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公开(公告)号：US09623520B2
公开(公告)日：2017-04-18
申请号：US14105691
申请日：2013-12-13
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
CPC classification number: B23P15/26 , F28D15/0266 , F28F3/00 , F28F3/12 , F28F13/00 , G06F1/20 , H05K7/20254 , H05K7/20272 , H05K7/2029 , H05K7/20772 , Y10T29/4935
Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
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2.发明授权公开(公告)号：US09295181B2
公开(公告)日：2016-03-22
申请号：US13671913
申请日：2012-11-08
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: H05K7/20281 , F28F27/02 , H05K7/20781 , H05K7/20836
Abstract: A coolant-conditioning unit is provided which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position.
Abstract translation: 提供了一种冷却剂调节单元，其包括设备冷却剂路径，具有设备冷却剂流量控制阀，以及容纳系统冷却剂的系统冷却剂通道，并具有与系统冷却剂旁通阀的旁路管路。 热交换器被耦合到设备和系统冷却剂路径，以便于将热量从系统冷却剂传送到设备冷却剂路径中的设备冷却剂，并且旁路管线与热交换器平行地设置在系统冷却剂路径中。 控制器基于系统冷却液的温度自动控制冷却剂旁通阀的调节位置和设备冷却剂流量控制阀的调节位置，并且自动调节系统冷却剂旁通阀的调节位置以便于维持设备冷却剂 流量控制阀处于或高于指定的，部分打开的最小调节位置。
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公开(公告)号：US09250024B2
公开(公告)日：2016-02-02
申请号：US13780613
申请日：2013-02-28
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: F28D15/02 , F28F3/048 , F28F3/12 , F28F2250/08 , H05K7/203 , H05K7/20772 , H05K7/20809 , Y10T29/4935 , Y10T29/49359
Abstract: A method of fabricating a cooling apparatus is provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment.
Abstract translation: 提供一种制造冷却装置的方法，以便于一个或多个电子部件的两相浸没冷却。 冷却装置包括壳体，该壳体具有隔室，在该隔室中布置介质流体，其有利于电子部件的浸入冷却。 液体冷却散热器与壳体相关联并且冷却暴露在隔间内的冷却表面。 一个或多个泵设置在隔室内，并且构造成将腔室内的介质流体液体朝向冷却表面泵送，以便于冷却介质流体的饱和温度以下室内的液体。 散热器包括或耦合到暴露在隔室内的冷凝和次冷却区域。
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公开(公告)号：US09213343B2
公开(公告)日：2015-12-15
申请号：US13783618
申请日：2013-03-04
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: H05K7/20836 , G05B15/02 , G05D23/1932 , H05K7/2079
Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.
Abstract translation: 部分地基于组件的加权冷却效率来提供电子系统的冷却系统冷却的能量效率控制。 该控制包括自动确定冷却系统的多个可调冷却部件的速度控制设置。 所述自动确定至少部分地基于所述冷却系统的组件的加权冷却效果，并且所述确定操作以限制至少所述冷却系统的功率消耗，同时确保与至少一个 冷却系统或电子系统在所需的范围内，通过基于加权的冷却效果，提供冷却系统的多个可调冷却部件之间的期望的目标温度变化。 供应包括至少部分地通过所确定的控制设置向多个可调冷却部件供应应用的功率。
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5.发明授权Pressure control unit and method facilitating single-phase heat transfer in a cooling system 有权压力控制单元和促进冷却系统中单相传热的方法公开(公告)号：US09200851B2
公开(公告)日：2015-12-01
申请号：US13785275
申请日：2013-03-05
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
CPC classification number: F28D15/00 , G05D16/202
Abstract: A pressure control unit and method are provided for facilitating single-phase heat transfer within a liquid-based cooling system. The pressure control unit includes a pressure vessel containing system coolant, and a pressurizing mechanism associated with the pressure vessel. A coolant line couples system coolant in the pressure vessel in fluid communication with the coolant loop of the cooling system, and a regulator mechanism couples to the pressurizing mechanism to maintain pressure within the pressure vessel at or above a defined pressure threshold, thus maintaining pressure within the coolant loop above the pressure threshold. The defined pressure threshold is set to facilitate system coolant within the coolant loop remaining single-phase throughout an operational temperature range of the system coolant within the coolant loop. More particularly, the pressure threshold is set to ensure pressure of system coolant within the coolant loop remains above the coolant's saturation pressure at maximum operational temperature.
