公开(公告)号：US20130194057A1

公开(公告)日：2013-08-01

申请号：US13361724

申请日：2012-01-30

Applicant: Richard C. Ruby

Inventor： Richard C. Ruby

IPC: H03H9/54

CPC classification number: H03H9/172 ,  H03H3/02 ,  H03H9/02102 ,  H03H9/08 ,  H03H9/54

Abstract: An acoustic resonator device includes an annular acoustic resonator, a heater coil and a heat sensor. The annular acoustic resonator is positioned over a trench formed in a substrate of the acoustic resonator device. The heater coil is disposed around a perimeter of the annular acoustic resonator, the heater coil including a resistor configured to receive a heater current. The heat sensor is configured to adjust the heater current in response to a temperature of the heater coil.

公开(公告)号：US08436516B2

公开(公告)日：2013-05-07

申请号：US13404095

申请日：2012-02-24

Applicant: Richard C. Ruby ,  Wei Pang ,  Qiang Zou ,  Donald Lee

Inventor： Richard C. Ruby ,  Wei Pang ,  Qiang Zou ,  Donald Lee

IPC: H01L41/08

CPC classification number: H03H9/131 ,  H03H3/04 ,  H03H9/02102 ,  H03H9/173 ,  H03H9/175

Abstract: An acoustic resonator device includes a composite first electrode on a substrate, a piezoelectric layer on the composite electrode, and a second electrode on the piezoelectric layer. The first electrode includes a buried temperature compensating layer having a positive temperature coefficient. The piezoelectric layer has a negative temperature coefficient, and thus the positive temperature coefficient of the temperature compensating layer offsets at least a portion of the negative temperature coefficient of the piezoelectric layer.

Abstract translation: 声谐振器装置包括在基板上的复合第一电极，复合电极上的压电层和压电层上的第二电极。 第一电极包括具有正温度系数的掩埋温度补偿层。 压电层具有负温度系数，因此温度补偿层的正温度系数抵消压电层的负温度系数的至少一部分。

公开(公告)号：US07855618B2

公开(公告)日：2010-12-21

申请号：US12112633

申请日：2008-04-30

Applicant: Michael L. Frank ,  Richard C. Ruby ,  Tiberiu Jamneala

Inventor： Michael L. Frank ,  Richard C. Ruby ,  Tiberiu Jamneala

IPC: H03H9/00 ,  H03H9/15

CPC classification number: H03H9/587 ,  H03H9/0095 ,  H03H9/132 ,  H03H9/583

Abstract: An electrical impedance transformer comprises a first film bulk acoustic resonator (FBAR), having a first electrical impedance and a first resonance frequency. The electrical impedance transformer also comprises: a second FBAR, having a second electrical impedance and a second resonance frequency, and being disposed over the first FBAR. The electrical impedance transformer also includes a decoupling layer disposed between the first and the second FBARs. The first electrical impedance differs from the second electrical impedance and the first and second resonance frequencies are substantially the same.

Abstract translation: 电阻抗变压器包括具有第一电阻抗和第一谐振频率的第一膜体声波谐振器（FBAR）。 电阻抗变压器还包括：第二FBAR，具有第二电阻抗和第二谐振频率，并且设置在第一FBAR上。 电阻抗变压器还包括设置在第一和第二FBAR之间的去耦层。 第一电阻抗与第二电阻抗不同，第一和第二谐振频率基本上相同。

公开(公告)号：US07841055B2

公开(公告)日：2010-11-30

申请号：US11373451

申请日：2006-03-09

Applicant: Richard C. Ruby ,  John D. Larson, III

Inventor： Richard C. Ruby ,  John D. Larson, III

IPC: H01L41/22

CPC classification number: H03H9/605 ,  H03H9/587 ,  H03H9/60 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49155

Abstract: An apparatus including vertically separated acoustic resonators are disclosed. The apparatus includes a first acoustic resonator on a substrate and a second acoustic resonator vertically separated above the first acoustic resonator. Because the resonators are vertically separated above another, total area required to implement the resonators is reduced thereby savings in die size and cost are realized. The vertically separated resonators are supported by standoffs that are fabricated on the substrate, or on a resonator.

