公开(公告)号：US07592238B2

公开(公告)日：2009-09-22

申请号：US11106648

申请日：2005-04-15

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

IPC分类号： H01L21/78 ,  H01L21/82

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

公开(公告)号：US20090135425A1

公开(公告)日：2009-05-28

申请号：US12293267

申请日：2007-02-15

申请人： Naoki Uchiyama

发明人： Naoki Uchiyama

IPC分类号： G01N21/77

CPC分类号： G01N21/77 ,  G01M3/20 ,  G01M3/38 ,  G01N21/55 ,  G01N21/59

摘要： In a hydrogen gas detection device, light emitted from a light source is irradiated onto a hydrogen sensor whose reflectance (optical reflectance) varies upon contact with hydrogen gas, and the light transmitted through the hydrogen sensor or reflected by a reflective film of the hydrogen sensor is received by an optical sensor. On the basis of the signal output from the optical sensor and indicative of the amount of light received, the hydrogen gas detection device detects leakage of hydrogen gas.

摘要翻译： 在氢气检测装置中，将从光源射出的光照射到与氢气接触时反射率（光反射率）变化的氢传感器，透过氢传感器的光或氢传感器的反射膜反射的光 被光学传感器接收。 基于从光学传感器输出的信号并指示接收的光量，氢气检测装置检测氢气的泄漏。

公开(公告)号：US20070125757A1

公开(公告)日：2007-06-07

申请号：US10548412

申请日：2003-03-12

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

IPC分类号： B23K26/38

CPC分类号： C03B33/091 ,  B23K26/0604 ,  B23K26/0624 ,  B23K26/40 ,  B23K26/53 ,  B23K26/60 ,  B23K2101/40 ,  B23K2103/50 ,  B28D1/221 ,  B28D5/0011 ,  C03B33/023 ,  Y02P40/57

摘要： A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line to cut 5. Thereafter, the object 1 is irradiated with laser light L2 absorbable by the object 1 along the line to cut 5, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line to cut 5. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line to cut 5.

摘要翻译： 提供了一种能够沿着切割线精密切割待处理物体的激光加工方法。 通过多光子吸收形成的改质区域7沿着切割线5在待处理物体1内形成切割开始区域8。 此后，对象物1照射由物体1沿着切割线5吸收的激光L 2，从作为起点的切割起始区域8产生裂缝24，由此能够精确地切割物体1 沿线切割5。 扩大其固定物体1的可膨胀膜19将各个芯片25彼此分开，这可以进一步提高沿着切割线5切割物体1的可靠性。

公开(公告)号：US20070084726A1

公开(公告)日：2007-04-19

申请号：US11581553

申请日：2006-10-16

申请人： Naoki Uchiyama ,  Hiroyuki Matsumoto

发明人： Naoki Uchiyama ,  Hiroyuki Matsumoto

IPC分类号： G01N27/26

CPC分类号： G01N21/77 ,  G01N2021/7773 ,  Y10T436/175383 ,  Y10T436/22

摘要： A hydrogen gas visualization device comprises a hydrogen sensor having a thin film layer formed on the surface of a substrate and a catalyst layer formed on the surface of the thin film layer which, when contacted by hydrogen gas contained in an atmosphere, hydrogenates the thin film layer and thereby changes the optical reflectance of the thin film layer, and one or more sensor faces provided with the hydrogen sensor. The hydrogen gas visualization device visualizes, on the sensor faces, the distribution of hydrogen gas contained in the atmosphere contacting the hydrogen sensor and thereby visualizes the existence and flow of the hydrogen gas.

摘要翻译： 氢气可视化装置包括具有在基板表面上形成的薄膜层的氢传感器和形成在薄膜层表面上的催化剂层，当与大气中包含的氢气接触时，将薄膜 从而改变薄膜层的光学反射率和设置有氢传感器的一个或多个传感器面。 氢气可视化装置在传感器面上显示了与氢传感器接触的气氛中所含的氢气的分布，从而使氢气的存在和流动显现。

公开(公告)号：US20060160331A1

公开(公告)日：2006-07-20

申请号：US11106645

申请日：2005-04-15

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

公开(公告)号：US20060121697A1

公开(公告)日：2006-06-08

申请号：US11332228

申请日：2006-01-17

申请人： Yoshimaro Fujii ,  Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama

发明人： Yoshimaro Fujii ,  Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  B23K26/0057 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B23K2203/50 ,  B28D5/00 ,  B28D5/0011 ,  H01L21/268 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/6836 ,  H01L21/76894 ,  H01L23/544 ,  H01L23/562 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2223/5446 ,  H01L2924/00 ,  H01L2924/0002

摘要： A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.

摘要翻译： 一种衬底分割方法，其可以在防止发生破裂和破裂的同时使衬底细分割。 该基板分割方法包括以下步骤：将具有形成有功能元件19的正面3的半导体基板1照射在基板内，同时将聚光点定位在基板内，从而形成包含熔融处理区域的改质区域 在半导体衬底1内进行多光子吸收，并且使包含熔融处理区域的改性区域形成切割起点区域; 在形成用于切割的起点区域的步骤之后，研磨半导体衬底1的后表面21，使得半导体衬底1达到预定厚度。

公开(公告)号：US06992026B2

公开(公告)日：2006-01-31

申请号：US10385696

申请日：2003-03-12

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC分类号： H01L21/36 ,  G06F17/00

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

公开(公告)号：US6099537A

公开(公告)日：2000-08-08

申请号：US805556

申请日：1997-02-25

申请人： Toshiya Sugai ,  Hiroyuki Nagamizu ,  Minoru Tsuruta ,  Yoshihito Shimizu ,  Toshihiko Suzuta ,  Norikiyo Shibata ,  Shinichi Nishigaki ,  Naoki Uchiyama ,  Yoshinao Oaki