Abstract translation: 提供了一种压力控制单元和方法，用于促进在液体冷却系统内的单相热传递。 压力控制单元包括容纳系统冷却剂的压力容器和与压力容器相关联的加压机构。 冷却剂管线将压力容器中的系统冷却剂与冷却系统的冷却剂回路流体连通，并且调节器机构联接到加压机构，以将压力容器内的压力维持在或高于限定的压力阈值，从而保持在 冷却剂回路高于压力阈值。 设定的压力阈值被设定为便于在冷却剂回路内的系统冷却剂的整个工作温度范围内，冷却剂回路内的系统冷却剂保持单相。 更具体地，设定压力阈值以确保冷却剂回路内的系统冷却剂的压力在最大工作温度下保持高于冷却剂的饱和压力。
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Patent Agency Ranking
6.发明授权公开(公告)号：US09113581B2
公开(公告)日：2015-08-18
申请号：US14519401
申请日：2014-10-21
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
CPC classification number: H05K7/20818 , G06F1/20 , G06F2200/201 , H05K7/2029 , H05K7/20309 , H05K7/20318 , H05K7/20809
Abstract: Apparatuses are provided for cooling an electronic component(s), which include a heat sink coupled to the electronic component(s), and having a coolant-carrying channel for a first coolant. The first coolant provides two-phase cooling to the electronic component(s), and is discharged from the heat sink as coolant exhaust, which includes coolant vapor. The apparatus further includes a node-level condensation module coupled to the heat sink to receive the coolant exhaust. The condensation module is cooled via a second coolant, and facilitates condensing the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module. A control valve adjusts a flow rate of the second coolant of the node-level condensation module, with the valve being automatically controlled by the controller based on a characterization of the coolant vapor in the coolant exhaust.
Abstract translation: 提供了用于冷却电子部件的装置，电子部件包括耦合到电子部件的散热器，并且具有用于第一冷却剂的冷却剂传送通道。 第一冷却剂向电子部件提供两相冷却，并且作为包括冷却剂蒸气的冷却剂排出物从散热器排出。 该装置还包括联接到散热器以接收冷却剂排气的节点级冷凝模块。 冷凝模块通过第二冷却剂冷却，并且有助于冷凝冷却剂排出物中的冷却剂蒸气。 控制器自动控制散热器的液体冷却和/或节点级冷凝模块的液冷。 控制阀调节节点级冷凝模块的第二冷却剂的流量，基于冷却剂排气中的冷却剂蒸气的表征，阀被控制器自动控制。
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7.发明授权公开(公告)号：US09102021B2
公开(公告)日：2015-08-11
申请号：US14064322
申请日：2013-10-28
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
CPC classification number: B23P15/26 , F28D15/0266 , F28F3/00 , F28F3/12 , F28F13/00 , G06F1/20 , H05K7/20254 , H05K7/20272 , H05K7/2029 , H05K7/20772 , Y10T29/4935
Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
Abstract translation: 提供散热器，冷却电子结构和利用散热器的冷却电子设备。 散热器由导热结构制成，该导热结构包括一个或多个冷却剂承载通道，其联接以便于冷却剂流过冷却剂输送通道。 散热器还包括与冷却剂输送通道相关联的膜。 该膜包括至少一个透气区域，其覆盖着一部分冷却剂输送通道，并且有助于从冷却剂输送通道中除去蒸气，以及至少一个孔口，其连接以将冷却剂注入到 在一个或多个通道的相对端之间的冷却剂承载通道的至少一个表面。
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公开(公告)号：US09095889B2
公开(公告)日：2015-08-04
申请号：US13788798
申请日：2013-03-07
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: B21D53/02 , F25B21/02 , F25B2321/0252 , H05K7/2079 , Y10T29/49359
Abstract: Thermoelectric-enhanced air and liquid cooling of an electronic system is facilitated by providing a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.
