公开(公告)号：US20240215119A1

公开(公告)日：2024-06-27

申请号：US18508540

申请日：2023-11-14

Applicant: NGK INSULATORS, LTD.

Inventor： Yoshiki KONNO

IPC: H05B3/42

CPC classification number: H05B3/42

Abstract: A heater element for vehicle air conditioning includes: a honeycomb structure having: a plurality of pillar shaped honeycomb segments each having an outer peripheral wall and partition walls disposed on an inner side of the outer peripheral wall, the partition walls defining a plurality of cells, each of the cells extending from a first end face to a second end face to form a flow path; and joining layers for joining surfaces of the outer peripheral walls of the plurality of pillar shaped honeycomb segments parallel to an extending direction of the cells; and a pair of electrodes provided on surfaces of the outer peripheral wall, the partition walls and the joining layers on the first end face and the second end face. The partition walls have a thickness of 0.1016 to 0.1397 mm. The joining layers have a thickness of 1.0 to 5.0 mm.

公开(公告)号：US20240213052A1

公开(公告)日：2024-06-27

申请号：US18520954

申请日：2023-11-28

Applicant: NGK INSULATORS, LTD.

Inventor： Hideaki HASHIMOTO ,  Masashi ONO ,  Michihiro ASHIDA

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67103 ,  H01L21/6833

Abstract: A plug includes a plug body, a spiral gas flow path that is provided in the plug body and that extends from a lower surface of the plug body to an upper surface, and at least one branch path that branches from a position on the spiral gas flow path and that opens on an outer circumferential surface of the plug body or that is in communication with another spiral gas flow path that differs from the spiral gas flow path and that extends from a lower surface of the plug body to an upper surface.

公开(公告)号：US20240203784A1

公开(公告)日：2024-06-20

申请号：US18342810

申请日：2023-06-28

Applicant: NGK INSULATORS, LTD.

Inventor： Hiroya SUGIMOTO

IPC: H01L21/687 ,  C23C16/458 ,  H01L21/67

CPC classification number: H01L21/68785 ,  C23C16/4581 ,  C23C16/4586 ,  H01L21/67069 ,  H01L21/68757

Abstract: A member for semiconductor manufacturing apparatus includes a ceramic plate having a circular wafer placement surface having a seal band along an outer periphery, and an annular focus ring placement surface located outside the wafer placement surface and below the wafer placement surface; a circular inner heater electrode embedded in the ceramic plate; an annular outer heater electrode embedded in the ceramic plate and surrounding the inner heater electrode; and a cooling plate disposed at a surface of the ceramic plate opposite the wafer placement surface, wherein the inner heater electrode overlaps at least a portion of the seal band in plan view, and an outer diameter of the inner heater electrode is not less than 97% of an outer diameter of the wafer placement surface.

公开(公告)号：US20240198269A1

公开(公告)日：2024-06-20

申请号：US18502202

申请日：2023-11-06

Applicant: NGK INSULATORS, LTD.

Inventor： Takahiro ONEDA

IPC: B01D46/24

CPC classification number: B01D46/244 ,  B01D46/2429 ,  B01D46/24491 ,  B01D46/2459 ,  B01D46/2474 ,  B01D46/2482 ,  B01D46/249

Abstract: A honeycomb filter includes a honeycomb structure having a porous partition wall and a plurality of plugging portions, wherein a porosity of the plugging portion is 40 to 60%, a central plugging portion having a plugging length of 5 mm or more and an outer peripheral plugging portion having the plugging length of less than 5 mm are disposed, an average plugging length L1(Ave) is 5 mm or more and 10 mm or less, an average plugging length L2(Ave) is 2 mm or more and less than 5 mm, a difference between L1(Ave) and L2(Ave) is 2 to 6 mm, a ratio of an average radius of the center part to an equivalent circle diameter of the end face is 0.2 to 0.5, the plugging portion is composed of a plurality of particles, an average value of an equivalent circle diameter of each particle is 3 to 5 μm, and a particle density is 750 to 1250 particles/mm2.

公开(公告)号：US12009245B2

公开(公告)日：2024-06-11

申请号：US17457092

申请日：2021-12-01

Applicant: NGK INSULATORS, LTD.

Inventor： Masaki Ishikawa ,  Yuji Akatsuka ,  Kenji Yonemoto

IPC: H01L21/683 ,  B23Q3/15 ,  C09J5/06 ,  H01J37/32 ,  H01L21/67 ,  H02N13/00

CPC classification number: H01L21/6833 ,  B23Q3/15 ,  C09J5/06 ,  H01J37/32697 ,  H01J37/32715 ,  H01L21/67109 ,  H02N13/00 ,  C09J2203/326 ,  H01J2237/2007 ,  H01L21/67103

Abstract: A member for semiconductor manufacturing apparatus, includes: a ceramic plate having a wafer placement surface; a plug receiving hole formed in a surface of the ceramic plate opposite to the wafer placement surface; a gas outlet port extending through a bottom wall of the plug receiving hole; a plug received in the plug receiving hole; and a gas flow path disposed inside the plug to be continuous with the gas outlet port, wherein a stepped portion is disposed on a side surface of the plug or an inner surface of the plug receiving hole, the plug receiving hole and the plug are in contact with each other in an area deeper than the stepped portion, a gap is formed between the plug receiving hole and the plug in an area shallower than the stepped portion, and a plug support member made of an adhesive material is formed in the gap.

