公开(公告)号：US06531026B1

公开(公告)日：2003-03-11

申请号：US09585415

申请日：2000-06-02

Applicant: Motohide Takeichi ,  Yukio Yamada

Inventor： Motohide Takeichi ,  Yukio Yamada

IPC: B32B3100

CPC classification number: H01L21/563 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A method for mounting electronic elements, comprises the step of arranging a thermosetting adhesive between a circuit board, situated on a stage, and an electronic element to be connected with the wiring pattern of the circuit board, and then bonding the electronic element to the circuit board by the application of heat and pressure from the electronic element side. The electronic element is temporarily thermocompression-bonded to the circuit board such that the thermosetting reaction rate of the thermosetting adhesive on the side of the circuit board is lower than the thermosetting reaction rate on the side of the electronic element. The thermosetting adhesive is then set finally in order to bond the electronic element to the circuit board.

Abstract translation: 一种用于安装电子元件的方法，包括在位于台架上的电路板和要与电路板的布线图形连接的电子元件之间布置热固性粘合剂的步骤，然后将电子元件接合到电路 通过应用电子元件侧的热和压力板。 将电子元件暂时热压到电路板上，使得热固性粘合剂在电路板一侧的热固化反应速率低于电子元件一侧的热固化反应速率。 然后最终设置热固性粘合剂以将电子元件粘合到电路板。

公开(公告)号：US06346402B1

公开(公告)日：2002-02-12

申请号：US09582764

申请日：2000-06-30

Applicant: Akira Iwasaki ,  Yukio Yamada ,  Yasuhiro Ikenaka ,  Yoshihiko Yasohara ,  Junzo Hasegawa

Inventor： Akira Iwasaki ,  Yukio Yamada ,  Yasuhiro Ikenaka ,  Yoshihiko Yasohara ,  Junzo Hasegawa

IPC: C12P1304

CPC classification number: C12N9/1096 ,  C12P41/006

Abstract: Relating to an enzyme capable of efficiently converting a ketone compound to an optically active amino compound by transamination, and a process for preparing an optically active amino compound using the enzyme. An (S)-&agr;-phenethylamine:pyruvate transaminase, which acts on (S)-&agr;-phenethylamine and a ketone compound, thereby catalyzing transamination for forming acetophenone and an amino compound corresponding to the ketone compound; a process for preparing an optically active amino compound using the transaminase; and a method for culturing a microorganism for producing the above transaminase, comprising adding to a medium one or more compounds selected from the group consisting of propylamine, 1-butylamine, 2-butylamine, 2-pentylamine, isopropylamine and isobutylamine as an inducer for the enzyme when a microorganism for producing (S)-&agr;-phenethylamine:pyruvate transaminase is cultured.

Abstract translation: 关于能够通过转氨酶有效地将酮化合物转化为光学活性氨基化合物的酶，以及使用该酶制备光学活性氨基化合物的方法。 （S）-α-苯乙胺：丙酮酸转氨酶，其作用于（S）-α-苯乙胺和酮化合物，从而催化转氨酶形成苯乙酮和对应于酮化合物的氨基化合物; 使用转氨酶制备光学活性氨基化合物的方法; 以及培养用于制备上述转氨酶的微生物的方法，包括向培养基中加入一种或多种选自丙胺，1-丁胺，2-丁胺，2-戊胺，异丙胺和异丁胺的化合物作为诱导剂 用于生产（S）-α-苯乙胺：丙酮酸转氨酶的微生物培养时的酶。

公开(公告)号：US6114672A

公开(公告)日：2000-09-05

申请号：US167140

申请日：1998-10-06

Applicant: Norikazu Iwasaki ,  Hisaya Tamura ,  Toyoji Yamazaki ,  Yukio Yamada

Inventor： Norikazu Iwasaki ,  Hisaya Tamura ,  Toyoji Yamazaki ,  Yukio Yamada

IPC: H01C7/02 ,  H01C7/13 ,  H01C13/02 ,  H05B1/02 ,  H05K1/18

CPC classification number: H01C7/027 ,  H01H2085/466

Abstract: A PTC-element to be used as a protective device against overcurrent or overvoltage, of which the volume resistivity does not substantially differ before and after a high temperature processing, such as reflowing of solder, and can be preserved even after having been subjected to repeated tripping, which contains a non-conductive crystalline polymer and a particulate conductor material dispersed in the non-conducting crystalline polymer, wherein the particulate conductor material includes electro-conductive particles having irregular surface contours.

