METHOD FOR FORMING SILICON FILM HAVING MICROCRYSTAL STRUCTURE
    71.
    发明申请
    METHOD FOR FORMING SILICON FILM HAVING MICROCRYSTAL STRUCTURE 审中-公开
    用于形成具有微结构结构的硅膜的方法

    公开(公告)号:US20120040519A1

    公开(公告)日:2012-02-16

    申请号:US13117722

    申请日:2011-05-27

    Applicant: Ching-Ting LEE

    Inventor: Ching-Ting LEE

    Abstract: A method for forming a silicon film having a microcrystal structure is provided. The method includes following steps. A plasma-enhanced chemical vapor deposition system having a reaction chamber, a top electrode and a bottom electrode is provided. The top electrode and the bottom electrode are opposite and disposed in the reaction chamber. A substrate is disposed on the bottom electrode. A silane gas is applied into the reaction chamber. A silicon film having a microcrystal structure is formed by simultaneously irradiating the silane gas in the reaction chamber by a carbon dioxide laser and performing a plasma-enhanced chemical vapor deposition step.

    Abstract translation: 提供了一种形成具有微晶结构的硅膜的方法。 该方法包括以下步骤。 提供了具有反应室,顶电极和底电极的等离子体增强化学气相沉积系统。 顶部电极和底部电极相对并设置在反应室中。 衬底设置在底部电极上。 将硅烷气体施加到反应室中。 通过二氧化碳激光器同时在反应室中照射硅烷气体并进行等离子体增强化学气相沉积步骤,形成具有微结晶结构的硅膜。

    HEAT SPREADING STRUCTURE
    72.
    发明申请
    HEAT SPREADING STRUCTURE 审中-公开
    散热结构

    公开(公告)号:US20110141698A1

    公开(公告)日:2011-06-16

    申请号:US12730082

    申请日:2010-03-23

    CPC classification number: H01L23/3737 H01L2924/0002 H01L2924/00

    Abstract: The disclosed is a thermal interface layer disposed between a heat-generating apparatus and a thermal dissipation component. The thermal interface layer is composed of a mixture of a resin matrix and highly thermal conductive powders, wherein the resin matrix is obtained by reacting epoxy resin, diisocyanate, and amino curing agent. Tuning the ratio of the diisocyanate and the epoxy resin may modify the hardness and the viscosity of the thermal interface material. After repeated tested at high temperature for long period, the described thermal interface layer still remained viscose, soft, and thermally resistant. The filling effect of the thermal interface material in the voids between the electronic device and the sink is largely improved. The thermoplastic thermal interface material may fill the void or cavity on the surface of the electronic apparatus, thereby improving the heat spreading efficiency of the whole structure.

    Abstract translation: 所公开的是设置在发热装置和散热部件之间的热界面层。 热界面层由树脂基体和高导热性粉末的混合物组成,其中树脂基体通过环氧树脂,二异氰酸酯和氨基固化剂反应获得。 调整二异氰酸酯和环氧树脂的比例可以改变热界面材料的硬度和粘度。 经过长时间的高温反复测试后,所述的热界面层仍保持粘胶,柔软和耐热。 热界面材料在电子设备和水槽之间的空隙中的填充效果大大提高。 热塑性热界面材料可以填充电子设备表面上的空隙或空腔,从而提高整个结构的散热效率。

    CALIBRATION DEVICE FOR NOZZLE AND CALIBRATION METHOD FOR NOZZLE
    73.
    发明申请
    CALIBRATION DEVICE FOR NOZZLE AND CALIBRATION METHOD FOR NOZZLE 有权
    用于喷嘴的校准装置和喷嘴的校准方法

    公开(公告)号:US20090183380A1

    公开(公告)日:2009-07-23

    申请号:US12017564

    申请日:2008-01-22

    CPC classification number: G01B3/34 G01B3/46 G01B7/14 G01B7/31 G01B11/14 G01B11/27

    Abstract: A calibration device for a nozzle suitable for calibrating a nozzle of a semiconductor apparatus is provided. The semiconductor apparatus includes a chuck with a center hole with radius R1. A cap with outer radius R3 is disposed outside the nozzle with outer radius R2. The calibration device includes a jig including an upper portion, a lower portion and a recess in the front surface of the upper portion. The recess includes an outer portion with depth D1 and radius R4 larger than R3 and an inner portion with depth D2 larger than D1 and radius R5 larger than R2. The lower portion with a radius R6 less than R1 is connected to the back surface of the upper portion for fixing the jig in the center hole. The values of (R4−R3), (R5−R2) and (R1−R6) are in the tolerable calibration inaccuracy range.

