Method and apparatus for switching an optical beam in a semiconductor substrate
    71.
    发明授权
    Method and apparatus for switching an optical beam in a semiconductor substrate 有权
    用于切换半导体衬底中的光束的方法和装置

    公开(公告)号:US06603893B1

    公开(公告)日:2003-08-05

    申请号:US09819160

    申请日:2001-03-27

    IPC分类号: G02B626

    摘要: An optical switching method and apparatus. In one aspect of the present invention, the disclosed apparatus includes first and second multi-mode interference (MMI) splitting devices in a semiconductor substrate. First and second outputs of the first MMI splitting device are optically coupled to first and second inputs, respectively, of the second MMI splitting device. First and second phase control devices are included in the semiconductor substrate. The first input of the second MMI splitting device is optically coupled to the first output of the first MMI splitting device through the first phase control device. The second input of the second MMI splitting device is optically coupled to the second output of the first MMI splitting device through the second phase control device. The first input of the first MMI splitting device is selectively optically coupled to the first and second outputs of the second MMI splitting device in response to the first and second phase control devices. The second input of the first MMI splitting device is selectively optically coupled to the first and second outputs of the second MMI splitting device in response to the first and second phase control devices.

    摘要翻译: 一种光学切换方法和装置。 在本发明的一个方面,所公开的设备包括半导体衬底中的第一和第二多模干涉(MMI)分离器件。 第一MMI分割装置的第一和第二输出分别光耦合到第二MMI分割装置的第一和第二输入。 第一和第二相位控制装置包括在半导体衬底中。 第二MMI分割装置的第一输入通过第一相位控制装置光耦合到第一MMI分配装置的第一输出端。 第二MMI分配装置的第二输入通过第二相位控制装置光耦合到第一MMI分配装置的第二输出端。 响应于第一和第二相位控制装置,第一MMI分配装置的第一输入选择性地光耦合到第二MMI分配装置的第一和第二输出端。 响应于第一和第二相位控制装置,第一MMI分配装置的第二输入被选择性地光耦合到第二MMI分配装置的第一和第二输出端。

    Method and apparatus for providing optical interconnection

    公开(公告)号:US06587605B2

    公开(公告)日:2003-07-01

    申请号:US09780174

    申请日:2001-02-09

    IPC分类号: G02B612

    CPC分类号: G02F1/025 G02B6/43

    摘要: A method and an apparatus providing an optical interconnection in an integrated circuit die. In one embodiment, an optical interconnection is used to optically interconnect a waveguide-based optical modulator through the insulating layer and back side of the semiconductor substrate of the integrated circuit die. In one embodiment, an insulating oxide layer is disposed between a semiconductor waveguide optical modulator and the back side of the semiconductor substrate. Optical conduits are disposed in the insulating oxide layer at the locations where light enters and exits the semiconductor waveguide optical modulator. In one embodiment, the optical conduits have indexes of refraction substantially equal to the indexes of refraction of the semiconductor substrate and the semiconductor waveguide optical modulator. Thus, attenuation of the light used to optically couple the semiconductor waveguide optical modulator through the back side of the semiconductor substrate is reduced.

    Method and apparatus for switching a plurality of optical beams in an optical switch
    74.
    发明授权
    Method and apparatus for switching a plurality of optical beams in an optical switch 失效
    用于在光开关中切换多个光束的方法和装置

    公开(公告)号:US06449405B1

    公开(公告)日:2002-09-10

    申请号:US09676293

    申请日:2000-09-28

    IPC分类号: G02B642

    CPC分类号: G02F1/025 G02B2006/12145

    摘要: A device for confining an optical beam in an optical switch. In one embodiment, the disclosed optical switch includes an optical switching device disposed between an optical input port and an optical output port in a semiconductor substrate layer disposed between a plurality of optical confinement layers such that an optical beam is confined to remain within the layers. In one embodiment, a plurality of semiconductor substrate layers are included in the optical switch. Each of the semiconductor substrate layers is disposed between optical confinement layers such that optical beams passing through the semiconductor substrate layers are confined to remain within the semiconductor substrate layers until exiting through respective optical output ports. In one embodiment, integrated circuitry such as driver circuitry, controller circuitry, logic circuitry, coder-decoder circuitry, microprocessor circuitry or the like is included in at least one of the semiconductor substrate layers.

