公开(公告)号：US09362646B2

公开(公告)日：2016-06-07

申请号：US14209795

申请日：2014-03-13

申请人： Thomas S. Cohen

发明人： Thomas S. Cohen

IPC分类号： H01R13/05 ,  H01R13/02 ,  H01R43/26 ,  H01R13/11 ,  H01R43/16 ,  H01R12/73

CPC分类号： H01R13/05 ,  H01R12/737 ,  H01R13/02 ,  H01R13/113 ,  H01R13/6587 ,  H01R43/16 ,  H01R43/26 ,  Y10T29/49117 ,  Y10T29/49208

摘要： Mating interfaces for high speed, high density electrical connectors. In some embodiments, a contact comprises a base region, a first elongated member comprising a distal end attached to the base region and a proximal portion, a second elongated member comprising a distal end attached to the base region and a proximal portion, and a strap coupling the distal portion of the first elongated member to the distal portion of the second elongated member, wherein the strap is conductive and compliant such that the distal portion of the first elongated member is capable of moving independently of and is electrically connected to the distal portion of the second elongated member.

摘要翻译： 用于高速，高密度电连接器的接合接口。 在一些实施例中，触点包括基部区域，第一细长构件，其包括附接到基部区域的远端和近端部分，第二细长构件，包括附接到基部区域的远端和近端部分，以及带 将所述第一细长构件的远端部分联接到所述第二细长构件的远侧部分，其中所述带是导电的并且柔顺的，使得所述第一细长构件的远侧部分能够独立于所述远侧部分并且电连接到所述远端部分 的第二细长构件。

公开(公告)号：US09022806B2

公开(公告)日：2015-05-05

申请号：US13930531

申请日：2013-06-28

申请人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R13/648 ,  H01R12/70 ,  H01R12/71 ,  H01R43/20 ,  H01R13/6587 ,  H05K1/02

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌件成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US08998642B2

公开(公告)日：2015-04-07

申请号：US13336564

申请日：2011-12-23

申请人： David Paul Manter ,  Thomas S. Cohen

发明人： David Paul Manter ,  Thomas S. Cohen

IPC分类号： H01R13/502 ,  H01R13/518 ,  H01R13/514 ,  H01R12/52

CPC分类号： H01R13/518 ,  H01R12/52 ,  H01R13/514 ,  H01R13/6587 ,  Y10T29/4922

摘要： An electrical connector system includes a daughter card connector formed of a plurality of wafers. Each wafer is formed with cavities between the contacts of the signal conductors. The cavities are shaped to receive lossy inserts whereby crosstalk is reduced. The connector system may also or alternatively include a front housing formed with shield plates also to aid in reducing cross-talk. The front housing is adapted to mate between the wafers of the daughter card connector and a backplane connector of the electrical connector system. In an alternative embodiment, the front housing portion may include lossy conductive portions for cross-talk reduction.

摘要翻译： 电连接器系统包括由多个晶片形成的子卡连接器。 每个晶片在信号导体的触点之间形成有空腔。 空腔被成形为接收有损耗的插入物，从而降低串扰。 连接器系统还可以或可选地包括形成有屏蔽板的前壳体，以帮助减少串扰。 前壳体适于在子卡连接器的晶片与电连接器系统的背板连接器之间配合。 在替代实施例中，前壳体部分可以包括用于串扰减少的有损导电部分。

公开(公告)号：US20140273557A1

公开(公告)日：2014-09-18

申请号：US14209240

申请日：2014-03-13

申请人： Marc B. Cartier, JR. ,  Mark W. Gailus ,  Thomas S. Cohen ,  John Robert Dunham ,  Vysakh Sivarajan

发明人： Marc B. Cartier, JR. ,  Mark W. Gailus ,  Thomas S. Cohen ,  John Robert Dunham ,  Vysakh Sivarajan

IPC分类号： H01R13/646 ,  H01R43/16 ,  H01R12/70

CPC分类号： H01R13/6476 ,  H01R12/585 ,  H01R12/724 ,  H01R12/737 ,  H01R13/514 ,  H01R43/16 ,  H01R43/24 ,  Y10T29/49208

摘要： An electrical connector designed for high speed signals. The connector includes one or more features that, when used alone or in combination, extend performance to higher speeds. These features may include compensation for tie bars that are used to hold conductive members in place for molding a housing around the conductive members. Removal of the tie bars during manufacture of the connector may leave artifacts in the conductive members and/or housing, which may be addressed by the features. The conductive members, for example, may include regions, adjacent tie bar locations, that compensate for portions of the tie bar that are not fully removed. Alternatively or additionally, a housing may include openings around tie bar locations such that a punch may be used to sever the tie bars. These openings may be filled to avoid performance-affecting artifacts.

