利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

168 条记录 (耗时 0.028 秒)

    Metallization system of a semiconductor device comprising rounded interconnects formed by hard mask rounding
    72.
    发明授权
    Metallization system of a semiconductor device comprising rounded interconnects formed by hard mask rounding 有权
    包括通过硬掩模四舍五入形成的圆形互连的半导体器件的金属化系统

    公开(公告)号：US08420533B2

    公开(公告)日：2013-04-16

    申请号：US12939424

    申请日：2010-11-04

    申请人： Robert Seidel ,  Thomas Werner

    发明人： Robert Seidel ,  Thomas Werner

    IPC分类号： H01L21/44

    CPC分类号： H01L21/76804 ,  H01L21/31144 ,  H01L21/76811

    摘要： In sophisticated metallization systems, vertical contacts and metal lines may be formed on the basis of a dual inlaid strategy, wherein an edge rounding or corner rounding may be applied to the trench hard mask prior to forming the via openings on the basis of a self-aligned via trench concept. Consequently, self-aligned interconnect structures may be obtained, while at the same time providing superior fill conditions during the deposition of barrier materials and conductive fill materials.

    摘要翻译： 在复杂的金属化系统中，可以基于双嵌入式策略形成垂直触点和金属线，其中可以在形成通孔之前，将边缘圆形或圆角圆化施加到沟槽硬掩模， 通过沟槽概念对齐。 因此，可以获得自对准的互连结构，同时在阻挡材料和导电填充材料的沉积期间提供优异的填充条件。

    IED FOR, AND METHOD OF ENGINEERING, AND SA SYSTEM
    75.
    发明申请
    IED FOR, AND METHOD OF ENGINEERING, AND SA SYSTEM 审中-公开
    IED FOR，AND ENGINEERING AND SA系统

    公开(公告)号：US20110257806A1

    公开(公告)日：2011-10-20

    申请号：US13173924

    申请日：2011-06-30

    申请人： Thomas Werner ,  Jean-Charles Tournier ,  Stefan Richter

    发明人： Thomas Werner ,  Jean-Charles Tournier ,  Stefan Richter

    IPC分类号： G06F1/28 ,  G06F1/26

    CPC分类号： H04L49/35 ,  H04L12/56 ,  H04L49/201

    摘要： Intelligent Electronic Devices (IEDs) for Substation Automation (SA), such as bay units or substation PCs, are equipped with a Central Processing Unit CPU that includes a first processing core dedicated and configured to execute Protection and Control applications, and a second processing core, or network core, dedicated and configured to handle or decode network communication traffic. The network core performs computationally expensive pre-processing and/or post-processing functionality on top of the 9-2 communication stack. A plurality of network cores or a plurality of network interfaces may be provided to cope with the expected amount of IEC 61850 9-2 traffic.

    摘要翻译： 用于变电站自动化（SA）的智能电子设备（IED），例如间隔单元或变电站PC，配备有中央处理单元CPU，其包括专用并被配置为执行保护和控制应用的第一处理核心以及第二处理核心 或网络核心，专用和配置为处理或解码网络通信流量。 网络核心在9-2通信堆栈之上执行计算上昂贵的预处理和/或后处理功能。 可以提供多个网络核心或多个网络接口以处理预期量的IEC 61850 9-2业务量。

    Data Consistency Validation
    76.
    发明申请
    Data Consistency Validation 审中-公开
    数据一致性验证

    公开(公告)号：US20110137878A1

    公开(公告)日：2011-06-09

    申请号：US10593094

    申请日：2004-03-17

    申请人： Thomas Werner ,  Philip Meier ,  Claus Vetter ,  Martin Naedele

    发明人： Thomas Werner ,  Philip Meier ,  Claus Vetter ,  Martin Naedele

    IPC分类号： G06F7/00 ,  G06F17/00

    CPC分类号： H04L41/0869 ,  H04L41/00

    摘要： An entity to be validated for consistency is loaded into the buffer of the consistency service, a signal to verify the existence of a specific data set of an IT system is then sent by the consistency service to the IT system holding the entity to be validated for consistency, and the consistency validating information is stored in the output means, said consistency validating information depending on the signal being sent back to the consistency service.The consistency of data stored in various IT systems is checked prior to attempting to access it. Errors by calling a service or functionality that would require access to data that is not available or that is inconsistent can therefore be avoided.

    摘要翻译： 为了一致性验证的实体被加载到一致性服务的缓冲器中，则由一致性服务发送用于验证IT系统的特定数据集的存在的信号给保持要被验证的实体的IT系统 一致性，并且一致性验证信息存储在输出装置中，所述一致性验证信息取决于被发送回一致性服务的信号。 在尝试访问之前检查存储在各种IT系统中的数据的一致性。 因此可以避免通过调用需要访问不可用或不一致的数据的服务或功能来进行错误。

    PERFORMANCE ENHANCEMENT IN METALLIZATION SYSTEMS OF MICROSTRUCTURE DEVICES BY INCORPORATING GRAIN SIZE INCREASING METAL FEATURES
    78.
    发明申请
    PERFORMANCE ENHANCEMENT IN METALLIZATION SYSTEMS OF MICROSTRUCTURE DEVICES BY INCORPORATING GRAIN SIZE INCREASING METAL FEATURES 审中-公开
    通过增加颗粒尺寸增加金属特征的微结构设备金属化系统的性能提升

    公开(公告)号：US20100133700A1

    公开(公告)日：2010-06-03

    申请号：US12624517

    申请日：2009-11-24

    申请人： Thomas Werner ,  Oliver Aubel ,  Frank Feustel

    发明人： Thomas Werner ,  Oliver Aubel ,  Frank Feustel

    IPC分类号： H01L23/522 ,  H01L21/768

    CPC分类号： H01L23/528 ,  H01L21/76813 ,  H01L21/76816 ,  H01L21/76832 ,  H01L23/522 ,  H01L23/5283 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In a sophisticated metallization system, enhanced electromigration behavior may be accomplished by incorporating electromigration barriers into metal lines after a given distance, which may be accomplished by providing an increased width in order to obtain an enhanced average grain size in the intermediate metal regions of increased lateral width. Consequently, the electromigration induced material diffusion may encounter an overall increased grain size along the entire depth of the metal lines, thereby resulting in a significantly reduced electromigration effect and thus enhanced reliability of the critical metal lines.

    摘要翻译： 在复杂的金属化系统中，增强的电迁移行为可以通过在给定距离之后将电迁移屏障并入金属线中来实现，这可以通过提供增加的宽度来实现，以便在增加的侧向的中间金属区域中获得增强的平均晶粒尺寸 宽度。 因此，电迁移诱导的材料扩散可能沿着金属线的整个深度遇到总体增加的晶粒尺寸，从而导致显着降低的电迁移效应，从而提高关键金属线的可靠性。