    摘要翻译: 用于将光束限制在光开关中的装置。 在一个实施例中,所公开的光开关包括设置在设置在多个光限制层之间的半导体衬底层中的光输入端口和光输出端口之间的光开关器件,使得光束被限制在残留在层内。 在一个实施例中,光开关中包括多个半导体衬底层。 每个半导体衬底层设置在光学限制层之间,使得通过半导体衬底层的光束被限制为保留在半导体衬底层内,直到通过相应的光学输出端口离开。 在一个实施例中,诸如驱动器电路,控制器电路,逻辑电路,编码器 - 解码器电路,微处理器电路等的集成电路被包括在至少一个半导体衬底层中。

    Method and apparatus for providing optical interconnection
    75.
    发明授权
    Method and apparatus for providing optical interconnection 有权
    提供光互连的方法和装置

    公开(公告)号:US06393169B1

    公开(公告)日:2002-05-21

    申请号:US09226783

    申请日:1999-01-06

    IPC分类号: G02B612

    摘要: A method and an apparatus providing an optical interconnection in an integrated circuit die. In one embodiment, an optical interconnection is used to optically interconnect a waveguide-based optical modulator through the insulating layer and back side of the semiconductor substrate of the integrated circuit die. In one embodiment, an insulating oxide layer is disposed between a semiconductor waveguide optical modulator and the back side of the semiconductor substrate. Optical conduits are disposed in the insulating oxide layer at the locations where light enters and exits the semiconductor waveguide optical modulator. In one embodiment, the optical conduits have indexes of refraction substantially equal to the indexes of refraction of the semiconductor substrate and the semiconductor waveguide optical modulator. Thus, attenuation of the light used to optically couple the semiconductor waveguide optical modulator through the back side of the semiconductor substrate is reduced.

    摘要翻译: 一种在集成电路管芯中提供光互连的方法和装置。 在一个实施例中,光互连用于通过集成电路管芯的半导体衬底的绝缘层和背面光学地互连基于波导的光学调制器。 在一个实施例中,绝缘氧化物层设置在半导体波导光调制器和半导体衬底的背面之间。 在光入射到半导体波导光调制器的位置处,光导管设置在绝缘氧化物层中。 在一个实施例中,光导管的折射指数基本上等于半导体衬底和半导体波导光调制器的折射率。 因此,减少了通过半导体衬底的背面光耦合半导体波导光学调制器的光的衰减。

    Method and apparatus for optically modulating light utilizing a resonant cavity structure
    76.
    发明授权
    Method and apparatus for optically modulating light utilizing a resonant cavity structure 有权
    利用谐振腔结构光学调制光的方法和装置

    公开(公告)号:US06351326B1

    公开(公告)日:2002-02-26

    申请号:US09465222

    申请日:1999-12-14

    IPC分类号: G02F103

    摘要: An optical modulator that modulates an optical beam through directed through an integrated circuit die. In one embodiment, the optical beam is directed into and out of a flip chip packaged integrated circuit die. In one embodiment, the optical modulator includes a resonant cavity structure. In one embodiment, the resonant cavity structure is disposed in the dielectric layer of the integrated circuit die. In one embodiment, the optical beam is directed into the integrated circuit die and through the resonant cavity structure and is modulated in response to an integrated circuit signal of the integrated circuit die. In one embodiment, the optical beam is modulated by modulating the resonant wavelength of the resonant cavity structure in response to the integrated circuit signal. A modulated optical beam is directed from the resonant cavity structure back out of the integrated circuit die.

    摘要翻译: 光调制器,其通过引导通过集成电路管芯来调制光束。 在一个实施例中,光束被引导到倒装芯片封装的集成电路管芯中和外。 在一个实施例中,光调制器包括谐振腔结构。 在一个实施例中,谐振腔结构设置在集成电路管芯的电介质层中。 在一个实施例中,光束被引导到集成电路管芯中并通过谐振腔结构,并且响应于集成电路管芯的集成电路信号被调制。 在一个实施例中,通过响应于集成电路信号调制谐振腔结构的谐振波长来调制光束。 调制光束从谐振腔结构引出集成电路管芯。

