层接触，然后固化第二粘合剂层。

公开(公告)号：US08425715B2

公开(公告)日：2013-04-23

申请号：US13079446

申请日：2011-04-04

申请人： Gregory George

发明人： Gregory George

IPC分类号： B29C65/00 ,  B29C65/08 ,  B29C45/00 ,  B29C47/00 ,  B29C43/02 ,  B29C49/00 ,  B29C51/00 ,  B29C43/10 ,  B32B37/00 ,  B30B5/02 ,  B30B5/04 ,  B30B15/34 ,  H01L21/30 ,  H01L21/46 ,  H01L21/76 ,  B29D24/00 ,  B29D29/00 ,  B28B21/36 ,  A01J21/00 ,  A01J25/12 ,  A21C3/00 ,  A21C11/00 ,  A23G1/20 ,  A23G3/02 ,  A23P1/00 ,  B28B11/08 ,  B29C55/28

CPC分类号： H01L21/6719 ,  H01L21/67092

摘要： An industrial-scale high throughput wafer bonding apparatus includes a wafer bonder chamber extending along a main axis and comprising a plurality of chamber zones, a plurality of heater/isolator plates, a guide rod system extending along the main axis, a pair of parallel track rods extending along the main axis, and first pressure means. The chamber zones are separated from each other and thermally isolated from each other by the heater/isolator plates. The heater/isolator plates are oriented perpendicular to the main axis, are movably supported and guided by the guide rod system and are configured to move along the direction of the main axis. Each of the chamber zones is dimensioned to accommodate an aligned wafer pair and the wafer pairs are configured to be supported by the parallel track rods. The first pressure means is configured to apply a first force perpendicular to a first end heater/isolator plate. The applied first force causes the heater/isolator plates to move toward each other along the main axis and thereby causes the collapse of each chamber zone volume and the application of bonding pressure onto the wafer pairs.

摘要翻译： 一种工业规模的高通量晶片接合装置，包括沿着主轴延伸的晶片接合室，包括多个室区，多个加热器/隔离板，沿主轴延伸的导杆系统，一对平行轨道 杆沿着主轴线延伸，以及第一压力装置。 室区彼此分离并通过加热器/隔离板彼此热隔离。 加热器/隔离板垂直于主轴定向，由导杆系统可移动地支撑和引导，并被构造成沿着主轴线的方向移动。 每个室区的尺寸被设计成适应对准的晶片对，并且晶片对构造成由平行轨道杆支撑。 第一压力装置构造成施加垂直于第一端加热器/隔离板的第一力。 所施加的第一力使得加热器/隔离板沿着主轴线彼此移动，从而导致每个室区域体积的崩溃以及将结合压力施加到晶片对上。

公开(公告)号：US08366873B2

公开(公告)日：2013-02-05

申请号：US13085159

申请日：2011-04-12

申请人： Gregory George

发明人： Gregory George

IPC分类号： B32B38/10

CPC分类号： B32B43/006 ,  B32B38/1858 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/1126 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1174 ,  Y10T156/1944 ,  Y10T156/1956 ,  Y10T156/1978

摘要： A debonder apparatus includes a chuck assembly, a flex plate assembly, a contact roller and a resistance roller. The chuck assembly includes a chuck and a first wafer holder holding a first wafer of a bonded wafer pair in contact with the chuck. The flex plate assembly includes a flex plate and a second wafer holder holding a second wafer of the bonded wafer pair in contact with the flex plate. The flex plate is placed above the chuck. The contact roller is arranged adjacent to a first edge of the chuck and pushes and lifts up a first edge of the flex plate, while the resistance roller traverses horizontally over the flex plate and applies a downward force upon the flex plate and thereby the bonded wafer pair delaminates along a release layer and the first and second wafers are separated from each other.