摘要翻译： 一个专为高速信号设计的电连接器。 连接器包括一个或多个特征，当单独使用或组合使用时，将性能扩展到更高的速度。 这些特征可以包括对用于将导电构件保持在适当位置以用于模制围绕导电构件的壳体的拉杆的补偿。 在制造连接器期间去除连接杆可能会在导电构件和/或外壳中留下瑕疵，这可以通过特征来解决。 例如，导电构件可以包括补偿未完全移除的连杆的部分的相邻连接杆位置的区域。 或者或另外，壳体可以包括围绕连杆位置的开口，使得可以使用冲头来切断连杆。 这些开口可以被填充以避免影响性能的假象。

公开(公告)号：US20140004746A1

公开(公告)日：2014-01-02

申请号：US13930351

申请日：2013-06-28

申请人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R12/71

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US20140004726A1

公开(公告)日：2014-01-02

申请号：US13930447

申请日：2013-06-28

申请人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R12/71 ,  H01R43/20

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US08202118B2

公开(公告)日：2012-06-19

申请号：US12891198

申请日：2010-09-27

申请人： Thomas S. Cohen ,  Mark W. Gailus ,  John R. Dunham

发明人： Thomas S. Cohen ,  Mark W. Gailus ,  John R. Dunham

IPC分类号： H01R13/648

CPC分类号： H01R12/716 ,  H01R12/585 ,  H01R12/724 ,  H01R12/727 ,  H01R13/514 ,  H01R13/6474 ,  H01R13/6587 ,  H01R13/6591 ,  H05K1/14 ,  H05K7/1445 ,  H05K2201/044 ,  H05K2201/10189 ,  H05K2203/1572

摘要： A differential connector has a plurality of rows. Each row includes a plurality of signal conductors provided as differential pairs. Each signal conductor has a first contact end connectable to a printed circuit board, a second contact end, and an intermediate portion having a first width. For each differential pair, one first contact end lies along a first line parallel to the plurality of rows and the other first contact end lies along a second line parallel to and spaced from the first line. The differential connector further includes a plurality of ground conductors, with each ground conductor corresponding to a differential pair. Each ground conductor has a first contact end connectable to the printed circuit board, a second contact end, and an intermediate portion having a second width that is at least twice the first width.

摘要翻译： 差分连接器具有多行。 每行包括多个作为差分对提供的信号导体。 每个信号导体具有可连接到印刷电路板的第一接触端，第二接触端和具有第一宽度的中间部分。 对于每个差分对，一个第一接触端沿着平行于多个行的第一线设置，而另一个第一接触端沿着与第一线平行并与之隔开的第二线。 差分连接器还包括多个接地导体，每个接地导体对应于差分对。 每个接地导体具有可连接到印刷电路板的第一接触端，第二接触端和具有至少为第一宽度的两倍的第二宽度的中间部分。

公开(公告)号：US07811130B2

公开(公告)日：2010-10-12

申请号：US12477578

申请日：2009-06-03

申请人： Thomas S. Cohen ,  Mark W. Gailus ,  John R. Dunham

发明人： Thomas S. Cohen ,  Mark W. Gailus ,  John R. Dunham

IPC分类号： H01R13/648

CPC分类号： H01R12/716 ,  H01R12/585 ,  H01R12/724 ,  H01R12/727 ,  H01R13/514 ,  H01R13/6474 ,  H01R13/6587 ,  H01R13/6591 ,  H05K1/14 ,  H05K7/1445 ,  H05K2201/044 ,  H05K2201/10189 ,  H05K2203/1572

摘要： A differential connector has a plurality of rows. Each row includes a plurality of signal conductors provided as differential pairs. Each signal conductor has a first contact end connectable to a printed circuit board, a second contact end, and an intermediate portion having a first width. For each differential pair, one first contact end lies along a first line parallel to the plurality of rows and the other first contact end lies along a second line parallel to and spaced from the first line. The differential connector further includes a plurality of ground conductors, with each ground conductor corresponding to a differential pair. Each ground conductor has a first contact end connectable to the printed circuit board, a second contact end, and an intermediate portion having a second width that is at least twice the first width.