公开(公告)号：US20240186170A1

公开(公告)日：2024-06-06

申请号：US18346951

申请日：2023-07-05

Applicant: NGK INSULATORS, LTD.

Inventor： Natsuki HIRATA ,  Shinya YOSHIDA ,  Tatsuya KUNO ,  Seiya INOUE ,  Taro USAMI ,  Kenji YONEMOTO ,  Aoi SAITO

IPC: H01L21/683

CPC classification number: H01L21/6833

Abstract: A member for a semiconductor manufacturing apparatus includes: a ceramic plate that has a wafer placement surface at an upper surface thereof; a plug disposition hole that extends through the ceramic plate in an up-down direction and that has a truncated conical space whose upper opening is larger than a lower opening thereof; a truncated conical plug that is disposed in the plug disposition hole, that allows gas to flow in the up-down direction, and whose upper surface is larger than a lower surface thereof; an adhesive layer that is provided between the plug disposition hole and the truncated conical plug; an electrically conductive baseplate that is joined to a lower surface of the ceramic plate through a joint layer; and a gas supply path that is provided in the baseplate and the joint layer and that supplies gas to the truncated conical plug.

公开(公告)号：US20240181399A1

公开(公告)日：2024-06-06

申请号：US18438583

申请日：2024-02-12

Applicant: NGK INSULATORS, LTD.

Inventor： Kenichi NODA ,  Narumi TOMOKAGE

IPC: B01D65/02 ,  B01D53/22 ,  B01D71/02

CPC classification number: B01D65/02 ,  B01D53/22 ,  B01D71/0281 ,  B01D2321/18 ,  B01D2321/44

Abstract: A processing method of a separation membrane complex includes a step of preparing a separation membrane complex including a porous support and a separation membrane formed on the support and a step of bringing a cleaning fluid composed of supercritical or subcritical carbon dioxide having a density of 600 to 1000 kg/m3 into contact with the separation membrane of the separation membrane complex.

公开(公告)号：US20240172332A1

公开(公告)日：2024-05-23

申请号：US18502150

申请日：2023-11-06

Applicant: NGK INSULATORS, LTD. ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： Yuta NAGATANI ,  Shinobu SHIMASAKI

IPC: H05B3/06 ,  B01J23/42 ,  B01J23/44 ,  B01J23/46 ,  B01J35/04

CPC classification number: H05B3/06 ,  B01J23/42 ,  B01J23/44 ,  B01J23/46 ,  B01J35/04

Abstract: An electrically heating support includes: a honeycomb structure 1 including a honeycomb structure portion 10 having an outer peripheral wall 100; and electrode layers 11 provided on a surface of the outer peripheral wall 100; metal electrodes 2; and a plurality of thermally sprayed fixed layers 3, wherein each of the pair of metal electrodes 2 includes: a base portion 20; and a comb tooth-shaped connection portion 21 having a plurality of teeth portions 23, wherein each of the tooth portions 23 includes at least one first portion 23a and at least one second portion 23b narrower than the first portion 23a, and wherein at least one of the thermally sprayed fixed layers 3 is provided on an outer peripheral surface of the honeycomb structure 1 and the at least one second portion 23b so that the connection portion 21 is fixed to the honeycomb structure 1.

公开(公告)号：US20240162016A1

公开(公告)日：2024-05-16

申请号：US18307918

申请日：2023-04-27

Applicant: NGK INSULATORS, LTD.

Inventor： Ryuji TAMURA ,  Ikuhisa MORIOKA ,  Hiroya SUGIMOTO ,  Keita MINE

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J2237/002

Abstract: A wafer placement table includes a ceramic plate, a cooling plate, a space layer, and a space layer forming portion. The ceramic plate has a wafer placement portion at an upper surface of the ceramic plate and incorporates electrodes. The cooling plate is joined to a lower surface of the ceramic plate and has a refrigerant passage. The space layer is provided between the refrigerant passage and an upper surface of the cooling plate. The space layer forming portion is a part, surrounding the space layer, of the cooling plate. The space layer forming portion has a seam. The seam is formed by metal bonding without a seal member.

公开(公告)号：US11963269B2

公开(公告)日：2024-04-16

申请号：US17132416

申请日：2020-12-23

Applicant: NGK INSULATORS, LTD.

Inventor： Noboru Kajihara ,  Shuichiro Motoyama

IPC: H05B3/14

CPC classification number: H05B3/143

Abstract: A ceramic heater includes a ceramic plate having a surface that serves as a wafer placement surface, resistance heating elements that are embedded in the ceramic plate, a tubular shaft that supports the ceramic plate from a rear surface of the ceramic plate, a recess that is formed in a within-shaft region of the rear surface of the ceramic plate, the within-shaft region being surrounded by the tubular shaft, and terminals that are disposed to be exposed at a side surface of the recess and that supply electric power to the resistance heating element.