公开(公告)号：US11456328B2

公开(公告)日：2022-09-27

申请号：US16597762

申请日：2019-10-09

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Sing-Chung Hu

IPC: H01L27/146 ,  H01L31/024 ,  H01L23/467

Abstract: Image sensors include a pixel die that is stacked on a logic die. The logic die includes at least one function logic element disposed on a bond side thereof, and a logic oxide array of raised logic oxide features also disposed on the bond side. The pixel die includes a pixel array disposed on a light receiving side thereof, and a pixel oxide array of raised pixel oxide features disposed on a bond side of the pixel die. A plurality of outer bonds is disposed between an outer region of the logic die and an outer region of the pixel die. A plurality of inner bonds is formed at an inner region of the image sensor between the pixel oxide array and the logic oxide array, the inner bonds being spaced apart by a plurality of fluidly connected air gaps that extend between the logic die and the pixel die.

公开(公告)号：US11435452B2

公开(公告)日：2022-09-06

申请号：US16267162

申请日：2019-02-04

Applicant: OmniVision Technologies, Inc.

Inventor： Eric A. G. Webster

IPC: G01S7/4865 ,  G01S7/481 ,  G01S7/497 ,  G01S17/42 ,  G01S17/89 ,  G01S17/00

Abstract: A time-of-flight (TOF) pixel includes a semiconductor material and a photogate disposed proximate to a frontside of the semiconductor material. The photogate is positioned to transfer charge in the semiconductor material toward the frontside in response to a voltage applied to the photogate. A floating diffusion is disposed in the semiconductor material proximate to the frontside of the semiconductor material, and one or more virtual phase implants is disposed in the semiconductor material proximate to the frontside of the semiconductor material. At least one of the one or more virtual phase implants extend laterally from under the photogate to the floating diffusion to transfer the charge to the floating diffusion.

公开(公告)号：US20220278148A1

公开(公告)日：2022-09-01

申请号：US17187396

申请日：2021-02-26

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Qin Wang

IPC: H01L27/146

Abstract: A pixel circuit includes a trench etched into a front side surface of a semiconductor substrate. The trench includes a bottom surface etched along a crystalline plane and a tilted side surface etched along a crystalline plane that extends between the bottom surface and the front side surface. A floating diffusion is disposed in the semiconductor substrate beneath the bottom surface of the trench. A photodiode is disposed in the semiconductor substrate beneath the tilted side surface of the trench and is separated from the floating diffusion. The photodiode is configured to photogenerate image charge in response to incident light. A tilted transfer gate is disposed over at least a portion of the bottom surface and at least a portion of the tilted side surface of the trench. The tilted transfer gate is configured to transfer the image charge from the photodiode to the floating diffusion.

公开(公告)号：US11431936B2

公开(公告)日：2022-08-30

申请号：US16854765

申请日：2020-04-21

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Lihang Fan ,  Min Qu ,  Yu-Shen Yang ,  Charles Qingle Wu

IPC: H03M1/12 ,  H04N5/378 ,  H03M7/16 ,  H03M1/56 ,  H03K19/21 ,  H03K19/20

Abstract: A readout circuit for use in an image sensor includes a plurality of comparators. Each one of the plurality of comparators is coupled to receive a ramp signal and a respective analog image data signal from a respective one of a plurality of column bit lines to generate a respective comparator output. Each one of a plurality of arithmetic logic units (ALUs) is coupled to receive phase-aligned Gray code (GC) outputs generated by a GC generator. Each one of the plurality of ALUs is further coupled to a respective one of the plurality of comparators to receive the respective comparator output. Each one of the plurality of ALUs is coupled to latch the phase-aligned GC outputs in response to the respective comparator output to generate a respective digital image data signal.

公开(公告)号：US20220269482A1

公开(公告)日：2022-08-25

申请号：US17180520

申请日：2021-02-19

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Lihang Fan ,  Min Qu ,  Chao-Fang Tsai ,  Chun-Hsiang Chang

IPC: G06F7/507 ,  G06F7/575

Abstract: An arithmetic logic unit (ALU) includes a front end latch stage coupled to latch Gray code (GC) outputs of a GC generator in response to a comparator output. A signal latch stage is coupled to latch outputs of the front end latch stage. A GC to binary stage is coupled to generate a binary representation of the GC outputs latched in the signal latch stage. First inputs of an adder stage are coupled to receive outputs of the GC to binary stage. Outputs of the adder stage are generated in response to the first inputs and second inputs of the adder stage. A pre-latch stage is coupled to latch outputs of the adder stage. A feedback latch stage is coupled to latch outputs of the pre-latch stage. The second inputs of the adder stage are coupled to receive outputs of the feedback latch stage.

