Abstract:
An integrated circuit includes first and second pads that are electrically connected to a circuit inside the integrated circuit. The circuit performs multiple functions which may be selected. A function identification circuit, inside the integrated circuit, is electrically connected to the first and second pads. The function identification circuit operates in multiple modes, wherein each operating mode corresponds to a function performed by the circuit. The function of the circuit may thereby be identified using fewer pads which may allow a reduction in the cost of the integrated circuit.
Abstract:
An internal power supply circuit for use in a semiconductor device includes a clamp circuit for clamping an internal voltage to a constant level. The clamped internal voltage is distributed to internal circuits of the semiconductor device through an output node. When the internal voltage rises momentarily due to noise in the internal power supply circuit due to open-circuit phenomenon, the rising internal voltage is discharged through the clamp circuit, thereby maintaining the internal voltage at a constant value. The clamp circuit includes a first transistor for discharging the output node, and a diode-connected transistor for generating a charge voltage at the gate of the first transistor. The threshold voltage of the diode-connected transistor is preferably equal to or lower than the threshold voltage of the first transistor.
Abstract:
An internal voltage conversion circuit for a DRAM wherein a voltage level of an internal power supply is regulated by an external signal applied to the DRAM pins after packaging to perform reliability tests. The internal voltage conversion circuit includes a test mode signal generator, for generating a test mode signal by combining first control signals applied externally of the semiconductor device, and a switching signal generator, for generating first and second switching signals according to second control signals applied externally of the DRAM when the test mode signal is active. First and second switching resistor portions connected in series between the internal power supply port and a ground potential are switched by the first and second switching signals, respectively, so that their resistance values are changed. The resistor portions are in a feedback path connected to one input of a comparator. The other input is connected to a reference cell. The internal voltage supply varies responsive to changes in resistance values.
Abstract:
A mobile System on Chip (SoC) comprises a microprocessor and a first memory controller configured to control a refresh of a first memory. A temperature sensor detects a temperature in the first memory. When first temperature information received from the temperature sensor indicates that the detected temperature deviates from a predetermined temperature range, the first memory controller controls the first memory so as not to perform a self refresh. When second temperature information received from the temperature sensor indicates that the detected temperature is in the predetermined temperature range, the first memory controller outputs a self refresh command to the first memory.
Abstract:
A semiconductor memory device includes a voltage level selection unit configured to output a plurality of voltage level selection signals according to a fuse program in response to a self-refresh command signal and a reference voltage generator configured to receive a reference voltage and output a target reference voltage having a different voltage level depending on a normal mode or a self-refresh mode in response to the voltage level selection signals.
Abstract:
A semiconductor device comprises a plurality of banks, a plurality of control circuits, and a plurality of temperature sensors, wherein each of the plurality of temperature sensors is disposed near at least one of the plurality of banks for sensing the temperature of the area surrounding the at least one of the plurality of banks and for outputting a sense signal corresponding to a sensed temperature, and each of the plurality of control circuits outputs at least one control signal, for controlling an operation of the at least one of the plurality of banks, to the at least one of the plurality of banks based on the sense signal.
Abstract:
In a method of inputting/outputting data in a semiconductor memory device, first data and second data are buffered and outputted to a first output node and a second output node, respectively, in a normal mode. In a test mode, the first data is buffered through a first transmission line and a second transmission line and outputted to the first output node and the second output node in response to at least one control signal. Also, in the test mode, the second data is buffered through the first transmission line and the second transmission line and outputted to the first output node and the second output node in response to the at least one control signal. Accordingly, test time may be reduced, and variations of operation characteristics caused by merging the data pins may also be reduced.
Abstract:
A bit line sense amplifier and method thereof are provided. The example bit line sense amplifier may include a sense amplifying circuit coupled between a first bit line and a second bit line. The sense amplifying circuit may be configured to amplify a voltage difference between the first bit line and the second bit line. The example bit line sense amplifier may further include a power supply voltage providing circuit configured to provide a first power supply voltage and a second power supply voltage to the sense amplifying circuit in response to first and second bit line sensing control signals. The bit line sense amplifier may further include a bit line voltage compensation circuit configured to prevent a voltage-reduction at the first bit line and the second bit line for a delay period, the delay period including at least a period of time after a pre-charging of the first and second bit lines, in response to one or more of the first and second bit line sensing control signals.
Abstract:
A semiconductor memory device and a write control circuit which may detect write failures and a write control method for the same are provided. The semiconductor memory device may include a memory cell array, a bit line amplifier, a switch unit, and a write driver. Exemplary embodiments of the semiconductor memory device, according to the present invention, may determine the activation timing of the column select line signal using a clock enable signal and a mode register set signal, without synchronizing with a master clock signal.
Abstract:
The invention relates to a method and apparatus for controlling a high voltage generator during wafer burn-in. The method includes generating an enable signal for enabling a high voltage generator responsive to a mode signal, e.g., a wafer burn-in test mode. The method provides an external voltage to a semiconductor memory device through a pad responsive to the enable signal. The method varies a high voltage level being output from the high voltage generator in response to a reference voltage level.