公开(公告)号：US10160072B2

公开(公告)日：2018-12-25

申请号：US14922338

申请日：2015-10-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Dylan J. Boday ,  Levi A. Campbell ,  Milnes P. David ,  Dustin W. Demetriou ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Prabjit Singh ,  Jason T. Wertz

IPC: B23P15/26 ,  H05K7/20

Abstract: A method of fabricating a liquid-cooled heat sink assembly, including: providing a heat transfer element including a heat transfer base having opposite first and second sides, and a plurality of thermally conductive fins extending from the first side of the heat transfer base, the second side of the heat transfer base to couple to a component(s) to be cooled; providing a coolant-carrying structure including a coolant-carrying base and a coolant-carrying compartment through which liquid coolant flows, the coolant-carrying base including a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins of the heat sink base to extend through; and attaching the heat transfer element and coolant-carrying structure together with the plurality of thermally conductive fins extending through the fin-receiving openings in the coolant-carrying base into the coolant-carrying compartment.

公开(公告)号：US09968006B2

公开(公告)日：2018-05-08

申请号：US14831073

申请日：2015-08-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Christopher R. Ciraulo ,  Milnes P. David ,  Dustin W. Demetriou ,  Robert K. Mullady ,  Roger R. Schmidt

IPC: H05K7/20 ,  F04D25/14

CPC classification number: H05K7/20727 ,  F04D25/14 ,  H05K7/20181 ,  H05K7/2019

Abstract: Apparatuses and methods are provided for locking an air-moving assembly within a chassis when in operational state. The apparatus includes a locking louver assembly having a louver(s) and locking mechanism. The louver(s) is disposed at an air inlet or outlet of the air-moving assembly, and pivots between operational and quiesced orientations, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The locking mechanism includes a keying element(s) affixed to the louver(s) to pivot therewith, which includes an elongated key(s) oriented in a first direction when the louver(s) is in operational orientation, and a second direction when in quiesced orientation. A key-receiving element(s) is associated with the chassis and includes a key opening(s) which receives and accommodates movement of the elongated key(s) between the first and second directions, and prevents removal of the air-moving assembly from the chassis with the key(s) oriented in the first direction.

公开(公告)号：US09861010B2

公开(公告)日：2018-01-02

申请号：US14499402

申请日：2014-09-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Christopher R. Ciraulo ,  Milnes P. David ,  Dustin W. Demetriou ,  Robert K. Mullady ,  Roger R. Schmidt

IPC: H05K7/20

CPC classification number: H05K7/20727 ,  H05K7/20181

Abstract: Apparatuses and methods are provided for blocking removal of an air-moving assembly from a chassis when in operational state. The apparatus includes a protective louver assembly having a louver(s) and an interlock element(s). The louver(s) is disposed at an air inlet or an air outlet of the air-moving assembly, and pivots between an operational and a quiesced orientation, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The interlock element(s) is associated with the louver(s) to pivot with the louver(s) between the operational orientation and the quiesced orientation. In the operational orientation, the interlock element(s) blocks, at least in part, access to at least one fastener securing the air-moving assembly within the chassis, and thereby prevents removal of the air-moving assembly from the chassis when in the operational state.

公开(公告)号：US20170131045A1

公开(公告)日：2017-05-11

申请号：US15007242

申请日：2016-01-27

Applicant: International Business Machines Corporation

Inventor： Bjorn J. Ahbel ,  Wiren D. Becker ,  Marc H. Coq ,  Milnes P. David ,  Ryan N. Elsasser ,  Syed F. Hossain

IPC: F28F13/08

CPC classification number: F28F3/06 ,  F28D9/0087 ,  F28F13/08 ,  F28F27/02 ,  F28F2215/14 ,  F28F2240/00 ,  H01L23/34 ,  H01L23/3672

Abstract: A heat sink structure is provided having fins mechanically altered dynamically to change and optimize the heat sink's performance based on certain environmental conditions. Specifically, the shape of fins of the heat sink structure is dynamically altered in response to environmental conditions that indicate the need for increased thermal performance by spreading the fins through a mechanical device dynamically, or by collapsing the fins to reduce pressure drop across a region when increased thermal performance is not needed.

公开(公告)号：US09623520B2

公开(公告)日：2017-04-18

申请号：US14105691

申请日：2013-12-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC: B23P15/26 ,  H05K7/20 ,  G06F1/20 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  F28D15/02

CPC classification number: B23P15/26 ,  F28D15/0266 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/2029 ,  H05K7/20772 ,  Y10T29/4935

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

公开(公告)号：US09622379B1

公开(公告)日：2017-04-11

申请号：US14926035

申请日：2015-10-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Milnes P. David ,  Dustin W. Demetriou ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20781 ,  H05K7/20127 ,  H05K7/20236 ,  H05K7/203 ,  H05K7/20318 ,  H05K7/2039 ,  H05K7/20772 ,  H05K7/20809

Abstract: Cooling apparatuses and methods of fabrication are provided which facilitate immersion-cooling of an electronic component(s). The cooling apparatus includes a drawer-level enclosure sized to reside within an electronics rack. The drawer-level enclosure includes a compartment which accommodates one or more electronic components to be cooled. A dielectric fluid is disposed within the compartment. The dielectric fluid includes a liquid dielectric which at least partially immerses the electronic component(s) within the compartment(s). A hinged, liquid-cooled heat sink is also disposed within the compartment of the enclosure. The heat sink operatively facilitates cooling the one or more electronic components via the dielectric fluid within the compartment, and is rotatable between an operational position overlying the electronic component(s), and a service position which allows access to the electronic component(s).

