公开(公告)号：US4782381A

公开(公告)日：1988-11-01

申请号：US062005

申请日：1987-06-12

申请人： Richard C. Ruby ,  Clinton Chao

发明人： Richard C. Ruby ,  Clinton Chao

IPC分类号： H01L27/01 ,  H01L23/538 ,  H01L23/64 ,  H01L23/48 ,  H01C1/012 ,  H01L29/90 ,  H01L39/02

CPC分类号： H01L23/538 ,  H01L23/647 ,  H01L2224/16225 ,  H01L2924/1305 ,  H01L2924/3011

摘要： A chip carrier for carrying integrated circuit chips is provided. Instead of placing individual circuit components either in the chips or next to them, the components are placed in or near the substrate of the chip carrier. This frees up expensive real-estate for logic chips at the chip level presently occupied by the components. The substrate of the carrier acts as a large heat sink to dissipate power generated by the components.

摘要翻译： 提供了用于承载集成电路芯片的芯片载体。 代替将单独的电路组件放置在芯片中或其旁边，将组件放置在芯片载体的衬底中或附近。 这可以在目前由组件占用的芯片级别上释放昂贵的逻辑芯片。 载体的基板用作大的散热器，以消散由部件产生的电力。

公开(公告)号：US09069005B2

公开(公告)日：2015-06-30

申请号：US13162883

申请日：2011-06-17

申请人： Richard C. Ruby

发明人： Richard C. Ruby

IPC分类号： G01P15/125 ,  G01P15/08 ,  G01C19/5776

CPC分类号： G01P15/125 ,  G01C19/5776 ,  G01P15/0802 ,  G01P2015/0831

摘要： A capacitance-to-frequency converter is configured to convert a difference between first and second capacitances produced of a teeter-totter capacitive transducer as a result of a rotational force being applied to the teeter-totter capacitive transducer to a first signal having a first frequency that is a function of the rotational force, and to convert a sum of the first and second capacitances produced as a result of an acceleration force to a second signal having a second frequency that is a function of the acceleration force. The capacitance-to-frequency converter includes a first oscillator having a first oscillator frequency that changes in response to a change in the first capacitance; a second oscillator having a second oscillator frequency that changes in response to a change in the second capacitance; and a mixer having first and second mixer inputs connected outputs of the first and second oscillators.

摘要翻译： 电容 - 频率转换器被配置为转换由跷跷板电容式换能器产生的第一和第二电容之间的差异，这是由于旋转力被施加到跷跷板电容换能器而具有第一频率的第一信号 这是旋转力的函数，并且将作为加速力的结果产生的第一和第二电容的和转换成具有作为加速力的函数的第二频率的第二信号。 电容 - 频率转换器包括具有响应于第一电容的变化而改变的第一振荡器频率的第一振荡器; 具有响应于所述第二电容的变化而改变的第二振荡器频率的第二振荡器; 以及具有连接第一和第二振荡器的输出的第一和第二混频器输入的混频器。

公开(公告)号：US20130194057A1

公开(公告)日：2013-08-01

申请号：US13361724

申请日：2012-01-30

申请人： Richard C. Ruby

发明人： Richard C. Ruby

IPC分类号： H03H9/54

CPC分类号： H03H9/172 ,  H03H3/02 ,  H03H9/02102 ,  H03H9/08 ,  H03H9/54

摘要： An acoustic resonator device includes an annular acoustic resonator, a heater coil and a heat sensor. The annular acoustic resonator is positioned over a trench formed in a substrate of the acoustic resonator device. The heater coil is disposed around a perimeter of the annular acoustic resonator, the heater coil including a resistor configured to receive a heater current. The heat sensor is configured to adjust the heater current in response to a temperature of the heater coil.

