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公开(公告)号：US09042098B2
公开(公告)日：2015-05-26
申请号：US13674207
申请日：2012-11-12
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: F28F9/00 , H05K7/20781
Abstract: A cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.
Abstract translation: 提供了一种用于电子机架的冷却装置，其包括在机架的入口或空气出口侧处联接到电子机架的门组件。 门组件包括：气流开口，其构造成便于通过安装到机架的门组件通过电子机架进入或流出气流; 空气冷却剂热交换器，其布置成使得通过气流开口的气流穿过空气 - 冷却剂热交换器，空气 - 冷却剂热交换器被配置为从通过其的气流中提取热量; 以及蒸汽冷凝器，其被配置为便于从电子机架的至少一个浸没冷却的电子部件部分出口的介电流体蒸气的冷凝。 包括门组件的冷却装置有助于电子机架的不同电子部件的空气冷却和浸没冷却。
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公开(公告)号：US09009968B2
公开(公告)日：2015-04-21
申请号：US13705283
申请日：2012-12-05
Applicant: International Business Machines Corporation
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Eric J. McKeever , Robert E. Simons
IPC: H05K7/20
CPC classification number: H05K7/20272 , H05K7/2079 , Y10T29/4935 , Y10T29/49389
Abstract: A cooling method is provided which includes providing a cooling apparatus that includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.
Abstract translation: 提供了一种冷却方法，其包括提供冷却装置，冷却装置包括连接到一个或多个电子部件，一个或多个冷却剂管道和一个或多个冷却剂歧管的一个或多个冷却剂冷却结构。 冷却剂冷却结构包括一个或多个冷却剂输送通道，并且冷却剂歧管包括一个或多个可旋转的歧管段。 一个冷却剂管道将相应的可旋转歧管部分和相应冷却剂冷却结构的冷却剂输送通道流体连通地连接。 相应的可旋转歧管部分可相对于冷却剂歧管的另一部分旋转，以便于将冷却剂冷却结构与其相关联的电子部件分离，同时保持冷却剂冷却结构与相应的可旋转歧管部分流体连通，通过一个冷却剂管道 ，其在一个实施例中是基本刚性的冷却剂导管。
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公开(公告)号：US08966922B2
公开(公告)日：2015-03-03
申请号：US13676198
申请日：2012-11-14
Applicant: International Business Machines Corporation
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: H05K7/20136 , H05K7/20209 , H05K7/203 , H05K7/20745 , H05K7/20781
Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.
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74.发明授权Immersion-cooling of selected electronic component(s) mounted to printed circuit board 有权对安装在印刷电路板上的所选择的电子部件进行浸入式冷却公开(公告)号：US08934250B2
公开(公告)日：2015-01-13
申请号：US13627216
申请日：2012-09-26
Applicant: International Business Machines Corporation
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC: H05K7/20 , H01L23/473
CPC classification number: H05K7/20 , H05K7/20236 , H05K7/20772 , Y10T29/49117
Abstract: Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling apparatus includes a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.
Abstract translation: 提供了冷却装置和方法，用于对诸如多节架架的节点或书的电子系统的所选择的电子部件进行抽吸浸没冷却。 冷却装置包括围绕要冷却的部件限定隔室的壳体组件，该组件联接到印刷电路板的第一侧。 组件包括具有开口尺寸以容纳部件的第一框架和第二框架。 第一和第二框架分别经由第一粘合剂层和第二粘合剂层密封到板的相对侧。 印刷电路板至少部分地多孔于冷却剂流过隔间，并且第一框架，第二框架和第一和第二粘合剂层相对于冷却剂是无孔的，并且提供冷却剂密封到 印刷电路板的第一和第二面。
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公开(公告)号：US08879257B2
公开(公告)日：2014-11-04
申请号：US13692177
申请日：2012-12-03
Applicant: International Business Machines Corporation
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC: H05K7/20
CPC classification number: H05K7/20627 , H05K7/20772 , H05K7/20836
Abstract: A method is provided for facilitating powering and cooling of one or more electronics racks. The method includes: providing a frame; associating at least one bulk power assembly with the frame, the at least one bulk power assembly being configured to provide power to the electronics rack(s), wherein the frame with the associated one or more bulk power assemblies is distinct from the electronics rack(s); and associating one or more heat exchange assemblies with the frame, the heat exchange assembly(ies) being configured to cool system coolant provided to the electronics rack(s). In operation, heat is transferred by the heat exchange assembly(ies) from the system coolant to a facility coolant, and the frame with the associated bulk power assembly(ies) and associated heat exchange assembly(ies) provides both power and cooling to the electronics rack(s).