    Abstract translation: 提供了一种用于校准半导体装置的喷嘴的用于喷嘴的校准装置。 半导体装置包括具有半径为R1的中心孔的卡盘。 具有外半径R3的盖设置在外径R2的喷嘴的外侧。 校准装置包括夹具,该夹具包括在上部的前表面中的上部,下部和凹部。 该凹部包括具有深度D1和半径R4大于R3的外部部分和深度D2大于D1且半径R5大于R2的内部部分。 半径R6小于R1的下部连接到上部的后表面,用于将夹具固定在中心孔中。 (R4-R3),(R5-R2)和(R1-R6)的值在容许的校准误差范围内。

    PRESS-KEY STRUCTURE
    74.
    发明申请
    PRESS-KEY STRUCTURE 审中-公开
    新闻结构

    公开(公告)号:US20090058811A1

    公开(公告)日:2009-03-05

    申请号:US12196549

    申请日:2008-08-22

    Applicant: CHING-TING LIN

    Inventor: CHING-TING LIN

    CPC classification number: H01H3/125

    Abstract: A press-key structure is disclosed, which comprises: a keycap; a scissors-type supporting part; a substrate; and an elastic part. In an exemplary embodiment, the scissors-type supporting part is configured with a first and a second pivot axes; the press-key structure further comprises a first clasp part formed with a guiding ramp, a second clasp part formed as an inversed L-shaped structure, and at least a guiding block formed with a ramp, all being disposed on the substrate in a manner that the ramp of the at least one guiding block is configured to lean toward the second clasp part, while connecting the first and the second pivot axes respectively to the first clasp part and the second clasp part for enabling the keycap to move up and down relative to the substrate.

    Abstract translation: 公开了一种按键结构,其包括:键帽; 剪刀式支撑部件; 底物; 和弹性部分。 在示例性实施例中,剪刀式支撑部分构造有第一和第二枢轴; 所述按键结构还包括形成有引导斜面的第一搭扣部件,形成为反转的L形结构的第二搭扣部件,以及形成有斜面的至少一个引导块,全部以一定方式设置在所述基板上 所述至少一个引导块的斜坡被配置为朝向所述第二扣环部分倾斜,同时将所述第一和第二枢转轴线分别连接到所述第一扣环部分和所述第二扣钩部件,以使所述键帽能够上下相对移动 到基底。

    Nondestructive measurement method of individual mode loss for waveguides
    77.
    发明授权
    Nondestructive measurement method of individual mode loss for waveguides 有权
    波导单个模式损耗的非破坏性测量方法

    公开(公告)号:US06219475B1

    公开(公告)日:2001-04-17

    申请号:US09293888

    申请日:1999-04-19

    Applicant: Ching-Ting Lee

    Inventor: Ching-Ting Lee

    Abstract: The device concerns measuring the propagation and bending losses that take place in the individual mode of the multi-mode waveguide. The method applied is a new one comprising butt-couple and prism-couple together with phase-modulation method. Electrodes are made on the waveguide, and applied with voltage. The electro-optical effect is used to modulate the effective length of the waveguide in forming a Fabry-Perot etalon. From here, the contrast of the butt-couple's output and the loss can be measured. At the same time, as the prism-couple is able to separate the multiple modes individually, and measure the contrast and loss of each mode through every output mode which are then compared with the butt-couple, each mode's propagation and bending losses values of the multi-mode waveguide can be derived.

    Abstract translation: 该装置涉及测量在多模波导的单独模式中发生的传播和弯曲损耗。 应用的方法是包括对接和棱镜耦合以及相位调制方法的新方法。 电极在波导上制成,并施加电压。 电光效应用于在形成法布里 - 珀罗标准具时调制波导的有效长度。 从这里,可以测量对夫妇的产出和损失的对比。 同时,由于棱镜对能够单独分离多个模式,并且通过每个输出模式测量每个模式的对比度和损耗,然后将其与对接进行比较,每个模式的传播和弯曲损耗值 可以导出多模波导。

    Single site catalyst with methyl aluminoxane or borate free and their
applications for the preparation of polyolefins
    78.
    发明授权
    Single site catalyst with methyl aluminoxane or borate free and their applications for the preparation of polyolefins 失效
    具有甲基铝氧烷或无硼酸盐的单中心催化剂及其在制备聚烯烃中的应用

