摘要:
A high priority and/or emergency overload access control system treats a wireless unit as a higher priority wireless unit when the wireless unit is attempting to access a wireless communications system with a high priority call, such as an emergency call. For example, the overload access control system can recognize if the wireless unit is attempting to initiate a call to an emergency number. If so, the wireless unit can perform a persistence test as an emergency class (e.g. overload class 10-15) wireless unit in attempting to access the wireless communications system. Thus, the wireless unit will experience an increased probability of passing the persistence test and thereby reducing the persistence delay in attempting to access the wireless communications system with the emergency call.
摘要:
Call processing overload at a base station of a cellular wireless network is controlled by monitoring a level of call processing at the base station, and reducing a present handoff rate for active users when the call processing level exceeds a first threshold less than a maximum call processing capacity. When the call processing level at the base station exceeds a second threshold greater than the first threshold, a present rate of call originations or terminations is reduced while further reducing the handoff rate.
摘要:
Reduced T2 decay is achieved through use of at least one asymmetrically truncated RF nutation pulse and an asymmetrically sampled NMR RF response with missing asymmetric data being supplied by complex conjugate synthesis.
摘要:
A telescopic tube is disclosed. By pressing and rotating a switching button, an abutting section is aligned to a first hole of an outer tube and then elastically pushed by an elastic member, a pin section of the switching button is released from engagement with a fastening hole of the inner tube, and the position of the inner tube in the outer tube can be adjusted individually. After the inner tube is adjusted completely and the switching button is pressed to rotated again, the pin section is inserted into the fastening hole, the engaging section is engaged in the first hole. When the switching button is pressed, the movement of the inner tube makes the switching button release from the first hole and the third hole, and the inner tube, the control assembly and the inner mounting member are retractable in the through hole of the outer tube.
摘要:
The present invention discloses a lateral double diffused metal oxide semiconductor (LDMOS) device and a manufacturing method thereof. The LDMOS device includes: drift region, an isolation oxide region, a first oxide region, a second oxide region, a gate, a body region, a source, and a drain. The isolation oxide region, the first oxide region, and the second oxide region have an isolation thickness, a first thickness, and a second thickness respectively, wherein the second thickness is less than the first thickness. The present invention can reduce a conduction resistance without decreasing a breakdown voltage of the LDMOS device by the first oxidation region and the second oxidation region.
摘要:
A network receiver includes a first variable resistor, a second variable resistor, a first processing unit, a second processing unit and an adjusting circuit. The first variable resistor is coupled to a first transmission line via a first terminal for transmitting a first signal. The second variable resistor is coupled to a second transmission line via a second terminal for transmitting a second signal. The first processing unit is utilized for obtaining a difference according to the first signal and the second signal, and processing the difference to generate first data. The second processing unit is utilized for obtaining a summation according to the first signal and the second signal, and processing the summation to generate second data. The adjusting circuit is utilized for adjusting resistance(s) of at least one of the first variable resistor and the second variable resistor according to the first data and the second data.
摘要:
The present invention discloses a double diffused metal oxide semiconductor (DMOS) device and a manufacturing method thereof. The DMOS device includes: an isolation structure for defining device regions; a gate with a ring-shaped structure; a drain located outside the ring; and a lightly doped drain, a source, and a body electrode located inside the ring. To increase the sub-threshold voltage at the corners of the gate, the corners are located completely on the isolation structure, or the lightly doped drain is apart from the corners by a predetermined distance.
摘要:
The present invention discloses a double diffused metal oxide semiconductor (DMOS) device and a manufacturing method thereof. The DMOS device includes: an isolation structure for defining device regions; a gate with a ring-shaped structure; a drain located outside the ring; and a lightly doped drain, a source, and a body electrode located inside the ring. To increase the sub-threshold voltage at the corners of the gate, the corners are located completely on the isolation structure, or the lightly doped drain is apart from the corners by a predetermined distance.
摘要:
The present invention discloses a double diffused metal oxide semiconductor (DMOS) device and a manufacturing method thereof. The DMOS device includes: an isolation structure for defining device regions; a gate with a ring-shaped structure; a drain located outside the ring; and a lightly doped drain, a source, and a body electrode located inside the ring. To increase the sub-threshold voltage at the corners of the gate, the corners are located completely on the isolation structure, or the lightly doped drain is apart from the corners by a predetermined distance.
摘要:
A device includes a semiconductor substrate having a front side and a backside. A photo-sensitive device is disposed at a surface of the semiconductor substrate, wherein the photo-sensitive device is configured to receive a light signal from the backside of the semiconductor substrate, and convert the light signal to an electrical signal. An amorphous-like adhesion layer is disposed on the backside of the semiconductor substrate. The amorphous-like adhesion layer includes a compound of nitrogen and a metal. A metal shielding layer is disposed on the backside of the semiconductor substrate and contacting the amorphous-like adhesion layer.