摘要翻译： 脱粘器装置包括卡盘组件，挠性板组件，接触辊和电阻辊。 卡盘组件包括卡盘和保持与卡盘接触的接合晶片对的第一晶片的第一晶片保持架。 柔性板组件包括柔性板和保持接合晶片对的第二晶片与柔性板接触的第二晶片保持架。 柔性板放置在卡盘的上方。 接触辊被布置成与卡盘的第一边缘相邻并且将柔性板的第一边缘推起并提升，同时阻力辊横向于柔性板上的水平方向并且向上施加向下的力到柔性板上，从而将接合的晶片 沿分离层分层，并且第一和第二晶片彼此分离。

公开(公告)号：US20110253314A1

公开(公告)日：2011-10-20

申请号：US13085159

申请日：2011-04-12

申请人： GREGORY GEORGE

发明人： GREGORY GEORGE

IPC分类号： B32B38/10

CPC分类号： B32B43/006 ,  B32B38/1858 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/1126 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1174 ,  Y10T156/1944 ,  Y10T156/1956 ,  Y10T156/1978

摘要： A debonder apparatus for debonding a temporary bonded wafer pair includes a chuck assembly, a flex plate assembly, a contact roller and a resistance roller. The chuck assembly includes a chuck and a first wafer holder configured to hold a first wafer of the temporary bonded wafer pair in contact with a top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold a second wafer of the temporary bonded wafer pair in contact with a first surface of the flex plate. The flex plate is configured to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a first edge of the chuck and includes means for pushing and lifting up a first edge of the flex plate. The resistance roller includes means for traversing horizontally over the flex plate and means for applying a downward force upon the flex plate. The contact roller pushes and lifts up the first edge of the flex plate while the resistance roller simultaneously applies the downward force upon the flex plate and traverses horizontally away from the first edge of the flex plate and thereby the temporary bonded wafer pair delaminates along a release layer and the first and second wafers are separated from each other.

摘要翻译： 用于剥离临时键合晶片对的脱粘器装置包括卡盘组件，挠性板组件，接触辊和电阻辊。 卡盘组件包括卡盘和第一晶片保持器，第一晶片保持器构造成保持临时结合晶片对的第一晶片与卡盘的顶表面接触。 柔性板组件包括柔性板和第二晶片保持器，其被配置为保持临时结合晶片对的第二晶片与柔性板的第一表面接触。 柔性板被配置为放置在卡盘的顶表面上方。 接触辊邻近卡盘的第一边缘布置，并且包括用于推动和提升柔性板的第一边缘的装置。 电阻辊包括用于水平地横过柔性板的装置和用于向柔性板施加向下的力的装置。 接触辊推动并提起柔性板的第一边缘，同时电阻辊同时向柔性板施加向下的力并且横向水平地远离柔性板的第一边缘，从而临时粘结的晶片对沿着释放 层，并且第一和第二晶片彼此分离。

公开(公告)号：US07948034B2

公开(公告)日：2011-05-24

申请号：US11766531

申请日：2007-06-21

申请人： Gregory George ,  Etienne Hancock ,  Robert Campbell

发明人： Gregory George ,  Etienne Hancock ,  Robert Campbell

IPC分类号： H01L27/12

CPC分类号： H01L21/67092 ,  H01L21/187

摘要： An apparatus for bonding semiconductor structures includes equipment for positioning a first surface of a first semiconductor structure directly opposite and in contact with a first surface of a second semiconductor structure and equipment for forming a bond interface area between the first surfaces of the first and second semiconductor structures by pressing the first and second semiconductor structures together with a force column configured to apply uniform pressure to the entire bond interface area between the first surfaces.

摘要翻译： 一种用于接合半导体结构的装置包括用于定位与第二半导体结构的第一表面直接相对并接触的第一半导体结构的第一表面的设备和用于在第一和第二半导体的第一表面之间形成接合界面区域的设备 通过将第一和第二半导体结构与被配置为对第一表面之间的整个结合界面区域施加均匀压力的力列一起按压第一和第二半导体结构的结构。

公开(公告)号：US07057707B2

公开(公告)日：2006-06-06

申请号：US10767124

申请日：2004-01-29

申请人： Sven Hansen

发明人： Sven Hansen

IPC分类号： G03B27/52 ,  G03B27/42 ,  G01B11/00 ,  G01N21/86

CPC分类号： G03F9/7088 ,  G02B21/24 ,  G03F9/7084

摘要： The present invention provides for a method for adjusting an alignment microscope. In the method of the present invention an alignment mask is used in which the one side comprises at least one alignment mark and the other side is reflective. For the adjustment, the microscope is first focused to the alignment mark and then refocused to the mirror image of the alignment mark generated by the reflective side. The microscope is then adjusted by comparing the positions of the alignment mark and the generated mirror image of the alignment mark until the alignment mark overlaps its mirror image. Moreover, a device for adjusting an alignment microscope in accordance with the method of the present invention.