Abstract translation: 用作抵抗过电流或过电压的保护装置的PTC元件，其在高温处理之前和之后的体积电阻率基本上不同，例如焊料的回流，并且即使在经受重复之后也可以保存 其包含分散在非导电结晶聚合物中的非导电结晶聚合物和颗粒状导体材料，其中所述颗粒状导体材料包括具有不规则表面轮廓的导电颗粒。

公开(公告)号：US5902736A

公开(公告)日：1999-05-11

申请号：US244657

申请日：1994-06-06

Applicant: Hideaki Yamada ,  Sakayu Shimizu ,  Yasuhiro Ikenaka ,  Kazuyoshi Yajima ,  Yukio Yamada ,  Hirokazu Nanba ,  Masayuki Takano ,  Satomi Takahashi

Inventor： Hideaki Yamada ,  Sakayu Shimizu ,  Yasuhiro Ikenaka ,  Kazuyoshi Yajima ,  Yukio Yamada ,  Hirokazu Nanba ,  Masayuki Takano ,  Satomi Takahashi

IPC: C12P13/04 ,  C12P41/00 ,  C07C1/04

CPC classification number: C12P13/04 ,  C12P41/009 ,  Y10S435/874 ,  Y10S435/911

Abstract: In a process for the production of a D-.alpha.-amino acid, in which an N-carbamyl-D-.alpha.-amino acid corresponding to the general formula: ##STR1## wherein R represents phenyl, hydroxy-substituted phenyl, substituted or unsubstituted alkyl, or thienyl, is converted by a microbial enzyme in an aqueous medium to a D-.alpha.-amino acid corresponding to the general formula: ##STR2## wherein R is the same as defined above, decarbamylase produced by a microorganism of the genus Comamonas, Blastobacter, Alcaligenes, Sporosarcina, Rhizobium, Bradyrhizobium or Arthrobacter is used as the enzyme converting the N-carbamyl-D-.alpha.-amino acid to the D-.alpha.-amino acid.The conversion of the N-carbamyl-D-.alpha.-amino acids to the D-.alpha.-amino acids is carried out in a neutral to alkaline pH range.

Abstract translation: PCT No.PCT / JP93 / 01408 Sec。 371日期：1994年6月6日 102（e）日期1994年6月6日PCT提交1993年10月1日PCT公布。 公开号WO94 / 08030 日期1994年4月14日在制备D-氨基酸的方法中，其中N-氨基甲酰基-D-α-氨基酸对应于通式：其中R表示苯基，羟基取代的苯基，取代的 或未取代的烷基或噻吩基通过微生物酶在水性介质中转化成对应于以下通式的D-α-氨基酸：其中R与上述定义相同，由Comamonas属的微生物产生的脱氨基甲酰酶， 使用喷杆菌属，产碱杆菌属，孢子体菌属，根瘤菌属，Bradyrhizobium或节杆菌作为将N-氨基甲酰基-D-α-氨基酸转化为D-氨基酸的酶。 N-氨基甲酰基-D-α-氨基酸向D-α-氨基酸的转化在中性至碱性pH范围内进行。