摘要翻译： 差分连接器具有多行。 每行包括多个作为差分对提供的信号导体。 每个信号导体具有可连接到印刷电路板的第一接触端，第二接触端和具有第一宽度的中间部分。 对于每个差分对，一个第一接触端沿着平行于多个行的第一线设置，而另一个第一接触端沿着与第一线平行并与之隔开的第二线。 差分连接器还包括多个接地导体，每个接地导体对应于差分对。 每个接地导体具有可连接到印刷电路板的第一接触端，第二接触端和具有至少两倍于第一宽度的第二宽度的中间部分。

公开(公告)号：US07794278B2

公开(公告)日：2010-09-14

申请号：US12062581

申请日：2008-04-04

申请人： Thomas S. Cohen ,  Brian Kirk ,  Jason E. Chan ,  Andreas C. Pfahnl ,  Marc B. Cartier, Jr. ,  David Manter

发明人： Thomas S. Cohen ,  Brian Kirk ,  Jason E. Chan ,  Andreas C. Pfahnl ,  Marc B. Cartier, Jr. ,  David Manter

IPC分类号： H01R13/648

CPC分类号： H01R12/727 ,  H01R13/6471 ,  H01R13/6474 ,  H01R13/6585 ,  H01R13/6587

摘要： An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers containing columns of conductive elements, some of which form differential pairs. Each column may include ground conductors adjacent pairs of signal conductors. The ground conductors may be wider than the signal conductors, with ground conductors between adjacent pairs of signal conductors being wider than ground conductors positioned at an end of at least some of the columns. Each of the conductive elements may end in a mating contact portion positioned to engage a complementary contact element in a mating connector. The mating contact portions of the signal conductors in some of the pairs may be rotated relative to the columns. The printed circuit board to which the differential signal connector is mounted may be constructed with elongated antipads around pairs of signal conductors.

摘要翻译： 具有高速差动电连接器的电气互连系统。 连接器由包含导电元件列的晶片组装，其中一些形成差分对。 每列可以包括相邻的信号导体对的接地导体。 接地导体可以比信号导体更宽，相邻的信号导体对之间的接地导体宽于位于至少一些列的端部的接地导体。 每个导电元件可以在匹配的接触部分中端部，该配合接触部分定位成接合配合连接器中的互补接触元件。 一些成对的信号导体的配合接触部分可以相对于列旋转。 安装有差分信号连接器的印刷电路板可以在信号导体对周围形成细长的止动片。

公开(公告)号：US07722401B2

公开(公告)日：2010-05-25

申请号：US12062570

申请日：2008-04-04

申请人： Brian Kirk ,  Thomas S. Cohen

发明人： Brian Kirk ,  Thomas S. Cohen

IPC分类号： H01R13/648

CPC分类号： H01R13/514 ,  H01R12/724 ,  H01R13/6471 ,  H01R13/6477 ,  H01R13/6587

摘要： An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers each containing a column of conductive elements, some of which form differential pairs. A housing for the wafer is formed with regions of higher and lower dielectric constant material. The regions of lower dielectric constant material are selectively positioned adjacent longer signal conductors of the differential pairs. The material may be preferentially placed along curved segments of the differential pair to reduce crosstalk in the connector while reducing skew.

摘要翻译： 具有高速差动电连接器的电气互连系统。 连接器由每个包含一列导电元件的晶片组装，其中一些形成差分对。 用于晶片的壳体形成有较高和较低介电常数材料的区域。 低介电常数材料的区域选择性地定位在差分对的更长的信号导体附近。 材料可以优先放置在差动对的弯曲段上，以减少连接器中的串扰，同时减少偏斜。