公开(公告)号：US08436516B2

公开(公告)日：2013-05-07

申请号：US13404095

申请日：2012-02-24

申请人： Richard C. Ruby ,  Wei Pang ,  Qiang Zou ,  Donald Lee

发明人： Richard C. Ruby ,  Wei Pang ,  Qiang Zou ,  Donald Lee

IPC分类号： H01L41/08

CPC分类号： H03H9/131 ,  H03H3/04 ,  H03H9/02102 ,  H03H9/173 ,  H03H9/175

摘要： An acoustic resonator device includes a composite first electrode on a substrate, a piezoelectric layer on the composite electrode, and a second electrode on the piezoelectric layer. The first electrode includes a buried temperature compensating layer having a positive temperature coefficient. The piezoelectric layer has a negative temperature coefficient, and thus the positive temperature coefficient of the temperature compensating layer offsets at least a portion of the negative temperature coefficient of the piezoelectric layer.

摘要翻译： 声谐振器装置包括在基板上的复合第一电极，复合电极上的压电层和压电层上的第二电极。 第一电极包括具有正温度系数的掩埋温度补偿层。 压电层具有负温度系数，因此温度补偿层的正温度系数抵消压电层的负温度系数的至少一部分。

公开(公告)号：US07855618B2

公开(公告)日：2010-12-21

申请号：US12112633

申请日：2008-04-30

申请人： Michael L. Frank ,  Richard C. Ruby ,  Tiberiu Jamneala

发明人： Michael L. Frank ,  Richard C. Ruby ,  Tiberiu Jamneala

IPC分类号： H03H9/00 ,  H03H9/15

CPC分类号： H03H9/587 ,  H03H9/0095 ,  H03H9/132 ,  H03H9/583

摘要： An electrical impedance transformer comprises a first film bulk acoustic resonator (FBAR), having a first electrical impedance and a first resonance frequency. The electrical impedance transformer also comprises: a second FBAR, having a second electrical impedance and a second resonance frequency, and being disposed over the first FBAR. The electrical impedance transformer also includes a decoupling layer disposed between the first and the second FBARs. The first electrical impedance differs from the second electrical impedance and the first and second resonance frequencies are substantially the same.

摘要翻译： 电阻抗变压器包括具有第一电阻抗和第一谐振频率的第一膜体声波谐振器（FBAR）。 电阻抗变压器还包括：第二FBAR，具有第二电阻抗和第二谐振频率，并且设置在第一FBAR上。 电阻抗变压器还包括设置在第一和第二FBAR之间的去耦层。 第一电阻抗与第二电阻抗不同，第一和第二谐振频率基本上相同。

公开(公告)号：US07508286B2

公开(公告)日：2009-03-24

申请号：US11540413

申请日：2006-09-28

申请人： Richard C. Ruby ,  Wei Pang

发明人： Richard C. Ruby ,  Wei Pang

IPC分类号： H03H9/00

CPC分类号： H03H3/04 ,  H03H9/105 ,  H03H9/605

摘要： An oscillator comprises a substrate and a high tone bulk acoustic resonator (HBAR), which includes a portion of the substrate. The oscillator also comprises a film bulk acoustic resonator (FBAR) filter disposed over the substrate. The filter comprises a plurality of FBAR devices. The oscillator also comprises a plurality of acoustic isolators disposed in the substrate, wherein one of the isolators is disposed beneath each of the FBAR devices. A method of fabricating an oscillator is also disclosed.

摘要翻译： 振荡器包括衬底和高音量体声波谐振器（HBAR），其包括衬底的一部分。 振荡器还包括设置在衬底上的膜体声波谐振器（FBAR）滤波器。 滤波器包括多个FBAR装置。 振荡器还包括设置在基板中的多个隔声器，其中一个隔离器设​​置在每个FBAR装置的下方。 还公开了一种制造振荡器的方法。

公开(公告)号：US07479685B2

公开(公告)日：2009-01-20

申请号：US11373434

申请日：2006-03-10

申请人： R. Shane Fazzio ,  Richard C. Ruby ,  Christopher P. Wade ,  Michael Louis Frank ,  David A. Feld

发明人： R. Shane Fazzio ,  Richard C. Ruby ,  Christopher P. Wade ,  Michael Louis Frank ,  David A. Feld

IPC分类号： H01L29/78

CPC分类号： H03H9/02118 ,  H03H3/02 ,  H03H9/02125 ,  H03H9/172

摘要： An electronic device. The electronic device includes a first electrode and a coating layer. The electronic device is fabricated on a substrate; the substrate has a cavity created in a top surface of the substrate; and the first electrode is electrically coupled to the substrate. The coating layer coats at least part of a substrate surface in the cavity, and the presence of the coating layer results in a mitigation of at least one parasitic leakage path between the first electrode and an additional electrode fabricated on the substrate.

