Abstract:
Detection logic of a memory subsystem obtains a threshold for a memory device that indicates a number of accesses within a time window that causes risk of data corruption on a physically adjacent row. The detection logic obtains the threshold from a register that stores configuration information for the memory device, and can be a register on the memory device itself and/or can be an entry of a configuration storage device of a memory module to which the memory device belongs. The detection logic determines whether a number of accesses to a row of the memory device exceeds the threshold. In response to detecting the number of accesses exceeds the threshold, the detection logic can generate a trigger to cause the memory device to perform a refresh targeted to a physically adjacent victim row.
Abstract:
A register not connected to a data bus is read by transferring data across an address bus to a device connected to the data bus, from which the data is read by a device connected to the data bus. The register resides in a register device connected via the address bus to a memory device that is connected to both the address bus and the data bus. A host processor triggers the register device to transfer information over the address bus to a register on the memory device. The host processor then reads the information from the register of the memory device.
Abstract:
A memory chip is described. The memory chip includes storage cells along a row of the memory chip's storage cell array to store a count value of the row's activations and error correction code (ECC) information to protect the count value. The memory chip includes ECC read logic circuitry to correct an error in the count value. The memory chip includes a comparator to compare the count value against a threshold. The memory chip includes circuitry to increment the count value if the count value is deemed not to have reached the threshold and ECC write logic circuitry to determine new ECC information for the incremented count value, and write driver circuitry to write the incremented count value and the new ECC information into the storage cells. The memory chip includes circuitry to cause the row to be refreshed if the count value is deemed to have reached the threshold.
Abstract:
A memory device that performs internal ECC (error checking and correction) can treat an N-bit channel as two N/2-bit channels for application of ECC. The memory device includes a memory array to store data and prefetches data bits and error checking and correction (ECC) bits from the memory array for a memory access operation. The memory device includes internal ECC hardware to apply ECC, with a first group of a first half the data bits checked by a first half of the ECC bits in parallel with a second group of a second half of the data bits checked by a second half of the ECC bits.
Abstract:
A memory subsystem includes a command address bus capable to be operated at double data rate. A memory circuit includes N command signal lines that operate at a data rate of 2R to receive command information from a memory controller. The memory circuit includes 2N command signal lines that operate at a data rate of R to transfer the commands to one or more memory devices. While ratios of 1:2 are specified, similar techniques can be used to send command signals at higher data rates over fewer signal lines from a host to a logic circuit, which then transfers the command signals at lower data rates over more signal lines.
Abstract:
Devices, systems, and methods include an active mode to accommodate read/write operations of a memory device and a self-refresh mode to accommodate recharging of voltage levels representing stored data when read/write operations are idle. At least one register source provides a first voltage level and a second voltage level that is less than the first voltage level. With such a configuration, during the active mode, the memory device operates at the first voltage level as provided by the at least one register source, and during the self-refresh mode, the memory device operates at the second voltage level as provided by the at least one register source.
Abstract:
A memory controller issues a targeted refresh command. A specific row of a memory device can be the target of repeated accesses. When the row is accessed repeatedly within a time threshold (also referred to as “hammered” or a “row hammer event”), physically adjacent row (a “victim” row) may experience data corruption. The memory controller receives an indication of a row hammer event, identifies the row associated with the row hammer event, and sends one or more commands to the memory device to cause the memory device to perform a targeted refresh that will refresh the victim row.
Abstract:
Described herein are a method and an apparatus for dynamically switching between one or more finite termination impedance value settings to a memory input-output (I/O) interface of a memory in response to a termination signal level. The method comprises: setting a first termination impedance value setting for a termination unit of an input-output (I/O) interface of a memory; assigning the first termination impedance value setting to the termination unit when the memory is not being accessed; and switching from the first termination impedance value setting to a second termination impedance value setting in response to a termination signal level.
Abstract:
A memory subsystem includes a group of memory devices connected to an address bus. The memory subsystem includes logic to uniquely map a physical address of a memory access command to each memory device of the group. Thus, each physical address sent by an associated memory controller uniquely accesses a different row of each memory device, instead of being mapped to the same or corresponding row of each memory device.
Abstract:
Techniques and mechanisms to provide selective access to data error information by a memory controller. In an embodiment, a memory device stores a first value representing a baseline number of data errors determined prior to operation of the memory device with the memory controller. Error detection logic of the memory device determines a current count of data errors, and calculates a second value representing a difference between the count of data errors and the baseline number of data errors. The memory device provides the second value to the memory controller, which is unable to identify that the second value is a relative error count. In another embodiment, the memory controller is restricted from retrieving the baseline number of data errors.