公开(公告)号：US08580594B2

公开(公告)日：2013-11-12

申请号：US13206014

申请日：2011-08-09

Applicant: Hsin-Ting Huang ,  Jung-Huei Peng ,  Shang-Ying Tsai ,  Yao-Te Huang ,  Ming-Tung Wu ,  Ping-Yin Liu ,  Xin-Hua Huang ,  Yuan-Chih Hsieh

Inventor： Hsin-Ting Huang ,  Jung-Huei Peng ,  Shang-Ying Tsai ,  Yao-Te Huang ,  Ming-Tung Wu ,  Ping-Yin Liu ,  Xin-Hua Huang ,  Yuan-Chih Hsieh

IPC: H01L21/02

CPC classification number: B81C1/00777 ,  B81B2207/07 ,  B81C1/00896 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01L2224/03001 ,  H01L2224/03009 ,  H01L2224/04042 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/83805 ,  H01L2224/85375 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/16235 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552

Abstract: The present disclosure provides a method including providing a first substrate; and forming a microelectromechanical system (MEMS) device on a first surface of the first substrate. A bond pad is formed on at least one bonding site on the first surface of the first substrate. The bonding site is recessed from the first surface. Thus, a top surface of the bond pad may lie below the plane of the top surface of the substrate. A device with recessed connective element(s) (e.g., bond pad) is also described. In further embodiments, a protective layer is formed on the recessed connective element during dicing of a substrate.

Abstract translation: 本公开提供了一种方法，包括提供第一基板; 以及在所述第一基板的第一表面上形成微机电系统（MEMS）装置。 在第一基板的第一表面上的至少一个结合部位上形成接合焊盘。 接合部位从第一表面凹陷。 因此，接合焊盘的顶表面可以位于衬底的顶表面的平面之下。 还描述了具有凹入的连接元件（例如，接合焊盘）的器件。 在另外的实施例中，在衬底切割期间，在凹入的连接元件上形成保护层。

公开(公告)号：US20130285180A1

公开(公告)日：2013-10-31

申请号：US13458812

申请日：2012-04-27

Applicant: Tzu-Jui Wang ,  Szu-Ying Chen ,  Jen-Cheng Liu ,  Dun-Nian Yaung ,  Ping-Yin Liu ,  Lan-Lin Chao

Inventor： Tzu-Jui Wang ,  Szu-Ying Chen ,  Jen-Cheng Liu ,  Dun-Nian Yaung ,  Ping-Yin Liu ,  Lan-Lin Chao

IPC: H01L31/0232 ,  H01L27/146 ,  H01L31/18

CPC classification number: H01L27/14683 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/1469 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A backside illuminated image sensor comprises a photodiode and a first transistor located in a first chip, wherein the first transistor is electrically coupled to the photodiode. The backside illuminated image sensor further comprises a second transistor formed in a second chip and a plurality of logic circuits formed in a third chip, wherein the second chip is stacked on the first chip and the third chip is stacked on the second chip. The logic circuit, the second transistor and the first transistor are coupled to each other through a plurality of boding pads and through vias.

Abstract translation: 背面照明图像传感器包括光电二极管和位于第一芯片中的第一晶体管，其中第一晶体管电耦合到光电二极管。 背面照明图像传感器还包括形成在第二芯片中的第二晶体管和形成在第三芯片中的多个逻辑电路，其中第二芯片堆叠在第一芯片上，第三芯片堆叠在第二芯片上。 逻辑电路，第二晶体管和第一晶体管通过多个焊盘和通孔彼此耦合。

公开(公告)号：US20130284885A1

公开(公告)日：2013-10-31

申请号：US13457637

申请日：2012-04-27

Applicant: Szu-Ying Chen ,  Ping-Yin Liu ,  Calvin Yi-Ping Chao ,  Tzu-Jui Wang ,  Jen-Cheng Liu ,  Dun-Nian Yaung ,  Lan-Lin Chao

Inventor： Szu-Ying Chen ,  Ping-Yin Liu ,  Calvin Yi-Ping Chao ,  Tzu-Jui Wang ,  Jen-Cheng Liu ,  Dun-Nian Yaung ,  Lan-Lin Chao

IPC: H01L27/146

CPC classification number: H01L27/1469 ,  H01L25/16 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond bad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding between the sensor and the ASIC.

