摘要:
Multilayer structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. Selectivity of deposition is obtained via a multi-cell controllable mask. Alternatively, net selective deposition is obtained via a blanket deposition and a selective removal of material via a multi-cell mask. Individual cells of the mask may contain electrodes comprising depositable material or electrodes capable of receiving etched material from a substrate. Alternatively, individual cells may include passages that allow or inhibit ion flow between a substrate and an external electrode and that include electrodes or other control elements that can be used to selectively allow or inhibit ion flow and thus inhibit significant deposition or etching. Single cell masks having a cell size that is smaller or equal to the desired deposition resolution may also be used to form structures.
摘要:
A method of and apparatus for slicing a three-dimensional object representation into a plurality of layer representations is described, wherein the layer representations are subsequently used to form the object layer-by-layer according to the principles of stereolithography. If not already provided in the object representation, a plurality of layer boundary representations are first formed, and then the boolean difference of successive layer boundary representations are computed to derive boundaries of up and down-facing regions, enabling different cure parameters to be specified for these different regions.
摘要:
Embodiments are directed to micro-scale or meso-scale hydraulically or pneumatically actuated devices, methods for forming such devices using multi-layer, multi-material electrochemical fabrication methods and particularly fabricating (i.e. building up) a plurality of components of devices that are moveable relative to one another in pre-assembled configurations wherein special features are designed into the devices (e.g. wide gaps in fabrication positions and narrowed gaps in working regions of component movement, mechanisms that inhibit the return of device components to fabrication positions after being moved into working regions, used of cylindrical interference and/or checkerboard bushings, etching holes in selected locations to allow removal of sacrificial material) to allow such fabrication to occur without violating intra-layer minimum feature size constraints while still obtaining effective gaps between components that are smaller than the minimum features size limits. Particular applications of such devices involve medical applications and in particular minimally invasive procedures where devices would be moved into a desired working area within a body of a patient via a lumen and then actuated while at the working location.
摘要:
Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.
摘要:
Electrochemical Fabrication techniques are used to modify substrates or to form multilayer structures (e.g. components or devices) from a plurality of overlaying and adhered layers. Masks are used to selectively etch or deposit material. Some masks may be of the contact type and may be formed of multiple materials some of which may be support materials, some of which may be mating materials for contacting a substrate and some may be intermediate materials. In some embodiments the contact masks may have conformable contact surfaces (i.e. surfaces with sufficient flexibility or deformability that they can substantially conform to surface of the substrate to form a seal with it) or they may have semi-rigid or even rigid surfaces. In embodiments where masks are used for selective deposition operations, etching operations may be performed after deposition to remove flash deposits (thin undesired deposits from areas that were intended to be masked).
摘要:
A method of and apparatus for slicing a three-dimensional object representation into a plurality of layer representations is described, wherein the layer representations are subsequently used to form the object layer-by-layer according to the principles of stereolithography. If not already provided in the object representation, a plurality of layer boundary representations are first formed, and then the boolean difference of successive layer boundary representations are computed to derive boundaries of up and down-facing regions, enabling different cure parameters to be specified for these different regions.
摘要:
Improved apparatus and methods for forming a layer of material over a surface of a previously-formed cross-section of a three-dimensional object in anticipation of forming a next cross-section of the object out of the layer. A volume of material, including at least some excess material, is placed over the surface, and the excess material is swept off by placing the excess material in the predetermined path of a sweeping member, the path being substantially in a plane spaced from a working surface of material. The member may be directed to sweep the excess material away through a successive number of sweeps, which may vary for each cross-section, at least a velocity which may vary for each sweep. Additionally, the clearance between the member and the surface of the previous cross-section may vary for each sweep. A "winged" member is also provided, comprising two legs extending from a base, and a "Trident" embodiment is also provided, comprising three legs extending from a base.
摘要:
An electrochemical fabrication process produces three-dimensional structures (e.g. components or devices) from a plurality of layers of deposited materials wherein the formation of at least some portions of some layers are produced by operations that remove material or condition selected surfaces of a deposited material. In some embodiments, removal or conditioning operations are varied between layers or between different portions of a layer such that different surface qualities are obtained. In other embodiments varying surface quality may be obtained without varying removal or conditioning operations but instead by relying on differential interaction between removal or conditioning operations and different materials encountered by these operations.
摘要:
Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.
摘要:
Electrochemical Fabrication techniques are used to modify substrates or to form multilayer structures (e.g. components or devices) from a plurality of overlaying and adhered layers. Masks are used to selectively etch or deposit material. Some masks may be of the contact type and may be formed of multiple materials some of which may be support materials, some of which may be mating materials for contacting a substrate and some may be intermediate materials. In some embodiments the contact masks may have conformable contact surfaces (i.e. surfaces with sufficient flexibility or deformability that they can substantially conform to surface of the substrate to form a seal with it) or they may have semi-rigid or even rigid surfaces. In embodiments where masks are used for selective deposition operations, etching operations may be performed after deposition to remove flash deposits (thin undesired deposits from areas that were intended to be masked).