公开(公告)号：US5715639A

公开(公告)日：1998-02-10

申请号：US523944

申请日：1995-09-06

Applicant: Yukio Yamada

Inventor： Yukio Yamada

IPC: E04D3/363 ,  E04D3/366 ,  E04D3/367 ,  E04D1/18

CPC classification number: E04D3/363 ,  E04D3/364 ,  E04D3/366

Abstract: A metal roof board connecting structure for connecting metal roof boards includes a raised-up flat lock seam portion formed by bending flatly and seamly raised-up regions of two metal roof boards which are arranged adjacently to each other, and a cap member capped on the raised-up flat lock seam portion. A part of the raised-up region of one of the two metal roof boards forms a first cap engaging projection and a bent portion of the raised-up flat lock seam portion forms a second cap engaging projection so as to be arranged in symmetrical with the first projection. The cap member has a two elastic side walls a center portion of each of which has an engaging recess and a lower end portion of each of which is extended downwardly and outwardly to extend away from each other. When the cap member is capped on the raised-up flat lock seam portion, the engaging recesses of the two side walls of the cap member are engaged with the first and second cap engaging projections of the one raised-up region and the raised-up flat lock seam portion of the two metal roof boards, and that engagement is semipermanently secured by the elastic force of the two side walls of the cap member.

Abstract translation: 用于连接金属屋顶板的金属屋顶板连接结构包括通过相互相邻布置的两个金属屋顶板的平坦地和接缝的上升区域弯曲而形成的上升平的锁定缝部分，以及盖 抬起的平锁缝部分。 两个金属屋顶板中的一个的升高区域的一部分形成第一盖接合突起，并且升高的平锁锁缝部分的弯曲部分形成第二帽接合突起，以便与 第一投影。 盖构件具有两个弹性侧壁，每个中心部分具有接合凹部，并且每个的下端部向下和向外延伸以彼此远离延伸。 当帽构件被盖在上升的平锁锁缝部分上时，帽构件的两个侧壁的接合凹槽与一个抬起区域的第一和第二帽接合突起接合，并且凸起 两个金属屋顶板的平锁锁缝部分，并且通过盖构件的两个侧壁的弹力半接头被固定。

公开(公告)号：US5698068A

公开(公告)日：1997-12-16

申请号：US429695

申请日：1995-04-27

Applicant: Iwao Ichikawa ,  Norio Kawatani ,  Kazuaki Suzuki ,  Yukio Yamada

Inventor： Iwao Ichikawa ,  Norio Kawatani ,  Kazuaki Suzuki ,  Yukio Yamada

IPC: H01R43/00 ,  B29C65/00 ,  B29C65/18 ,  G02F1/1345 ,  H01R43/02 ,  H05K3/32 ,  B30B15/34

CPC classification number: B29C65/18 ,  B29C65/305 ,  B29C66/80 ,  B29C66/81427 ,  B29C66/8167 ,  B29C66/8322 ,  B29C66/836

Abstract: This invention provides a thermocompression bonding equipment which, when the material to be bonded is to be changed, allows easy replacement and preparation of a compression bonding head, reduction of working time required for replacement and preparation of a compression bonding head, and simplified adjustment of the compression bonding head. The thermocompression bonding equipment is provided with a head unit 20 comprising a base 10, thermocompression bonding head 56 and sliding mechanism 50 for sliding the thermocompression bonding head 56 provided on the base 10, pressing means 30, which are structured independently from the head unit, for pressing the sliding mechanism 50 to slide the thermocompression bonding head 56, thereby thermocompression bonding the material of ACF, LCD, and TAB, and a base frame 40 provided with positioning means 40, 41 for positioning the base 10.

Abstract translation: 本发明提供一种热压接设备，当要被接合的材料被改变时，允许容易地更换和制备压接头，减少更换所需的工作时间并制备压接头，并且简化了 压接头。 热压接设备设置有头单元20，头单元20包括基座10，热压接头56和用于滑动设置在基座10上的热压接头56的滑动机构50，独立于头单元构造的按压装置30， 用于按压滑动机构50以滑动热压接头56，从而热压接ACF，LCD和TAB的材料，以及设置有用于定位基座10的定位装置40,41的基架40。