公开(公告)号：US20220247943A1

公开(公告)日：2022-08-04

申请号：US17167768

申请日：2021-02-04

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Zhiyong Zhan ,  Tongtong Yu ,  Zheng Yang ,  Wei Deng

IPC: H04N5/353 ,  H04N5/33 ,  H04N5/3745

Abstract: An imaging system includes a pixel array configured to generate image charge voltage signals in response to incident light received from an external scene. An infrared illumination source is deactivated during the capture of a first image of the external scene and activated during the capture of a second image of the external scene. An array of sample and hold circuits is coupled to the pixel array. Each sample and hold circuit is coupled to a respective pixel of the pixel array and includes first and second capacitors to store first and second image charge voltage signals of the captured first and second images, respectively. A column voltage domain differential amplifier is coupled to the first and second capacitors to determine a difference between the first and second image charge voltage signals to identify an object in a foreground of the external scene.

公开(公告)号：US20220239840A1

公开(公告)日：2022-07-28

申请号：US17576816

申请日：2022-01-14

Applicant: OmniVision Technologies, Inc.

Inventor： Victor Lenchenkov ,  Andreas Suess

IPC: H04N5/232 ,  H04N9/04 ,  G02B5/18 ,  G02B7/28 ,  G02B5/20 ,  H01L27/146

Abstract: An image sensor has diffractive microlenses over pixels with central structures and ring(s) of material having index of refraction different from that of background material. Disposed beneath the diffractive microlenses are photodiodes that permit determining ratios of illumination of peripheral photodiodes to illumination of central photodiodes of the pixels, and, in embodiments, circuitry for determining said ratio. In embodiments, the ratio is used to find illumination wavelengths; and in other embodiments the ratio is used to determine focus of an imaging lens providing illumination. A method determines color by passing light through a diffractive lens disposed above photodiodes of the diffractive pixel and determining color from illumination peripheral and central photodiodes. An autofocus method of determining focus includes passing light through a diffractive lens and determining focus from illumination of peripheral photodiodes and central photodiodes of the pixel. In embodiments, the central structures are disks and rings are round.

公开(公告)号：US20220230011A1

公开(公告)日：2022-07-21

申请号：US17150827

申请日：2021-01-15

Applicant: OmniVision Technologies, Inc.

Inventor： Tsung-Wei WAN ,  Wei-Ping CHEN ,  Jau-Jan DENG ,  Kuang-ju WANG

IPC: G06K9/00 ,  G02B3/00 ,  G02B5/00

Abstract: A multiple-lens optical fingerprint reader for reading fingerprints through a display has an image sensor integrated circuit with photosensor array(s); a spacer; and multiple lenses in a microlens array, each lens of multiple lenses focuses light arriving at that lens from a finger adjacent the display through the spacer to form an image on associated photosensors on a photosensor array of the integrated circuit. A method of verifying identity of a user includes illuminating a finger of the user with an OLED display; focusing light from the fingerprint through arrayed microlenses onto a photosensor array of an integrated circuit, reading the array to overlapping electronic fingerprint images; extracting features from the overlapping electronic fingerprint images or from a stitched fingerprint image, and comparing the features to features of at least one user in a library of features and associated with one or more fingers of one or more authorized users.

公开(公告)号：US11362124B2

公开(公告)日：2022-06-14

申请号：US16777193

申请日：2020-01-30

Applicant: OmniVision Technologies, Inc.

Inventor： Alireza Bonakdar ,  Zhiqiang Lin ,  Bill Phan ,  Badrinath Padmanabhan

IPC: H01L27/14 ,  H01L27/146

Abstract: An image sensor with quantum efficiency enhanced by inverted pyramids includes a semiconductor substrate and a plurality of microlenses. The semiconductor substrate includes an array of pixels. Each of the pixels is configured to convert light incident on the pixel to an electrical output signal, the semiconductor substrate having a top surface for receiving the light. The top surface forms a plurality of inverted pyramids in each pixel. The plurality of microlenses are disposed above the top surface and aligned to the plurality of inverted pyramids, respectively.

公开(公告)号：US11362121B2

公开(公告)日：2022-06-14

申请号：US16775022

申请日：2020-01-28

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Hui Zang ,  Yuanliang Liu

IPC: H01L27/146

Abstract: An image sensor includes a substrate having a plurality of small photodiodes and a plurality of large photodiodes surrounding the small photodiodes. The substrate further includes a plurality of deep trench isolation structures in regions of the substrate between ones of the small photodiodes and the large photodiodes. Each of large photodiodes having a full well capacity larger than each of the small photodiodes. The image sensor further includes an array of color filters disposed over the substrate, a first and second buffer layer disposed between the substrate and the array of color filters, metal grid structures disposed between the color filters and above the first buffer layer, and an attenuation layer portion above a region of the substrate between ones of the large and small photodiodes, the attenuation layer portion is between the first and second buffer layers and normal to an upper surface of the substrate.