Abstract translation: 公开了用于封装具有专用集成电路（ASIC）的背面照明（BSI）图像传感器或传感器装置的方法和装置。 根据实施例，传感器设备可以与ASIC面对面地结合在一起，而不使用载体晶片，其中传感器的相应接合焊盘与ASIC的接合焊盘对准并且结合在一起，以一对一 一个时尚。 传感器的像素列可以共享由共享的金属间线路连接不良的键。 接合焊盘可以具有不同的尺寸并且被配置成不同的行以彼此不相交。 可以添加附加的虚拟焊盘以增加传感器和ASIC之间的接合。

公开(公告)号：US08446210B2

公开(公告)日：2013-05-21

申请号：US13082072

申请日：2011-04-07

Applicant: Kai-Yin Liu

Inventor： Kai-Yin Liu

IPC: H01H37/76 ,  G01R31/07

CPC classification number: H01H37/761

Abstract: An electronic fuse system includes: a pad, an electronic fuse circuit, a first switch circuit, and a control circuit. The pad is used for receiving a reference voltage. The electronic fuse circuit is used for changing a voltage level when a current signal passes. The first switch circuit is coupled between the pad and the electronic fuse circuit, for controlling the first switch circuit to be disabled or enabled according to a switch control signal. The control circuit, coupled to the first switch circuit is for transferring the switch control signal according a control signal and a lock signal.

Abstract translation: 电子熔断器系统包括：焊盘，电子熔丝电路，第一开关电路和控制电路。 该焊盘用于接收参考电压。 电子熔丝电路用于当电流信号通过时改变电压电平。 第一开关电路耦合在焊盘和电子熔丝电路之间，用于根据开关控制信号控制第一开关电路被禁用或使能。 耦合到第一开关电路的控制电路用于根据控制信号和锁定信号传送开关控制信号。

公开(公告)号：US20130071489A1

公开(公告)日：2013-03-21

申请号：US13637040

申请日：2011-03-25

Applicant: Michael Graeber ,  Christian Loesche ,  Philip Freidenreich ,  Yin Liu ,  Matthew James Leoni

Inventor： Michael Graeber ,  Christian Loesche ,  Philip Freidenreich ,  Yin Liu ,  Matthew James Leoni

IPC: A61K31/498 ,  A61K33/24 ,  A61P17/00

CPC classification number: A61K31/498 ,  A61K9/0014 ,  A61K9/06 ,  A61K31/194 ,  A61K45/06

Abstract: Improved methods and compositions for safe and effective treatment of erythema or a symptom associated with erythema in a subject are described. The methods involve topically applying to an affected skin area a topical composition comprising about 0.3% to about 10% by weight of brimonidine and a pharmaceutically acceptable carrier.

公开(公告)号：US08332763B2

公开(公告)日：2012-12-11

申请号：US12481143

申请日：2009-06-09

Applicant: Jiajun Zhang ,  Yin Liu ,  Shenhua Gu

Inventor： Jiajun Zhang ,  Yin Liu ,  Shenhua Gu

IPC: G06F3/00 ,  G06F3/048

CPC classification number: G06F17/30893

Abstract: Methods, systems, and computer-readable media that allow a user to select and add subsections of multiple websites to a single aggregated website that will automatically retrieve updated content corresponding to the selected subsection are provided. The content from the selected subsections may be displayed on the aggregated website. The aggregated website will periodically check a source website and update the content displayed on the aggregated site if the source website has been updated. The application generating the source website determines which subsection of the updated website corresponds with the subsection originally selected for display by comparing the document object model (“DOM”) for both the updated web page and the original version of the web page at the time the subsection selection was made by the user. Condensed DOM trees may be generated for the updated web page and the original version of the web page, prior to comparing the two DOM trees.

