公开(公告)号：US5150827A

公开(公告)日：1992-09-29

申请号：US796208

申请日：1991-11-22

申请人： William M. Fries

发明人： William M. Fries

IPC分类号： B23K3/047 ,  B29C65/00

CPC分类号： B23K3/0471 ,  B29C65/02 ,  B29C66/8163

摘要： A reflow solder head has its heater bar (30) mounted so as to cause the heater bar to contact a tilted reflow surface (50) and align itself with the tilted surface without tip skid. The heater bar is mounted to its movable drive ram (40) by two independent pivots (36,42), both nominally positioned on a line normal to and in the center of the heater bar itself. The first pivot (36) closer to the heater bar allows the heater bar to rotate about its first point of contact (54) with the tilted reflow surface. The second pivot (42) allows lateral movement of the first pivot (36) without tip skid during the rotation of the heater bar about its first point of contact. This double pivot mechanism eliminates the tendency of the heater bar to skid along the reflow surface.

摘要翻译： 回流焊头具有其加热棒（30），其安装成使得加热棒接触倾斜的回流表面（50），并使其自身与倾斜的表面对准，而没有尖端滑动。 加热器杆通过两个独立的枢轴（36,42）安装到其可移动的驱动柱塞（40）上，两个标称位于加热棒本身的法线上和中心的直线上。 更靠近加热棒的第一枢轴（36）允许加热棒围绕其第一接触点（54）以倾斜的回流表面旋转。 第二枢轴（42）允许第一枢轴（36）的横向移动，而不会在加热器棒绕其第一接触点旋转期间引起滑动。 这种双重枢转机构消除了加热棒沿回流表面滑动的趋势。

公开(公告)号：US5068510A

公开(公告)日：1991-11-26

申请号：US506922

申请日：1990-04-10

申请人： Rudolf Schuster

发明人： Rudolf Schuster

IPC分类号： B23K3/02 ,  B23K3/04 ,  B23K3/047 ,  H05K13/04 ,  B23K3/03 ,  B23K35/02

CPC分类号： H05K13/0465 ,  B23K3/0471

摘要： A soldering device comprising at least one strip electrode which can be electrically heated and wherein so as to avoid thermal deformation and to assure good contact between the stirrup electrode (B) and the soldering joint wherein at the outer ends of the soldering strip (Ls) of the stirrup electrode (B) is closed expansion-compensation guards (AK) are provided which are U-shaped and which are attached to the soldering strip (Ls). Vertically extending retaining strips (Hs) are attached to the ends of the expansion-compensation guards (AK) so as to provide soldering which is particularly suitable for soldering high-pole electronic components on a PC board. The two retaining strips (Hs) may be approximately one-half the length of soldering strip.

摘要翻译： 一种焊接装置，包括至少一个能够被电加热的带状电极，并且其中以避免热变形并且确保所述镫形电极（B）和所述焊接接头之间的良好接触，其中在所述焊接条（Ls）的外端处， 提供了镫形电极（B）的闭合的膨胀补偿保护件（AK），其为U形并且连接到焊接条（Ls）。 垂直延伸的保持条（Hs）连接到膨胀补偿保护件（AK）的端部，以提供特别适合于焊接PC板上的高极电子部件的焊接。 两个保持条（Hs）可以是焊接长度的大约一半。

公开(公告)号：US5066844A

公开(公告)日：1991-11-19

申请号：US587793

申请日：1990-09-25

申请人： Rudolf Schuster ,  Josef Raschke

发明人： Rudolf Schuster ,  Josef Raschke

IPC分类号： B23K3/00 ,  B23K3/02 ,  B23K3/04 ,  B23K3/047 ,  H01R43/02 ,  H05K3/30 ,  H05K3/34 ,  H05K13/04

CPC分类号： B23K3/0471 ,  H05K13/0465 ,  H05K3/3421 ,  H05K2203/0195 ,  H05K2203/082 ,  H05K3/303 ,  Y02P70/613

摘要： A soldering device has two or four stirrup electrodes secured to a soldering stirrup holder and a centrally-arranged suction pipette between the stirrup electrodes for picking up, conveying and placing components onto assigned soldering locations. Sensitive mechanical and electrical parts, particularly machanical guides and electrical contacts are protected against undesired precipitation of soldering vapors that arise during the soldering process. This protection is achieved by an extraction device for solder vapors which includes an annular extraction opening between the suction pipette and the soldering stirrup holder. The extraction opening discharges into an extraction chamber arranged above the soldering stirrup holder and is in communication with at least one extraction port.

摘要翻译： 焊接装置具有固定到焊接镫形支架的两个或四个镫形电极和位于镫形电极之间的居中设置的吸移管，用于拾取，输送和将部件放置在所分配的焊接位置上。 敏感的机械和电气部件，特别是机械引导件和电触点被保护，防止在焊接过程中出现的焊接蒸汽的不期望的沉淀。 该保护通过用于焊料蒸气的提取装置来实现，其包括吸入吸管和焊接马镫支架之间的环形抽出开口。 提取开口排放到布置在焊接马镫支架上方的提取室中，并与至少一个提取口连通。

公开(公告)号：US5016804A

公开(公告)日：1991-05-21

申请号：US459946

申请日：1990-01-02

申请人： Rudolf Schuster ,  Georg Ketzer

发明人： Rudolf Schuster ,  Georg Ketzer

IPC分类号： B23K3/047 ,  H05K3/34

CPC分类号： B23K3/0471 ,  H05K3/3421 ,  H05K3/3494

摘要： The soldering apparatus using at least one resistance heated stirrup electrode that is place onto soldering locations on a printed circuit board includes a pivotable suspension of the stirrup electrode. The pivotable suspension is such that a dislocated rotational axis of pivotable suspension lies in a plane of the working surface and extends perpendicular to a long side of the rectangular working surface of electrode and at the center thereof. The working surface of the stirrup electrode thus achieves reliable contact with parts to be soldered. Embodiments having two or four soldering stirrups, each individually pivotly suspended, are also possible.

