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71.发明申请公开(公告)号：US20170087355A1
公开(公告)日：2017-03-30
申请号：US15375235
申请日：2016-12-12
申请人： Greatbatch Ltd.
IPC分类号： A61N1/08 , H01R13/7195 , H01G4/40 , A61N1/375 , H03H1/00 , H03H7/01 , H05K1/18 , A61N1/37 , H05K5/00 , H01G4/35
CPC分类号： A61N1/08 , A61N1/086 , A61N1/3718 , A61N1/375 , A61N1/3754 , A61N2001/086 , H01G4/06 , H01G4/35 , H01G4/40 , H01R13/7195 , H03H1/0007 , H03H7/1766 , H03H2001/0042 , H03H2001/0085 , H05K1/181 , H05K5/0095 , H05K9/00 , H05K2201/10015
摘要： An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the capacitor. A ground path electrically extends between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises a conductive pin electrically and mechanically connected to the ferrule by a third gold braze. The ground path comprises an internal ground plate disposed within the circuit board substrate, and the internal ground plate is electrically connected to both the conductive pin and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.
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72.发明授权Multilayer planar spiral inductor filter for medical therapeutic or diagnostic applications 有权用于医疗或诊断应用的多层平面螺旋电感滤波器公开(公告)号：US09468750B2
公开(公告)日：2016-10-18
申请号：US13958604
申请日：2013-08-04
申请人： Greatbatch Ltd.
CPC分类号： A61N1/05 , A61N1/086 , A61N1/3718 , H01F17/02 , H03H1/0007
摘要： A multilayer helical wave filter having a primary resonance at a selected RF diagnostic or therapeutic frequency or frequency range, includes an elongated conductor forming at least a portion of an implantable medical lead. The elongated conductor includes a first helically wound segment having at least one planar surface, a first end and a second end, which forms a first inductive component, and a second helically wound segment having at least one planar surface, a first end and a second end, which forms a second inductive element. The first and second helically wound segments are wound in the same longitudinal direction and share a common longitudinal axis. Planar surfaces of the helically wound segments face one another, and a dielectric material is disposed between the facing planar surfaces of the helically wound segments and between adjacent coils of the helically wound segments, thereby forming a capacitance.
摘要翻译： 在选定的RF诊断或治疗频率或频率范围内具有初级共振的多层螺旋波滤波器包括形成可植入医疗引线的至少一部分的细长导体。 细长导体包括具有至少一个平坦表面的第一螺旋缠绕段，形成第一感应组件的第一端和第二端，以及具有至少一个平坦表面的第二螺旋缠绕段，第一端和第二端 端部，其形成第二电感元件。 第一和第二螺旋缠绕段在相同的纵向缠绕并共享共同的纵向轴线。 螺旋缠绕段的平面表面彼此面对，并且电介质材料设置在螺旋缠绕段的相对的平坦表面之间和螺旋缠绕段的相邻线圈之间，从而形成电容。
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73.发明申请EMI FILTERED CO-CONNECTED HERMETIC FEEDTHROUGH, FEEDTHROUGH CAPACITOR AND LEADWIRE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE 审中-公开电磁干扰过滤共同连接的传播途径，有源可插拔医疗设备的有用电容器和引线组件公开(公告)号：US20160263384A1
公开(公告)日：2016-09-15
申请号：US15164945
申请日：2016-05-26
申请人： Greatbatch Ltd.
IPC分类号： A61N1/375 , H01G4/35 , H01G4/40 , A61N1/05 , H05K1/09 , H05K5/06 , H05K1/03 , H05K3/40 , H01G4/12 , H05K1/11
CPC分类号： A61N1/3754 , A61N1/05 , A61N1/0551 , A61N1/0563 , A61N1/08 , A61N1/372 , A61N1/375 , C22C29/12 , C22C32/0015 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/35 , H01G4/40 , H01R43/00 , H05K1/0306 , H05K1/09 , H05K1/095 , H05K1/115 , H05K3/4038 , H05K3/4061 , H05K5/066 , Y10T156/1052
摘要： A hermetically sealed feedthrough filter assembly is attachable to an active implantable medical device and includes an insulator substrate assembly and a feedthrough filter capacitor disposed on a device side. A conductive leadwire has a proximal leadwire end extending to a distal leadwire end, wherein the proximal leadwire end is connectable to electronics internal to the AIMD. The distal leadwire end is disposed at least partially through a first passageway of the feedthrough filter capacitor and is in contact with, adjacent to or near a device side conductive fill. A first electrically conductive material makes a three-way electrically connection that electrically connects the device side conductive fill to an internal metallization of the feedthrough filter capacitor and to the distal leadwire end. A second electrically conductive material electrically connects an external metallization of the feedthrough filter capacitor to a ferrule or an AIMD housing.