发明人： Toshiya Sugai ,  Hiroyuki Nagamizu ,  Minoru Tsuruta ,  Yoshihito Shimizu ,  Toshihiko Suzuta ,  Norikiyo Shibata ,  Shinichi Nishigaki ,  Naoki Uchiyama ,  Yoshinao Oaki

IPC分类号： A61B17/00 ,  A61B17/068 ,  A61B17/072 ,  A61B17/115 ,  A61B17/122 ,  A61B17/128 ,  A61B17/10

CPC分类号： A61B17/0684 ,  A61B17/07207 ,  A61B17/115 ,  A61B17/122 ,  A61B17/1285 ,  A61B17/1155 ,  A61B17/1227 ,  A61B2017/00464

摘要： A medical treatment instrument is provided with a treatment section for treating issue, an insertion section which has at one end the treatment section, and an operating section which is provided at the other end of the insertion section, operates the treatment section, and has a fixed portion and a movable portion. The treatment section is actuated by pivoting the movable portion with respect to the fixed portion. The medical treatment instrument is further provided with an actuating main body and a cover. The cover is displaceable between a first position in which the medical treatment instrument is used and a second position in which the inside of the operating section is uncovered.

摘要翻译： 医疗器具具有处理问题的处理部，具有一端处理部的插入部和设置在插入部的另一端的操作部，操作处理部，具有 固定部分和可移动部分。 处理部通过相对于固定部枢转可动部而被致动。 医疗器具还具有致动主体和盖子。 盖子可以在其中使用医疗器械的第一位置和操作部分的内部未被覆盖的第二位置之间移动。

公开(公告)号：US5954929A

公开(公告)日：1999-09-21

申请号：US738660

申请日：1996-10-30

申请人： Naoki Uchiyama ,  Munenori Mashima ,  Makoto Kinoshita ,  Yorishige Hashimoto

发明人： Naoki Uchiyama ,  Munenori Mashima ,  Makoto Kinoshita ,  Yorishige Hashimoto

IPC分类号： C23C14/56 ,  C23C14/04 ,  C23C30/00 ,  G11B5/85 ,  G11B7/26 ,  C23C14/00

CPC分类号： C23C14/042 ,  G11B7/26

摘要： A deposition-preventing part, particularly a masking tool, which is used over an area to be protected from adhesion of a physical vapor deposition film, for physical vapor deposition apparatuses which are used to form physical vapor deposition films of metals, particularly noble metals, on CD-ROM, CD-R or CD-E substrates. One or more of a solder-plated Cu wire, a solder-plated Cu foil tape, an Al foil tape and a synthetic resin tape are attached, in a peelable manner, on a solder film formed on the surface of the substrate of a deposition-preventing part such as a masking tool, which has a surface roughness of 0.01-1 .mu.m when expressed as the arithmetic mean roughness defined according to JIS B 0601, a thickness of 5-100 .mu.m and a melting point of 100-450.degree. C.

摘要翻译： 在用于形成金属，特别是贵金属的物理气相沉积膜的物理气相沉积装置中，在要被保护的物理气相沉积膜的粘附区域上使用的防沉积部分，特别是掩模工具， 在CD-ROM，CD-R或CD-E底物上。 将一个或多个焊料镀覆的Cu线，焊料镀覆的Cu箔带，Al箔带和合成树脂带以可剥离的方式附着在形成在沉积基板的表面上的焊料膜上 当表示为根据JIS B 0601定义的算术平均粗糙度时，其表面粗糙度为0.01-1μm的掩模工具，其厚度为5-100μm，熔点为100-450 DEG C.

公开(公告)号：US5876325A

公开(公告)日：1999-03-02

申请号：US940613

申请日：1997-09-30

申请人： Hitoshi Mizuno ,  Yuuichi Ikeda ,  Akihiro Horii ,  Shuichi Takayama ,  Akio Nakada ,  Naoki Uchiyama ,  Yasuhiro Ueda ,  Koichi Umeyama ,  Sakae Takehana

发明人： Hitoshi Mizuno ,  Yuuichi Ikeda ,  Akihiro Horii ,  Shuichi Takayama ,  Akio Nakada ,  Naoki Uchiyama ,  Yasuhiro Ueda ,  Koichi Umeyama ,  Sakae Takehana

IPC分类号： A61B1/00 ,  A61B1/04 ,  A61B19/00

CPC分类号： A61B1/00193 ,  A61B1/00048 ,  A61B1/00149 ,  A61B1/00188 ,  A61B34/30 ,  A61B34/37 ,  A61B34/74 ,  A61B1/042 ,  A61B2034/301 ,  A61B2034/742 ,  A61B2090/502 ,  A61B2090/506 ,  G05B2219/39442

摘要： A surgical manipulator system comprising at least one surgical manipulator, at least one guide, a detector, and a drive controller. The surgical manipulator has a surgical device for performing a desired operation. The guide guides the surgical device. The detector detects a position and/or orientation relationship between the surgical device and the guide, and/or a position and/or orientation relationship between the surgical device and another surgical device. The drive controller controls the surgical manipulator such that the surgical device is guided by the guide.

摘要翻译： 一种手术操纵器系统，包括至少一个手术操纵器，至少一个引导件，检测器和驱动器控制器。 手术操纵器具有用于执行所需操作的手术装置。 引导件引导手术装置。 检测器检测手术装置和引导件之间的位置和/或取向关系，和/或手术装置与另一手术装置之间的位置和/或取向关系。 驱动器控制器控制手术操纵器，使得外科装置由引导件引导。