Abstract translation: 提供允许用户选择和添加多个网站的子部分到单个聚合网站的方法，系统和计算机可读介质，其将自动检索对应于所选择的子部分的更新的内容。 所选子段的内容可能会显示在聚合网站上。 如果源网站已更新，聚合网站将定期检查源网站并更新聚合网站上显示的内容。 生成源网站的应用程序通过在分区选择时比较用于更新的网页和网页的原始版本的文档对象模型（DOM）来确定更新的网站的哪个子部分与最初被选择用于显示的部分相对应 是由用户做的 在比较两个DOM树之前，可以为更新的网页和网页的原始版本生成缩写的DOM树。

公开(公告)号：US20120294228A1

公开(公告)日：2012-11-22

申请号：US13574008

申请日：2010-02-11

Applicant: Xinghua Song ,  Jiansong Gan ,  Yin Liu ,  Yu Qian ,  Jianfeng Wang

Inventor： Xinghua Song ,  Jiansong Gan ,  Yin Liu ,  Yu Qian ,  Jianfeng Wang

IPC: H04W72/04 ,  H04W72/08 ,  H04W36/00

CPC classification number: H04W88/04 ,  H04W72/04

Abstract: This invention is related to the link adaptation for the downlink transmission in type-II relay network. An method in an eNodeB for adapting link for downlink transmission in type-II relay network, said type-II relay network comprises the eNodeB, one or more relay nodes and a plurality of User Equipments (UE), the method comprises the steps of: classifying the plurality of UEs into two groups: macro-UEs which are served directly by the eNodeB without the help of the one or more relay nodes, and relay-UEs which are served by the eNodeB and the one or more relay nodes; and adapting link for the macro-UEs and the relay-UEs separately.

Abstract translation: 本发明涉及在II型中继网络中下行链路传输的链路自适应。 一种用于适应II型中继网络中下行链路传输的链路的eNodeB中的一种方法，所述II型中继网络包括eNodeB，一个或多个中继节点和多个用户设备（UE），该方法包括以下步骤： 将所述多个UE分为两组：由所述eNodeB直接服务而不经所述一个或多个中继节点的帮助的所述宏UE以及由所述eNodeB和所述一个或多个中继节点服务的中继UE; 以及分别为宏UE和中继UE适配链路。

公开(公告)号：US20120229940A1

公开(公告)日：2012-09-13

申请号：US13401865

申请日：2012-02-22

Applicant: Chien-Ming Wu ,  Kai-Yin Liu

Inventor： Chien-Ming Wu ,  Kai-Yin Liu

IPC: H02H9/04

CPC classification number: H02H9/046

Abstract: The present invention provides an integrated circuit having a better ESD protection capability and capable of reducing a circuit layout area. The integrated circuit comprises: an internal circuit, a first pad, and at least a first impedance matching unit. The first impedance matching unit is coupled between the internal circuit and the first pad, and the first impedance matching unit comprises: a first switch unit and a first resistance unit. The first switch unit is coupled to the internal circuit, and the first resistance unit is coupled between the first switch unit and the first pad, wherein the first resistance unit has a first terminal and a second terminal. The first terminal is directly electrically connected to the first pad and the second terminal is coupled to the first switch unit.