公开(公告)号：US09462729B1

公开(公告)日：2016-10-04

申请号：US14955275

申请日：2015-12-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Milnes P. David ,  Dustin W. Demetriou ,  Michael J. Ellsworth, Jr.

IPC: E04B1/70 ,  E04F17/00 ,  H05K7/20 ,  F24F11/00

CPC classification number: H05K7/20745 ,  F24F2011/0002 ,  F24F2011/0006

Abstract: Tile assemblies are provided having first and second tile sections and an airflow control mechanism. The first tile section allows, in a cold air cooling mode, cold air from a cold air plenum of a data center to flow into a cold air containment aisle for supply to an electronics rack(s). The second tile section is associated with the first tile section to allow, in a failover cooling mode, ambient air external the cold air plenum to flow, via an air pathway through the second and first tile sections into the containment aisle. The airflow control mechanism is disposed within the air pathway to block cold air from the cold air plenum from passing through the second tile section in the cold air cooling mode, and to allow, in the failover cooling mode, ambient air to pass through the air pathway into the cold air containment aisle.

Abstract translation: 提供具有第一和第二瓦片部分和气流控制机构的瓦片组件。 第一瓦片部分允许在冷空气冷却模式下，来自数据中心的冷气室的冷空气流入冷空气容纳通道以供应到电子机架。 第二瓦片部分与第一瓦片部分相关联，以允许在故障切换冷却模式中，冷空气通风室外部的环境空气经由穿过第二和第一瓦片区段的空气路径流入容纳通道。 气流控制机构设置在空气通路内以阻挡来自冷空气通风室的冷空气以冷空气冷却模式通过第二瓦片部分，并且在故障切换冷却模式中允许环境空气通过空气 通道进入冷空气遏制通道。

公开(公告)号：US09420721B2

公开(公告)日：2016-08-16

申请号：US14828775

申请日：2015-08-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Milnes P. David ,  Dustin W. Demetriou ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20 ,  H01L23/34 ,  H01L23/473

CPC classification number: H05K7/20218 ,  H01L23/34 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20254 ,  H05K7/20281 ,  H05K7/20327 ,  H05K7/2039 ,  H05K7/20436 ,  H05K7/20509 ,  H05K7/20772 ,  H01L2924/00

Abstract: Liquid-cooled heat sink assemblies are provided which include: a thermally conductive base structure having a sidewall surface and a main heat transfer surface; and a manifold structure attached to the base structure, with the base structure residing at least in part within a recess in the manifold structure. Together, the base and manifold structures define a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the base structure, and at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure includes a continuous groove. A sealing member is disposed, at least in part, within the continuous groove, and provides a fluid-tight seal between the thermally conductive base structure and the manifold structure.

公开(公告)号：US09295181B2

公开(公告)日：2016-03-22

申请号：US13671913

申请日：2012-11-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: G05D23/00 ,  H05K7/20 ,  F28F27/02

CPC classification number: H05K7/20281 ,  F28F27/02 ,  H05K7/20781 ,  H05K7/20836

Abstract: A coolant-conditioning unit is provided which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position.

Abstract translation: 提供了一种冷却剂调节单元，其包括设备冷却剂路径，具有设备冷却剂流量控制阀，以及容纳系统冷却剂的系统冷却剂通道，并具有与系统冷却剂旁通阀的旁路管路。 热交换器被耦合到设备和系统冷却剂路径，以便于将热量从系统冷却剂传送到设备冷却剂路径中的设备冷却剂，并且旁路管线与热交换器平行地设置在系统冷却剂路径中。 控制器基于系统冷却液的温度自动控制冷却剂旁通阀的调节位置和设备冷却剂流量控制阀的调节位置，并且自动调节系统冷却剂旁通阀的调节位置以便于维持设备冷却剂 流量控制阀处于或高于指定的，部分打开的最小调节位置。

公开(公告)号：US09250024B2

公开(公告)日：2016-02-02

申请号：US13780613

申请日：2013-02-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20 ,  F28D15/02 ,  F28F3/04 ,  F28F3/12

CPC classification number: F28D15/02 ,  F28F3/048 ,  F28F3/12 ,  F28F2250/08 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359

Abstract: A method of fabricating a cooling apparatus is provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment.

Abstract translation: 提供一种制造冷却装置的方法，以便于一个或多个电子部件的两相浸没冷却。 冷却装置包括壳体，该壳体具有隔室，在该隔室中布置介质流体，其有利于电子部件的浸入冷却。 液体冷却散热器与壳体相关联并且冷却暴露在隔间内的冷却表面。 一个或多个泵设置在隔室内，并且构造成将腔室内的介质流体液体朝向冷却表面泵送，以便于冷却介质流体的饱和温度以下室内的液体。 散热器包括或耦合到暴露在隔室内的冷凝和次冷却区域。