公开(公告)号：US5439161A

公开(公告)日：1995-08-08

申请号：US301389

申请日：1994-09-07

Applicant: Norio Kawatani ,  Iwao Ichikawa ,  Kazuaki Suzuki ,  Yukio Yamada

Inventor： Norio Kawatani ,  Iwao Ichikawa ,  Kazuaki Suzuki ,  Yukio Yamada

IPC: G02F1/13 ,  G02F1/1345 ,  H01L21/00 ,  H01L21/603

CPC classification number: H01L21/67138 ,  H01L24/80 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/14

Abstract: A thermocompression bonding apparatus wherein object parts can be connected with a high degree of accuracy by thermocompression bonding and the entire apparatus is not deformed readily by a high pressure and a member of a large size can be connected at a fine pitch with a high degree of accuracy. The thermocompression bonding apparatus is constructed so as to bond a first member to a second member by thermocompression bonding and comprises a base member, a holding device for holding the second member thereon, a heat generation element for applying heat to the first member, and a pressurization member for pressing the heat generation element against the first member and the second member. The holding device, the heat generation element and the pressurization member are disposed mechanically separately from the base member. Also a thermocompression bonding method and a process of manufacturing a liquid crystal display device which are performed using the thermocompression bonding apparatus are disclosed.

Abstract translation: 一种热压接装置，其中通过热压接可以高精度地连接对象部分，并且整个装置不会由于高压而容易地变形，并且可以以高度的细度将大尺寸的部件连接在一起 准确性。 热压接装置被构造成通过热压接将第一构件结合到第二构件，并且包括基座构件，用于将第二构件保持在其上的保持装置，用于向第一构件施加热量的发热元件，以及 加压构件，用于将发热元件按压在第一构件和第二构件上。 保持装置，发热元件和加压构件与基座构件分开设置。 还公开了使用热压接装置进行的热压接方法和制造液晶显示装置的方法。

公开(公告)号：US5189520A

公开(公告)日：1993-02-23

申请号：US660786

申请日：1991-02-25

Applicant: Yoshisada Okayasu ,  Toshiyuki Yamauchi ,  Akinari Mori ,  Naoki Kamaya ,  Naoki Okayama ,  Takanori Maruichi ,  Junichi Iwasawa ,  Yukio Yamada ,  Renjiro Okano

Inventor： Yoshisada Okayasu ,  Toshiyuki Yamauchi ,  Akinari Mori ,  Naoki Kamaya ,  Naoki Okayama ,  Takanori Maruichi ,  Junichi Iwasawa ,  Yukio Yamada ,  Renjiro Okano

IPC: H04N5/225

CPC classification number: H04N5/2251 ,  Y10S358/906

Abstract: An adapter pack is constructed so that it can be connected to a video camera via the site via which the battery pack is normally connected. The adapter pack is itself provided with a mounting site on which the battery pack can be connected. This construction allows the adapter pack to be operatively "sandwiched" between the battery pack and the camera. The adapter pack is arranged to permit the power from the battery pack to be supplied both to its own circuitry and therethrough to the camera.

公开(公告)号：US5125509A

公开(公告)日：1992-06-30

申请号：US722399

申请日：1991-06-20

Applicant: Kazuhiro Takei ,  Yukio Yamada ,  Kenichi Hanaoka ,  Toshitsugu Yajima

Inventor： Kazuhiro Takei ,  Yukio Yamada ,  Kenichi Hanaoka ,  Toshitsugu Yajima

IPC: B65D21/02 ,  B65D21/00 ,  H01L21/673

CPC classification number: H01L21/67356

Abstract: A container of substantially rectangular cross section is formed of synthetic resin and comprises a container body and a lid member to be detachably mounted to the container body. The container body is provided with longitudinal and lateral side walls and a bottom wall and is capable of being molded as a single piece and thereafter foldable into a container. A locking device for locking the container body and the lid member is located on an outer surface of a side wall of the container body and on a corresponding inner surface of a side wall of the lid. The locking member comprises projections extending outwardly from outer surfaces of the lateral side walls of the container body and corresponding recesses extending inwardly from inner surfaces of the lateral side walls of the lid member. A pair of the longitudinal side walls of the lid member are provided with projected portions formed on upper edges thereof and with recessed portions formed on lower edges thereof, wherein each recessed portion formed so as to have an inner shape corresponding to an outer shape of each projected portion. Projecting pieces are formed on the inner surfaces of the lateral side walls of the container body for abutting against and supportably fixing the contents, which have an outer perimeter surface area smaller than a surface area of the bottom wall of the container body.