摘要翻译： 密封的馈通过滤器组件可附接到有源可植入医疗装置，并且包括设置在装置侧的绝缘体基底组件和馈通滤波电容器。 导电引线具有延伸到远端引线端的近端引线端，其中近端引线端可连接到AIMD内部的电子装置。 远端引线端部至少部分地设置穿过馈通滤波电容器的第一通道，并与器件侧导电填充物接触，邻近或附近。 第一导电材料形成电气连接器件侧导电填充物与馈通滤波电容器的内部金属化以及远端导线端的三路电连接。 第二导电材料将馈通滤波电容器的外部金属化电连接到套圈或AIMD壳体。
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74.发明授权公开(公告)号：US08868189B2
公开(公告)日：2014-10-21
申请号：US13873832
申请日：2013-04-30
申请人： Greatbatch Ltd.
IPC分类号： H05K9/00 , A61N1/375 , A61N1/37 , H01G4/35 , H01G4/40 , H01R13/7195 , H03H1/00 , A61N1/08 , H03H7/01
CPC分类号： A61N1/08 , A61N1/086 , A61N1/3718 , A61N1/375 , A61N1/3754 , A61N2001/086 , H01G4/06 , H01G4/35 , H01G4/40 , H01R13/7195 , H03H1/0007 , H03H7/1766 , H03H2001/0042 , H03H2001/0085 , H05K1/181 , H05K5/0095 , H05K9/00 , H05K2201/10015
摘要： A shielded three-terminal flat-through EMI/energy dissipating filter includes an active electrode plate through which a circuit current passes between a first terminal and a second terminal, a first shield plate on a first side of the active electrode plate, and a second shield plate on a second side of the active electrode plate opposite the first shield plate. The first and second shield plates are conductively coupled to a grounded third terminal. In preferred embodiments, the active electrode plate and the shield plates are at least partially disposed with a hybrid flat-through substrate that may include a flex cable section, a rigid cable section, or both.
摘要翻译： 屏蔽三端子平通EMI /消能滤波器包括有源电极板，电路电流通过该有源电极板在第一端子和第二端子之间通过，第一屏蔽板位于有源电极板的第一侧上，第二屏蔽板 屏蔽板在与第一屏蔽板相对的有源电极板的第二侧上。 第一和第二屏蔽板导电地耦合到接地的第三端子。 在优选实施例中，有源电极板和屏蔽板至少部分地布置有可以包括柔性电缆部分，刚性电缆部分或两者的混合平整基板。
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75.发明申请MULTILAYER HELICAL WAVE FILTER FOR MEDICAL THERAPEUTIC OR DIAGNOSTIC APPLICATIONS 有权用于医疗治疗或诊断应用的多层螺旋形滤波器公开(公告)号：US20130338747A1
公开(公告)日：2013-12-19
申请号：US13958604
申请日：2013-08-04
申请人： Greatbatch Ltd.
IPC分类号： A61N1/05
CPC分类号： A61N1/05 , A61N1/086 , A61N1/3718 , H01F17/02 , H03H1/0007
摘要： A multilayer helical wave filter having a primary resonance at a selected RF diagnostic or therapeutic frequency or frequency range, includes an elongated conductor forming at least a portion of an implantable medical lead. The elongated conductor includes a first helically wound segment having at least one planar surface, a first end and a second end, which forms a first inductive component, and a second helically wound segment having at least one planar surface, a first end and a second end, which forms a second inductive element. The first and second helically wound segments are wound in the same longitudinal direction and share a common longitudinal axis. Planar surfaces of the helically wound segments face one another, and a dielectric material is disposed between the facing planar surfaces of the helically wound segments and between adjacent coils of the helically wound segments, thereby forming a capacitance.
摘要翻译： 在选定的RF诊断或治疗频率或频率范围内具有初级共振的多层螺旋波滤波器包括形成可植入医疗引线的至少一部分的细长导体。 细长导体包括具有至少一个平坦表面的第一螺旋缠绕段，形成第一感应组件的第一端和第二端，以及具有至少一个平坦表面的第二螺旋缠绕段，第一端和第二端 端部，其形成第二电感元件。 第一和第二螺旋缠绕段在相同的纵向缠绕并共享共同的纵向轴线。 螺旋缠绕段的平面表面彼此面对，并且电介质材料设置在螺旋缠绕段的相对的平坦表面之间和螺旋缠绕段的相邻线圈之间，从而形成电容。
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公开(公告)号：US08577453B1
公开(公告)日：2013-11-05
申请号：US13946595
申请日：2013-07-19
申请人： Greatbatch Ltd.
IPC分类号： A61N1/05
CPC分类号： A61N1/05 , A61B5/04 , A61B5/0428 , A61B5/7203 , A61B2562/18 , A61M5/14276 , A61M5/172 , A61N1/086 , A61N1/37 , A61N1/3754
摘要： A header block is configured to be attachable to an implantable medical device. The header block includes a header block body and a connection port disposed in the header block body configured to receive an implantable lead. A conductor is disposed in the header block body electrically coupled to the connection port at a first end and connectable at a second end to the implantable medical device. An impeding device is electrically coupled in series along the length of the conductor and disposed within the header block body. The impeding device is configured to raise the high-frequency impedance of the conductor. The impeding device may include a bandstop filter or an L-C tank circuit.