    公开(公告)号:US6150529A

    公开(公告)日:2000-11-21

    申请号:US249511

    申请日:1999-02-12

    CPC classification number: C08F10/00 C08F110/02 C08F4/65912 Y10S526/943

    Abstract: A novel organometallic compound is disclosed which can be used, in conjunction with a trialkyl or bialkyl aluminum cocatalyst, for catalyzing the polymerization and copolymerization of ethylene without requiring the use of either methyl aluminoxane or borate as cocatalyst. The organometallic compound is represented by the formula of (C.sub.5 R.sub.n H.sub.5-n)(L)MX.sub.a Y.sub.b ; wherein: (a) C.sub.5 R.sub.n H.sub.5-n is a substituted or unsubstituted cyclopentadienyl group, in which n is an integer between 0 and 5, and R is C.sub.1 to C.sub.6 alkyl group; (b) L is tetrapyrazolyl borate, hydrotrispyrazolyl borate, dihydrobispyrazolyl borate or hydrotris(3,5-dimethylpyrazolyl) borate; (c) M is a Group IIIB, Grcup IVB, or Group VB transitional metal; (d) a and b are integers such that a+b=m-2, where m is the valance of M; and (e) X and Y, which can be the same of different from each other, are halogen atoms or ligands represented by the formula of ER.sup.1 or ER.sup.1 R.sup.2, where E is a Group VA or VIA element, and R.sup.1 and R.sup.2, which can be the same or different from each other, are C.sub.1 to C.sub.6 alkyl group or substituted aryl group. Preferably, M is a Group IVB transitional metal and a=b=1, and the organometallic compound is then represented by the formula of (C.sub.5 R.sub.n H.sub.5-n)(L)MXY.

    Abstract translation: 公开了一种可与三烷基或双烷基铝助催化剂结合使用的用于催化乙烯的聚合和共聚而不需要使用甲基铝氧烷或硼酸盐作为助催化剂的新型有机金属化合物。 有机金属化合物由式(C5RnH5-n)(L)MXaYb表示; 其中:(a)C5RnH5-n是取代或未取代的环戊二烯基,其中n是0和5之间的整数,R是C1-C6烷基; (b)L是四吡唑基硼酸盐,氢四唑基硼酸盐,二氢双吡唑基硼酸盐或氢化三(3,5-二甲基吡唑基)硼酸盐; (c)M是IIIB族,Grcup IVB族或VB族过渡金属; (d)a和b是整数,使得a + b = m-2,其中m是M的化合价; 和(e)可以彼此不同的X和Y是由式ER1或ER1R2表示的卤素原子或配体,其中E是VA族或VIA族,R1和R2可以 彼此相同或不同,为C1至C6烷基或取代的芳基。 优选地,M是IVB族过渡金属,a = b = 1,有机金属化合物由式(C5RnH5-n)(L)MXY表示。

    Single site catalysts with MAO or borate free and their application for
polyolefins
    79.
    发明授权
    Single site catalysts with MAO or borate free and their application for polyolefins 失效
    具有MAO或无硼酸盐的单中心催化剂及其在聚烯烃中的应用

    公开(公告)号:US5891816A

    公开(公告)日:1999-04-06

    申请号:US897862

    申请日:1997-07-21

    CPC classification number: C08F10/00 C08F110/02 C08F4/65912 Y10S526/943

    Abstract: A novel organometallic compound is disclosed which can be used, in conjunction with a trialkyl or bialkyl aluminum cocatalyst, for catalyzing the polymerization and copolymerization of ethylene without requiring the use of either methyl aluminoxane or borate as cocatalyst. The organometallic compound is represented by the formula of (CR.sub.5 R.sub.n H.sub.5-n)(L)MX.sub.a Y.sub.b ; wherein: (a) C.sub.5 R.sub.n H.sub.5-n is a substituted or unsubstituted cyclopentadienyl group, in which n is an integer between 0 and 5, and R is C.sub.1 to C.sub.6 alkyl group; (b) L is tetrapyrazolyl borate, hydrotrispyrazolyl borate, dihydrobispyrazolyl borate or hydrotris(3,5-dimethylpyrazolyl) borate; (c) M is a Group IIIB, Group IVB, or Group VB transitional metal; (d) a and b are integers such that a+b=m-2, where m is the valance of M; and (e) X and Y, which can be the same of different from each other, are halogen atoms or ligands represented by the formula of ER.sup.1, where E is a Group VA or VIA element, and R.sup.1 is C.sub.1 to C.sub.6 alkyl group, aryl group or halogen-substituted aryl group. Preferably, M is a Group IVB transitional metal and a=b=1, and the organometallic compound is then represented by the formula of (C.sub.5 R.sub.n H.sub.5-n)(L)MXY.

    Abstract translation: 公开了一种可与三烷基或双烷基铝助催化剂结合使用的用于催化乙烯的聚合和共聚而不需要使用甲基铝氧烷或硼酸盐作为助催化剂的新型有机金属化合物。 有机金属化合物由式(CR5RnH5-n)(L)MXaYb表示; 其中:(a)C5RnH5-n是取代或未取代的环戊二烯基,其中n是0和5之间的整数,R是C1-C6烷基; (b)L是四吡唑基硼酸盐,氢四唑基硼酸盐,二氢双吡唑基硼酸盐或氢化三(3,5-二甲基吡唑基)硼酸盐; (c)M是IIIB族,IVB族或VB族过渡金属; (d)a和b是整数,使得a + b = m-2,其中m是M的化合价; 和(e)可以彼此不同的X和Y是由式ER1表示的卤素原子或配体,其中E是VA族或VIA族,R1是C1-C6烷基, 芳基或卤素取代的芳基。 优选地,M是IVB族过渡金属,a = b = 1,有机金属化合物由式(C5RnH5-n)(L)MXY表示。

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