摘要:
A variable resistance nonvolatile storage device which includes (i) a semiconductor substrate (301), (ii) a variable resistance element (309) having: lower and upper electrodes (309a, 309c); and a variable resistance layer (309b) whose resistance value reversibly varies based on voltage signals each of which has a different polarity and is applied between the electrodes (309a, 309c), and (iii) a MOS transistor (317) formed on the substrate (301), wherein the variable resistance layer (309b) includes: oxygen-deficient transition metal oxide layers (309b-1, 309b-2) having compositions MOX and MOy (where x
摘要:
A nonvolatile memory element includes first and second electrodes, and a resistance variable layer disposed therebetween. At least one of the first and second electrodes includes a platinum-containing layer. The resistance variable layer includes a first oxygen-deficient transition metal oxide layer which is not physically in contact with the platinum-containing layer and a second oxygen-deficient transition metal oxide layer which is disposed between the first oxygen-deficient transition metal oxide layer and the platinum-containing layer and is physically in contact with the platinum-containing layer. When oxygen-deficient transition metal oxides included in the first and second oxygen-deficient transition metal oxide layers are expressed as MOx, and MOy, respectively, x
摘要:
A nonvolatile memory element (100) includes a variable resistance layer (107) including a first metal oxide MOx and a second metal oxide MOy, and reaction energy of chemical reaction related to the first metal oxide, the second metal oxide, oxygen ions, and electrons is 2 eV or less. The chemical reaction is expressed by a formula 13, where a combination (MOx, MOy) of MOx and MOy is selected from a group including (Cr2O3, CrO3), (Co3O4, Co2O3), (Mn3O4, Mn2O3), (VO2, V2O5), (Ce2O3, CeO2), (W3O8, WO3), (Cu2O, CuO), (SnO, SnO2), (NbO2, Nb2O5), and (Ti2O3, TiO2). [Mathematical Expression 13] MOx+(y−x)O2−MOy+2(y−x)e− (Formula 13)
摘要翻译:非易失性存储元件(100)包括可变电阻层(107),其包括第一金属氧化物MOx和第二金属氧化物MOy,以及与第一金属氧化物,第二金属氧化物,氧离子和 电子为2eV以下。 化学反应由式13表示,其中MOx和MOy的组合(MOx,MOy)选自(Cr 2 O 3,CrO 3),(Co 3 O 4,Co 2 O 3),(Mn 3 O 4,Mn 2 O 3),(VO 2,V 2 O 5) ),(Ce 2 O 3,CeO 2),(W3O 8,WO 3),(Cu 2 O,CuO),(SnO,SnO 2),(NbO 2,Nb 2 O 5)和(Ti 2 O 3,TiO 2)。 [数学表达式13] MOx +(y-x)O2-MOy + 2(y-x)e-(式13)
摘要:
A nonvolatile memory element of the present invention comprises a first electrode (503); a second electrode (505); and a resistance variable layer (504) which is disposed between the first electrode (503) and the second electrode (505), a resistance value of the resistance variable layer being changeable in response to electric signals which are applied between the first electrode (503) and the second electrode (505), wherein the first electrode and the second electrode comprise materials which are made of different elements.
摘要:
Provided is a nonvolatile memory element achieving a stable resistance change and miniaturization, and a method of manufacturing the same. The nonvolatile memory element includes: a first electrode formed above a substrate; an interlayer insulating layer formed above the substrate including the first electrode and having a memory cell hole reaching the first electrode; a barrier layer formed in the memory cell hole and composed of a semiconductor layer or an insulating layer connected to the first electrode; a second electrode formed in the memory cell hole and connected to the barrier layer; a variable resistance layer formed on the second electrode and having a stacked structure whose resistance value changes based on electric signals; and a third electrode connected to the variable resistance layer and formed on the interlayer insulating layer to cover the memory cell hole.