摘要翻译： 标题块被配置为可附接到可植入医疗装置。 标题块包括标题块主体和设置在头部块主体中的配置为接收可植入引线的连接端口。 导体被布置在头部块体中，第一端部电耦合到连接端口，并且在第二端处可连接到可植入医疗装置。 阻碍装置沿着导体的长度串联电耦合并设置在集管块体内。 阻碍装置被配置为提高导体的高频阻抗。 阻碍装置可以包括带阻滤波器或L-C槽电路。
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公开(公告)号：US12064639B2
公开(公告)日：2024-08-20
申请号：US17165500
申请日：2021-02-02
申请人： Greatbatch Ltd.
发明人： Robert A. Stevenson , Christine A. Frysz , Keith W. Seitz , Brian P Hohl , Marc Gregory Martino
CPC分类号： A61N1/3754 , H01G4/008 , H01G4/1209 , H01G4/236 , H01G4/35
摘要： A feedthrough for an AIMD includes a ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A circuit board disposed adjacent to the insulator device side has a ground plate or ground trace electrically connected to a circuit board ground conductive pathway disposed in a circuit board ground via hole. An anisotropic conductive layer disposed between the circuit board and the insulator device side has an electrically insulative matrix supporting a plurality of electrically conductive particles. The anisotropic conductive layer has a first thickness where at least one first electrically conductive particle is longitudinally aligned and in electrical contact with the ferrule and the circuit board ground conductive pathway electrically connected to the at least one circuit board ground plate or ground trace. The anisotropic conductive layer has a second, greater thickness where the ferrule and the circuit board ground conductive pathway are not longitudinally aligned, and no electrically conductive particles are in electrical contact with the ferrule and the circuit board ground conductive pathway.
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公开(公告)号：US12017065B2
公开(公告)日：2024-06-25
申请号：US17315895
申请日：2021-05-10
申请人： Greatbatch Ltd.
CPC分类号： A61N1/08 , A61N1/3718 , A61N1/375 , A61N1/3754 , C22C14/00 , H05K5/06 , A61N1/086 , A61N1/37512 , A61N1/3758 , C22C5/02 , H01G4/35 , H05K9/0064
摘要： A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant coating layer that is disposed on the device side surface of the hermetic seal ferrule over which an optional ECA stripe may be provided. The optional ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyamide, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free coating layer may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof. As used herein, the oxide-free coating layer is not limiting and as will be taught, in addition to sputtering, there are many other methods of applying a proud oxide-free surface on either an AIMD ferrule or an AIMD housing.
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79.发明公开公开(公告)号：US20240039206A1
公开(公告)日：2024-02-01
申请号：US18376687
申请日：2023-10-04
申请人： Greatbatch Ltd.
IPC分类号： H01R13/52 , H01R13/719 , H01R13/426 , H01G4/35 , A61N1/375
CPC分类号： H01R13/5224 , H01R13/719 , H01R13/426 , H01G4/35 , H01R13/521 , A61N1/3754 , Y10T29/49204
摘要： A circuit board for an active implantable medical device (AIMD) has a circuit board land connected to at least one electrical circuit. A hermetic feedthrough terminal pin connector for the AIMD includes an electrical insulator hermetically sealed to an opening of an electrically conductive ferrule. A terminal pin of the feedthrough extends outwardly beyond the insulator. A terminal pin connector has an electrically conductive connector housing that is connected to the circuit board land by an electrical connection material. At least one electrically conductive prong supported by the connector housing contacts and compresses against the feedthrough terminal pin to thereby make a removable electrical connection between the circuit board and the terminal pin. An insulative material loaded with electrically insulative nanoparticles coats at least a portion of the sidewall of the connector housing and the electrical connection material connecting the connector housing to the circuit board land.
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公开(公告)号：US11712571B2
公开(公告)日：2023-08-01
申请号：US17171418
申请日：2021-02-09
申请人： Greatbatch Ltd.
CPC分类号： A61N1/3754 , A61N1/378 , H01R4/58 , H01R13/26 , H01R13/5221 , H01R13/5224 , A61N1/37512 , H01R2201/12 , H03H2001/0014 , H03H2001/0021 , H03H2001/0042
摘要： A feedthrough for an AIMD is described. The feedthrough includes an electrically conductive ferrule having a ferrule sidewall defining a ferrule opening. The ferrule sidewall has a height. At least one recessed pocket has a depth extending part-way through the height of the ferrule. An oxide-resistant pocket-pad is nested in the recessed pocket. An electrical connection material is supported on the pocket-pad for making an oxide-resistant electrical connection to the ferrule. An insulator is hermetically sealed to the ferrule in the ferrule opening. At least one active via hole extends through the insulator with an active conductive pathway residing in and hermetically sealed to the insulator in the active via hole.
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