Abstract translation: 公开了一种包括垂直分离的声谐振器的装置。 该装置包括在基板上的第一声谐振器和在第一声谐振器之上垂直分离的第二声谐振器。 由于谐振器在另一个上方垂直分离，所以实现谐振器所需的总面积减小，从而实现了芯片尺寸和成本的节省。 垂直分离的谐振器由制造在衬底上或在谐振器上的支座支撑。

公开(公告)号：US07508286B2

公开(公告)日：2009-03-24

申请号：US11540413

申请日：2006-09-28

Applicant: Richard C. Ruby ,  Wei Pang

Inventor： Richard C. Ruby ,  Wei Pang

IPC: H03H9/00

CPC classification number: H03H3/04 ,  H03H9/105 ,  H03H9/605

Abstract: An oscillator comprises a substrate and a high tone bulk acoustic resonator (HBAR), which includes a portion of the substrate. The oscillator also comprises a film bulk acoustic resonator (FBAR) filter disposed over the substrate. The filter comprises a plurality of FBAR devices. The oscillator also comprises a plurality of acoustic isolators disposed in the substrate, wherein one of the isolators is disposed beneath each of the FBAR devices. A method of fabricating an oscillator is also disclosed.

Abstract translation: 振荡器包括衬底和高音量体声波谐振器（HBAR），其包括衬底的一部分。 振荡器还包括设置在衬底上的膜体声波谐振器（FBAR）滤波器。 滤波器包括多个FBAR装置。 振荡器还包括设置在基板中的多个隔声器，其中一个隔离器设​​置在每个FBAR装置的下方。 还公开了一种制造振荡器的方法。

公开(公告)号：US07479685B2

公开(公告)日：2009-01-20

申请号：US11373434

申请日：2006-03-10

Applicant: R. Shane Fazzio ,  Richard C. Ruby ,  Christopher P. Wade ,  Michael Louis Frank ,  David A. Feld

Inventor： R. Shane Fazzio ,  Richard C. Ruby ,  Christopher P. Wade ,  Michael Louis Frank ,  David A. Feld

IPC: H01L29/78

CPC classification number: H03H9/02118 ,  H03H3/02 ,  H03H9/02125 ,  H03H9/172

Abstract: An electronic device. The electronic device includes a first electrode and a coating layer. The electronic device is fabricated on a substrate; the substrate has a cavity created in a top surface of the substrate; and the first electrode is electrically coupled to the substrate. The coating layer coats at least part of a substrate surface in the cavity, and the presence of the coating layer results in a mitigation of at least one parasitic leakage path between the first electrode and an additional electrode fabricated on the substrate.

Abstract translation: 电子设备。 电子器件包括第一电极和涂层。 电子器件制造在衬底上; 衬底具有在衬底的顶表面中产生的空腔; 并且第一电极电耦合到衬底。 涂层涂覆在空腔中的基底表面的至少一部分，并且涂层的存在导致在第一电极和在基底上制造的附加电极之间的至少一个寄生泄漏路径的减轻。

公开(公告)号：US20070279153A1

公开(公告)日：2007-12-06

申请号：US11443954

申请日：2006-05-31

Applicant: Richard C. Ruby

Inventor： Richard C. Ruby

IPC: H03H9/58

CPC classification number: H03H9/02118 ,  H03H9/132 ,  H03H9/174 ,  H03H9/564 ,  H03H9/585

Abstract: Film bulk acoustic resonators (FBARs) stacked FBARs (SBARS) including at least two curved edges are disclosed.