摘要:
Provided is a nonvolatile storage device (200) capable of stably operating without increasing a size of a selection transistor included in each of memory cells. The nonvolatile storage device (200) includes: a semiconductor substrate (301) which has a P-type well (301a) of a first conductivity type; a memory cell array (202) which includes memory cells (M11) or the like each of which includes a variable resistance element (R11) and a transistor (N11) that are formed above the semiconductor substrate (301) and connected in series; and a substrate bias circuit (220) which applies, to the P-type well (301a), a bias voltage in a forward direction with respect to a source and a drain of the transistor (N11), when a voltage pulse for writing is applied to the variable resistance element (R11) included in the selected memory cell (M11) or the like.
摘要:
A stacking structure in which a stacked body (21) including a first conductive layer (13), a semiconductor layer (17), and a second conductive layer (18) and an interlayer insulating film (16) are alternately stacked in parallel to a substrate, a plurality of columnar electrodes (12) arranged so as to penetrated through the stacking structure in a stacking direction, a variable resistance layer (14) which is disposed between the columnar electrode (12) and the first conductive layer (13) and which has a resistance value that reversibly changes according to an application of an electric signal are included. The variable resistance layer (14) is formed by oxidizing part of the first conductive layer (13). The variable resistance layer (14) and an insulating film for electrically separating the semiconductor layer (17) and the second conductive layer (18) from the columnar electrode (12) are simultaneously formed in a single oxidation process.
摘要:
A method of programming a variable resistance element includes: performing a writing step by applying a writing voltage pulse having a first polarity to a transition metal oxide comprising two metal oxide layers which are stacked, so as to change a resistance state of the transition metal oxide from high to low, each of the two metal oxide layers having a different degree of oxygen deficiency; and performing an erasing step by applying an erasing voltage pulse having a second polarity to the transition metal oxide so as to change the resistance state of the transition metal oxide from low to high, the second polarity being different from the first polarity, wherein |Vw1|>|Vw2| is satisfied, where Vw1 represents a voltage value of the writing voltage pulse for first to N-th writing steps, and Vw2 represents a voltage value of the writing voltage pulse for (N+1)-th and subsequent writing steps, where N is equal to or more than 1, te1>te2 is satisfied, where te1 represents a pulse width of the erasing voltage pulse for first to M-th erasing steps, and te2 represents a pulse width of the erasing voltage pulse for (M+1)-th and subsequent erasing steps, where M is equal to or more than 1, and the (N+1)-th writing step follows the M-th erasing step.
摘要:
Each of memory cells (MC) includes one transistor and one resistance variable element. The transistor includes a first main terminal, a second main terminal and a control terminal. The resistance variable element includes a first electrode, a second electrode and a resistance variable layer provided between the first electrode and the second electrode. A first main terminal of one of two adjacent memory cells is connected to a second main terminal of the other memory cell, to form a series path (SP) sequentially connecting main terminals of the plurality of memory cells in series. Each of the memory cells is configured such that the control terminal is a part of a first wire (WL) associated with the memory cell or is connected to the first wire associated with the memory cell, the second electrode is a part of a second wire (SL) associated with the memory cell or is connected to the second wire associated with the memory cell; and the first electrode is a part of a series path (SP) associated with the memory cell or is connected to the series path associated with the memory cell.
摘要:
A nonvolatile memory apparatus comprises a memory array (102) including plural first electrode wires (WL) formed to extend in parallel with each other within a first plane; plural second electrode wires (BL) formed to extend in parallel with each other within a second plane parallel to the first plane and to three-dimensionally cross the plural first electrode wires; and nonvolatile memory elements (11) which are respectively provided at three-dimensional cross points between the first electrode wires and the second electrode wires, the elements each having a resistance variable layer whose resistance value changes reversibly in response to a current pulse supplied between an associated first electrode wire and an associated second electrode wire; and a first selecting device (13) for selecting the first electrode wires, and further comprises voltage restricting means (15) provided within or outside the memory array, the voltage restricting means being connected to the first electrode wires, for restricting a voltage applied to the first electrode wires to a predetermined upper limit value or less; wherein plural nonvolatile memory elements of the nonvolatile memory elements are connected to one first electrode wire connecting the first selecting device to the voltage restricting means.