Abstract translation: 提供了一种用于促进一个或多个电子机架的供电和冷却的方法。 该方法包括：提供帧; 将至少一个体积动力组件与所述框架相关联，所述至少一个体积动力组件被配置为向所述电子机架提供动力，其中具有相关联的一个或多个体积动力组件的所述框架不同于所述电子机架 s）; 以及将一个或多个热交换组件与所述框架相关联，所述热交换组件被配置为冷却提供给所述电子机架的系统冷却剂。 在操作中，热量由热交换器组件从系统冷却剂传送到设备冷却剂，并且具有相关联的主体动力组件和相关联的热交换组件的框架提供功率和冷却功能 电子机架。
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Patent Agency Ranking
公开(公告)号：US08720063B2
公开(公告)日：2014-05-13
申请号：US13692196
申请日：2012-12-03
Applicant: International Business Machines Corporation
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madnusudan K. Iyengar , Robert E. Simons , Prabjit Singh
CPC classification number: H05K7/20 , H01L23/367 , H01L23/373 , H01L23/3736 , H01L23/4006 , H01L23/427 , H01L23/473 , H01L2023/4087 , H01L2224/16 , Y10T29/49002 , Y10T29/4935 , Y10T29/49353
Abstract: A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.
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公开(公告)号：US10734307B2
公开(公告)日：2020-08-04
申请号：US16251177
申请日：2019-01-18
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Milnes P. David , Dustin W. Demetriou , Michael J. Ellsworth, Jr. , Roger R. Schmidt , Robert E. Simons
IPC: H01L23/473 , B29C43/18 , B29C43/20 , H01L23/427 , H05K7/20 , B29C70/84 , B29C70/88 , B29L9/00 , H01L23/367 , H01L23/40 , B29K101/12 , B29K705/00 , B29L31/34
Abstract: Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.
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公开(公告)号：US10287925B2
公开(公告)日：2019-05-14
申请号：US15249703
申请日：2016-08-29
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Milnes P. David , Dustin W. Demetriou , Roger R. Schmidt , Robert E. Simons
Abstract: Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.
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公开(公告)号：US10082048B2
公开(公告)日：2018-09-25
申请号：US15249718
申请日：2016-08-29
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Milnes P. David , Dustin W. Demetriou , Roger R. Schmidt , Robert E. Simons
CPC classification number: F01K25/08 , F01K5/00 , F25B15/00 , F25B19/00 , F25B27/02 , F25B49/00 , H02P9/04 , H05K7/20709 , H05K7/20818 , H05K7/20836
Abstract: Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.
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公开(公告)号：US09949412B2
公开(公告)日：2018-04-17
申请号：US14922324
申请日：2015-10-26
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Milnes P. David , Dustin W. Demetriou , Michael J. Ellsworth, Jr. , Roger R. Schmidt , Robert E. Simons
CPC classification number: H05K7/20836 , H05K7/20436 , H05K7/20545 , H05K7/20709 , H05K7/20727 , H05K7/20754 , H05K7/20818
Abstract: A method of providing a cooling apparatus for cooling a heat-dissipating component(s) of an electronics enclosure includes: providing a thermal conductor to couple to the heat-dissipating component(s), the thermal conductor including a first conductor portion coupled to the heat-dissipating component, and a second conductor portion to position along an air inlet side of the electronics enclosure, so that in operation, the first conductor portion transfers heat from the component(s) to the second conductor portion; coupling at least one air-cooled heat sink to the second conductor portion to facilitate transfer of heat to airflow ingressing into the enclosure; providing at least one thermoelectric device coupled to the first or second conductor portion to facilitate providing active auxiliary cooling to the thermal conductor; and providing a controller to control operation of the thermoelectric device(s) and to selectively switch operation of the cooling apparatus between active and passive cooling modes.
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