Abstract translation: 大致矩形截面的容器由合成树脂形成，并且包括容器主体和可拆卸地安装到容器主体上的盖构件。 容器主体设置有纵向和侧向侧壁和底壁，并且能够被模制成单件，然后可折叠成容器。 用于锁定容器主体和盖构件的锁定装置位于容器主体的侧壁的外表面上并且位于盖的侧壁的相应内表面上。 锁定构件包括从容器主体的侧壁的外表面向外延伸的凸起和从盖构件的侧壁的内表面向内延伸的对应的凹部。 盖构件的一对纵向侧壁设置有形成在其上边缘上的突出部分和形成在其下边缘上的凹部，其中每个凹部形成为具有与每个的外部形状对应的内部形状 投影部分。 在容器主体的侧壁的内表面上形成有突出部件，用于抵靠并可支撑地固定外周表面面积小于容器主体底壁表面积的内容物。

公开(公告)号：US5038496A

公开(公告)日：1991-08-13

申请号：US385160

申请日：1989-07-26

Applicant: Haruo Mishina ,  Shinya Yamama ,  Yukio Yamada ,  Keizo Tsuchiya

Inventor： Haruo Mishina ,  Shinya Yamama ,  Yukio Yamada ,  Keizo Tsuchiya

IPC: B23K1/015

CPC classification number: B23K1/015

Abstract: A vapor reflow type soldering apparatus comprises a vapor generating tank disposed substantially centrally in the apparatus for receiving therein a thermal medium and saturated vapor of said thermal medium; a preheating chamber arranged upstream of the vapor generating tank; a cooling chamber arranged downstream of the vapor generating tank; an inlet side passage connecting the vapor generating tank and the preheating chamber; an outlet side passage connecting the vapor generating tank and the cooling chamber; a conveyor extending horizontally through the preheating chamber, the inlet side passage, the vapor generating tank, the outlet side passage and the cooling chamber, wherein the conveyor can vary the width thereof; an outlet side exhaust port provided at the outlet side passage; an inlet side cooler arranged beneath the inlet side passage and having a cover at an upper position thereof; an outlet side cooler arranged beneath the outlet side passage and extending close to the outlet side exhaust port; a lower vapor discharge opening formed below the conveyor within the vapor generating tank; and a shutter connected with a movable conveyor guide and also with the peripheral part of the lower vapor discharge opening, whereby the opening area of said lower vapor discharge opening can be varied as the movable conveyor guide is moved widthwise.

Abstract translation: 蒸汽回流型焊接装置包括蒸发发生罐，其基本上设置在该装置中的中间，用于在其中容纳热介质和所述热介质的饱和蒸气; 预热室，其布置在所述蒸汽发生罐的上游; 布置在蒸汽发生罐下游的冷却室; 连接蒸汽发生罐和预热室的入口侧通道; 连接蒸汽发生罐和冷却室的出口侧通道; 输送机横向延伸穿过预热室，入口侧通道，蒸汽发生罐，出口侧通道和冷却室，其中输送机可以改变其宽度; 出口侧排气口，设置在出口侧通道; 入口侧冷却器，其布置在入口侧通道下方并且在其上部位置具有盖; 出口侧冷却器，布置在出口侧通道下方并且靠近出口侧排气口延伸; 在蒸汽发生罐内形成在输送机下面的较低蒸汽排放口; 以及与可移动的输送机引导件连接并且还与下部蒸汽排出口的周边部分连接的闸门，由此可移动的输送机引导件沿宽度方向移动，所述下部蒸汽排出口的开口面积可以变化。