Abstract translation: 提供一种电子系统的热电增强空气和液体冷却是通过提供一种冷却装置来实现的，所述冷却装置包括与电子部件热连通的液冷结构，以及液体 - 液体和空气 - 液体热交换器 通过冷却剂回路串联流体连通，其包括并联连接的第一和第二回路部分。 液冷结构经由第一回路部分供应冷却剂，热电阵列设置有第一和第二回路部分与阵列的第一和第二侧热接触。 热电阵列用于将热量从穿过第一环路部分的冷却剂传递到穿过第二环路部分的冷却剂，并且在冷却剂通过液冷结构之前冷却通过第一环部分的冷却剂。 通过第一和第二回路部分的冷却剂通过串联耦合的热交换器，其中一个用作散热器。
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9.发明授权公开(公告)号：US09075582B2
公开(公告)日：2015-07-07
申请号：US13676313
申请日：2012-11-14
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
CPC classification number: H05K7/20818 , G06F1/20 , G06F2200/201 , H05K7/2029 , H05K7/20309 , H05K7/20318 , H05K7/20809
Abstract: A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module.
Abstract translation: 提供冷却装置和方法来冷却电子机架的电子子系统的一个或多个电子部件。 冷却装置包括散热器，其被配置为耦合到电子部件，并且其包括用于冷却剂流过其中的冷却剂输送通道。 冷却剂为电子部件提供两相冷却，并且作为包括要冷凝的冷却剂蒸汽的冷却剂排出物从散热器排出。 冷却装置还包括与电子子系统相关联的节点级冷凝模块，并且与散热器流体连通地耦合以接收来自散热器的冷却剂排出物。 冷凝模块是液体冷却的，并且便于冷却剂排气中的冷却剂蒸气的冷凝。 控制器自动控制散热器的液体冷却和/或节点级冷凝模块的液冷。
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10.发明授权Wicking and coupling element(s) facilitating evaporative cooling of component(s) 有权促进部件蒸发冷却的芯吸和耦合元件公开(公告)号：US09009971B2
公开(公告)日：2015-04-21
申请号：US13788871
申请日：2013-03-07
Applicant: International Business Machines Corporation
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: B23P15/26 , H05K7/203 , H05K7/20336 , H05K7/20809 , Y10T29/4935 , Y10T29/49396
Abstract: A method is provided for facilitating cooling of electronic components of an electronic system. The method includes: providing a housing at least partially surrounding and forming a compartment about the components, and providing an immersion-cooling fluid is disposed within the compartment, at least one component of the electronic system being at least partially non-immersed within the fluid in the compartment; providing a wicking film element physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment; and securing, via a coupling element, the wicking film element in physical coupling to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.
Abstract translation: 提供了一种便于冷却电子系统的电子部件的方法。 该方法包括：提供壳体，其至少部分地环绕和形成围绕部件的隔室，并且提供浸入冷却流体设置在隔室内，电子系统的至少一个部件至少部分地不浸入流体 在隔间; 提供物理耦合到所述至少一个部件的主表面并且部分地设置在所述隔室内的流体内的芯吸膜元件; 以及通过耦合元件将所述芯吸膜元件物理耦合到所述至少一个部件的主表面，而不将所述耦合元件覆盖在所述部件的主表面上。 作为增强，芯吸膜元件包裹在部件上以物理耦合到部件的两个相对的主侧。
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