Abstract translation: 公开了包括至少两个弯曲边缘的薄膜体声共振器（FBAR）堆叠FBAR（SBARS）。

公开(公告)号：US07098758B2

公开(公告)日：2006-08-29

申请号：US10980562

申请日：2004-11-03

Applicant: Kun Wang ,  Paul D. Bradley ,  Richard C. Ruby ,  Hongjun Feng

Inventor： Kun Wang ,  Paul D. Bradley ,  Richard C. Ruby ,  Hongjun Feng

IPC: H03H9/54 ,  H03H9/13

CPC classification number: H03H9/564 ,  H03H9/02228 ,  H03H9/13 ,  H03H9/60 ,  H03H9/605 ,  H03H9/706

Abstract: Acoustically coupled resonators include a first and a second acoustic resonator. Both the first and second acoustic resonators include a first electrode, a layer of piezoelectric material, and a second electrode. The first electrode is adjacent a first surface of the layer of piezoelectric material. The second electrode is adjacent a second surface of the layer of piezoelectric material. At least the second electrode has an edge that is tapered.

Abstract translation: 声耦合谐振器包括第一和第二声谐振器。 第一和第二声谐振器都包括第一电极，压电材料层和第二电极。 第一电极邻近压电材料层的第一表面。 第二电极邻近压电材料层的第二表面。 至少第二电极具有渐缩的边缘。

公开(公告)号：US06777267B2

公开(公告)日：2004-08-17

申请号：US10286729

申请日：2002-11-01

Applicant: Richard C. Ruby ,  Frank S. Geefay ,  Cheol Hyun Han ,  Qing Gan ,  Andrew T. Barfknecht

Inventor： Richard C. Ruby ,  Frank S. Geefay ,  Cheol Hyun Han ,  Qing Gan ,  Andrew T. Barfknecht

IPC: H01L2144

CPC classification number: H01L21/6836 ,  H01L21/50 ,  H01L21/78 ,  H01L2221/68327

Abstract: A method for separating dies on a wafer includes etching channels around the dies on a first side of the wafer, mounting the first side of the wafer to a quartz plate with an UV adhesive, and grinding a second side of the wafer until the channels are exposed on the second side of the wafer. At this point, the dies are separated but held together by the UV adhesive on the quartz plate. The method further includes mounting a second side of the wafer to a tack tape, exposing UV radiation through the quartz plate to the UV adhesive. At this point, the UV adhesive looses its adhesion so the dies are held together by the tack tape. The method further includes dismounting the quartz plate from the first side of the wafer and picking up the individual dies from the tack tape.

公开(公告)号：US06777263B1

公开(公告)日：2004-08-17

申请号：US10647040

申请日：2003-08-21

Applicant: Qing Gan ,  Richard C. Ruby ,  Frank S. Geefay ,  Andrew T. Barfknecht

Inventor： Qing Gan ,  Richard C. Ruby ,  Frank S. Geefay ,  Andrew T. Barfknecht

IPC: H01L2144

CPC classification number: B81C1/00269 ,  H01L21/50

Abstract: A method for forming a wafer package includes forming a die structure, wherein the die structure includes a first wafer, a device mounted on the first wafer, a second wafer mounted atop the first wafer with a first seal ring around the device and a second seal ring around a via contact. The method further includes forming a trench in the second wafer around the first seal ring, filling the trench and the via contact with a sealing agent, patterning a topside of the second wafer to removed the excessive sealing agent and to expose a contact pad of the via contact, and singulating a die around the first seal ring.

Abstract translation: 一种用于形成晶片封装的方法，包括形成管芯结构，其中管芯结构包括第一晶片，安装在第一晶片上的器件，安装在第一晶片顶部的第二晶片，具有围绕器件的第一密封环，第二密封 环绕通道接触。 所述方法还包括在所述第二晶片周围形成沟槽，围绕所述第一密封环，用密封剂填充所述沟槽和所述通孔接触，图案化所述第二晶片的顶侧以除去所述过量的密封剂并露出所述第二晶片的接触垫 通过接触，并且围绕第一密封环分开模具。