    Higher order rejection method and apparatus for optical modulator
    77.
    发明授权
    Higher order rejection method and apparatus for optical modulator 有权
    光调制器的高阶抑制方法和装置

    公开(公告)号:US06330376B1

    公开(公告)日:2001-12-11

    申请号:US09283106

    申请日:1999-03-31

    申请人: Mario J. Paniccia

    发明人: Mario J. Paniccia

    IPC分类号: G02B612

    摘要: An optical modulator that modulates light through the semiconductor substrate through the back side of a flip chip packaged integrated circuit. The optical modulator of the present invention enables integrated circuit signals to be extracted through the back side of the semiconductor substrate. In one embodiment, an optical modulator is disposed within a flip chip packaged integrated circuit die. The optical modulator includes a deflector and a diffraction grating. An infrared light beam is directed through the back side of a silicon substrate of the integrated circuit die, deflected off the deflector through the diffraction grating and back out the back side of the integrated circuit die. The diffraction grating modulates the phase of a portion of the deflected light beam in response to an integrated circuit signal. A resulting diffraction interference occurs between the phase modulated portions and nonphase modulated portions of the deflected light beam. The interference causes amplitude modulation of a zero order diffraction of the deflected light beam, from which the integrated circuit signal can be extracted. The zero order diffraction is allowed to pass through an optical passage to exit the semiconductor substrate of the flip chip packaged integrated circuit die while the non-zero order diffractions are blocked.

    摘要翻译: 一种光学调制器,其通过倒装芯片封装集成电路的背面来调制通过半导体衬底的光。 本发明的光调制器能够通过半导体基板的背面提取集成电路信号。 在一个实施例中,光学调制器设置在倒装芯片封装集成电路管芯内。 光学调制器包括偏转器和衍射光栅。 红外光束被引导通过集成电路管芯的硅衬底的背面,通过衍射光栅偏转偏转器并从集成电路管芯的背面退出。 衍射光栅响应于集成电路信号调制偏转光束的一部分的相位。 在偏转光束的相位调制部分和非相位调制部分之间产生衍射干涉。 干扰引起偏转光束的零级衍射的幅度调制,可从中提取集成电路信号。 允许零级衍射通过光通道以退出倒装芯片封装的集成电路管芯的半导体衬底,而非零级衍射被阻挡。

    Method and apparatus for optically modulating light through the back
side of an integrated circuit die
    78.
    发明授权
    Method and apparatus for optically modulating light through the back side of an integrated circuit die 失效
    通过集成电路管芯的背侧对光进行光学调制的方法和装置

    公开(公告)号:US6075908A

    公开(公告)日:2000-06-13

    申请号:US993786

    申请日:1997-12-19

    IPC分类号: G02B6/12 G02F1/015 G02F1/21

    摘要: An optical modulator that modulates light through the semiconductor substrate through the back side of a flip chip packaged integrated circuit. The optical modulator of the present invention enables integrated circuit signals to be extracted through the back side of the semiconductor substrate. In one embodiment, an optical modulator is disposed within a flip chip packaged integrated circuit die. The optical modulator includes a deflector and a diffraction grating. An infrared light beam is directed through the back side of a silicon substrate of the integrated circuit die, deflected off the deflector through the diffraction grating and back out the back side of the integrated circuit die. The diffraction grating modulates the phase of a portion of the deflected light beam in response to an integrated circuit signal. A resulting diffraction interference occurs between the phase modulated portions and non-phase modulated portions of the deflected light beam. The interference causes amplitude modulation of a zero order diffraction of the deflected light beam, from which the integrated circuit signal can be extracted.

    摘要翻译: 一种光学调制器,其通过倒装芯片封装集成电路的背面来调制通过半导体衬底的光。 本发明的光调制器能够通过半导体基板的背面提取集成电路信号。 在一个实施例中,光学调制器设置在倒装芯片封装集成电路管芯内。 光学调制器包括偏转器和衍射光栅。 红外光束被引导通过集成电路管芯的硅衬底的背面,通过衍射光栅偏转偏转器并从集成电路管芯的背面退出。 衍射光栅响应于集成电路信号调制偏转光束的一部分的相位。 在偏转光束的相位调制部分和非相位调制部分之间产生衍射干涉。 干扰引起偏转光束的零级衍射的幅度调制,可从中提取集成电路信号。