Abstract translation: 本发明提供一种具有更好的ESD保护能力并能够减少电路布局面积的集成电路。 集成电路包括：内部电路，第一焊盘和至少第一阻抗匹配单元。 第一阻抗匹配单元耦合在内部电路和第一焊盘之间，第一阻抗匹配单元包括：第一开关单元和第一电阻单元。 第一开关单元耦合到内部电路，并且第一电阻单元耦合在第一开关单元和第一焊盘之间，其中第一电阻单元具有第一端子和第二端子。 第一端子直接电连接到第一焊盘，第二端子耦合到第一开关单元。

公开(公告)号：US20120195226A1

公开(公告)日：2012-08-02

申请号：US13502374

申请日：2009-10-19

Applicant: Yin Liu ,  Jiansong Gan ,  Peter Moberg ,  Yu Qian ,  Zhang Zhang

Inventor： Yin Liu ,  Jiansong Gan ,  Peter Moberg ,  Yu Qian ,  Zhang Zhang

IPC: H04W24/00

CPC classification number: H04L1/0026 ,  H04B7/15528 ,  H04L1/0035 ,  H04L2001/0097 ,  H04W28/0236 ,  H04W40/16

Abstract: Method and arrangement in a base station for adjusting a channel quality indicator value of a wireless transmission between the base station and a user equipment. The base station, the user equipment and a relay node are comprised in a multi-hop wireless communication system and adapted to intercommunicate in a first transmission mode and a second transmission mode. The method comprises sending a radio signal to be received by the user equipment, obtaining a measurement of the channel quality indicator value, determining if the transmission mode of the sent radio signal is different from the transmission mode of the obtained channel quality indicator value measurement, and adding a channel quality indicator offset value to the channel quality indicator value, if the transmission mode of the relay node is determined to be the first transmission mode while the channel quality indicator was measured and obtained in the second transmission mode.

Abstract translation: 基站中用于调整基站与用户设备之间的无线传输的信道质量指标值的方法和装置。 基站，用户设备和中继节点包括在多跳无线通信系统中，并且适于以第一传输模式和第二传输模式相互通信。 该方法包括发送由用户设备接收的无线电信号，获得信道质量指示符值的测量值，确定所发送的无线电信号的传输模式是否与获得的信道质量指标值测量的传输模式不同， 以及如果在所述第二传输模式中测量和获得所述信道质量指示符的情况下确定所述中继节点的传输模式被确定为所述第一传输模式，则向所述信道质量指示符值添加信道质量指示符偏移值。

公开(公告)号：US20120149152A1

公开(公告)日：2012-06-14

申请号：US12966756

申请日：2010-12-13

Applicant: Shang-Ying Tsai ,  Jung-Huei Peng ,  Hsin-Ting Huang ,  Hung-Hua Lin ,  Ming-Tung Wu ,  Ping-Yin Liu ,  Yao-Te Huang ,  Yuan-Chih Hsieh

Inventor： Shang-Ying Tsai ,  Jung-Huei Peng ,  Hsin-Ting Huang ,  Hung-Hua Lin ,  Ming-Tung Wu ,  Ping-Yin Liu ,  Yao-Te Huang ,  Yuan-Chih Hsieh

IPC: H01L21/50

CPC classification number: B81C1/00333 ,  B81B2207/07 ,  B81C1/00825 ,  B81C2201/053 ,  B81C2203/0109 ,  H01L2924/16235

Abstract: The present disclosure provide a method of manufacturing a microelectronic device. The method includes forming a bonding pad on a first substrate; forming wiring pads on the first substrate; forming a protection material layer on the first substrate, on sidewalls and top surfaces of the wiring pads, and on sidewalls of the bonding pad, such that a top surface of the bonding pad is at least partially exposed; bonding the first substrate to a second substrate through the bonding pad; opening the second substrate to expose the wiring pads; and removing the protection material layer.

Abstract translation: 本公开提供了一种制造微电子器件的方法。 该方法包括在第一基板上形成接合焊盘; 在所述第一基板上形成布线焊盘; 在所述第一基板上，在所述布线焊盘的侧壁和顶表面上以及所述焊盘的侧壁上形成保护材料层，使得所述焊盘的顶表面至少部分地露出; 通过接合焊盘将第一衬底接合到第二衬底; 打开第二基板以露出布线垫; 并去除保护材料层。