摘要翻译： 电子设备。 电子器件包括第一电极和涂层。 电子器件制造在衬底上; 衬底具有在衬底的顶表面中产生的空腔; 并且第一电极电耦合到衬底。 涂层涂覆在空腔中的基底表面的至少一部分，并且涂层的存在导致在第一电极和在基底上制造的附加电极之间的至少一个寄生泄漏路径的减轻。

公开(公告)号：US20070279153A1

公开(公告)日：2007-12-06

申请号：US11443954

申请日：2006-05-31

申请人： Richard C. Ruby

发明人： Richard C. Ruby

IPC分类号： H03H9/58

CPC分类号： H03H9/02118 ,  H03H9/132 ,  H03H9/174 ,  H03H9/564 ,  H03H9/585

摘要： Film bulk acoustic resonators (FBARs) stacked FBARs (SBARS) including at least two curved edges are disclosed.

摘要翻译： 公开了包括至少两个弯曲边缘的薄膜体声共振器（FBAR）堆叠FBAR（SBARS）。

公开(公告)号：US06777267B2

公开(公告)日：2004-08-17

申请号：US10286729

申请日：2002-11-01

申请人： Richard C. Ruby ,  Frank S. Geefay ,  Cheol Hyun Han ,  Qing Gan ,  Andrew T. Barfknecht

发明人： Richard C. Ruby ,  Frank S. Geefay ,  Cheol Hyun Han ,  Qing Gan ,  Andrew T. Barfknecht

IPC分类号： H01L2144

CPC分类号： H01L21/6836 ,  H01L21/50 ,  H01L21/78 ,  H01L2221/68327

摘要： A method for separating dies on a wafer includes etching channels around the dies on a first side of the wafer, mounting the first side of the wafer to a quartz plate with an UV adhesive, and grinding a second side of the wafer until the channels are exposed on the second side of the wafer. At this point, the dies are separated but held together by the UV adhesive on the quartz plate. The method further includes mounting a second side of the wafer to a tack tape, exposing UV radiation through the quartz plate to the UV adhesive. At this point, the UV adhesive looses its adhesion so the dies are held together by the tack tape. The method further includes dismounting the quartz plate from the first side of the wafer and picking up the individual dies from the tack tape.

公开(公告)号：US06777263B1

公开(公告)日：2004-08-17

申请号：US10647040

申请日：2003-08-21

申请人： Qing Gan ,  Richard C. Ruby ,  Frank S. Geefay ,  Andrew T. Barfknecht

发明人： Qing Gan ,  Richard C. Ruby ,  Frank S. Geefay ,  Andrew T. Barfknecht

IPC分类号： H01L2144

CPC分类号： B81C1/00269 ,  H01L21/50

摘要： A method for forming a wafer package includes forming a die structure, wherein the die structure includes a first wafer, a device mounted on the first wafer, a second wafer mounted atop the first wafer with a first seal ring around the device and a second seal ring around a via contact. The method further includes forming a trench in the second wafer around the first seal ring, filling the trench and the via contact with a sealing agent, patterning a topside of the second wafer to removed the excessive sealing agent and to expose a contact pad of the via contact, and singulating a die around the first seal ring.

摘要翻译： 一种用于形成晶片封装的方法，包括形成管芯结构，其中管芯结构包括第一晶片，安装在第一晶片上的器件，安装在第一晶片顶部的第二晶片，具有围绕器件的第一密封环，第二密封 环绕通道接触。 所述方法还包括在所述第二晶片周围形成沟槽，围绕所述第一密封环，用密封剂填充所述沟槽和所述通孔接触，图案化所述第二晶片的顶侧以除去所述过量的密封剂并露出所述第二晶片的接触垫 通过接触，并且围绕第一密封环分开模具。