摘要翻译： 使用位于印刷电路板上的焊接位置上的至少一个电阻加热镫形电极的焊接装置包括镫形电极的可枢转的悬挂。 可枢转悬架使得可枢转悬架的位错旋转轴线位于工作表面的平面中，并且垂直于电极的矩形工作表面的长边和其中心延伸。 因此，镫形电极的工作面能够与要焊接的部件可靠地接触。 具有两个或四个焊接马镫的实施例，每个单独枢转悬挂也是可能的。

公开(公告)号：US4892995A

公开(公告)日：1990-01-09

申请号：US195137

申请日：1988-05-17

申请人： Bienvenido Del Pino Millan

发明人： Bienvenido Del Pino Millan

IPC分类号： B23K1/018 ,  B23K3/047

CPC分类号： B23K3/0471 ,  B23K1/018

摘要： Automatic portable unsolderer consisting of a solenoid supplied by alternating current, a cylinder whose piston has a rod consisting the core of said solenoid, including too a reservoir and a heating member, all of them axially engaged as above-mentioned. Through the heating member end, the material that has to be unsoldered is melted and through operation of the solenoid, the piston draws back and suctions said material, which is collected, in a solid condition, in the reservoir which includes a retaining member, easily removable, and a threaded plug. On the outlet of the reservoir a one-way valve is disposed so that the air compressed by the piston, through a return spring that encircles the rod, doesn't flow through the suction conduct avoiding in such manner that the air can drag soldering material particles. The ejected air is by-passed through a side hole provided with a one-way valve that is reversely oriented.

摘要翻译： 由通过交流电供应的螺线管组成的自动便携式非开瓶器，其活塞具有由所述螺线管的芯构成的杆的气缸，其也包括储存器和加热构件，所有这些都如上所述轴向接合。 通过加热构件端部，必须不被软管的材料熔化并且通过螺线管的操作，活塞将所述材料以固体状态吸收并吸收在包括保持构件的容器中，容易地吸收 可拆卸和螺纹插头。 在储存器的出口处设置有单向阀，使得由活塞压缩的空气通过围绕杆的复位弹簧不会流过吸入管道，避免空气能够拖动焊接材料 粒子。 排出的空气被旁通，设置有反向取向的单向阀的侧孔。

公开(公告)号：US4648543A

公开(公告)日：1987-03-10

申请号：US620128

申请日：1984-06-13

申请人： Eggert Herrmann

发明人： Eggert Herrmann

IPC分类号： H05K3/34 ,  B23K3/00 ,  B23K3/03 ,  B23K3/047 ,  B23K3/04

CPC分类号： B23K3/0471 ,  B23K3/03 ,  H05K3/3421 ,  H05K3/3494

摘要： A device for fastening by soldering an element having a plurality of laterally projecting, substantially coplanar connecting wires to a print plate comprising a bracket holder capable of performing a movement in a direction substantially perpendicular to the surface of the print plate and comprising a bracket heated, for example, by electric current, to the desired soldering temperature and practically simultaneously soldering all connections at the correct places of the print substrate during the movement of the bracket holder; wherein the bracket holder comprises a part carrying the soldering bracket and a part connected with a mechanism for producing the movement of the bracket holder, the parts bearing one on the other by concentric spherical surfaces and being held in contact with one another solely by spring force.

摘要翻译： 一种用于通过将具有多个横向突出的基本上共面的连接线的元件焊接到印刷板上的用于紧固的装置，所述印刷板包括支架保持器，所述支架保持器能够在基本上垂直于所述印刷板的表面的方向上执行移动，并且包括加热的支架， 例如通过电流，达到期望的焊接温度，并且在支架保持器的运动期间实际上同时焊接印刷基板的正确位置处的所有连接; 其中托架支架包括承载焊接托架的部件和与用于产生托架支架运动的机构相连的部件，该部件通过同心球面彼此承载，并且仅通过弹簧力相互保持接触 。

公开(公告)号：US4412123A

公开(公告)日：1983-10-25

申请号：US148505

申请日：1980-05-09

申请人： Hans H. Ammann ,  Rocco Bonanni ,  Werner Engelmaier

发明人： Hans H. Ammann ,  Rocco Bonanni ,  Werner Engelmaier

IPC分类号： B23K3/047 ,  H05B3/10 ,  B23K3/02 ,  H05B3/00

CPC分类号： B23K3/0471 ,  H05B3/10

摘要： An electrically heated soldering device adapted to simultaneously heat a plurality of spaced electrical elements in a reflow soldering operation includes an elongated metal laminate of substantially U-shaped cross section having a bight portion between two side portions which may be parallel or divergent. The laminate includes a layer of aluminum between a layer of copper and a layer of stainless steel, with the layers being roll bonded together. The copper and aluminum layers are removed at the bight portion to expose the stainless steel layer and form a heat generating zone for contacting the plurality spaced electrical elements which is corrosion resistant and nonwettable by solder. The edges of the copper and aluminum layers adjacent to the exposed stainless steel bight portion are shaped to impart a selectable temperature profile, either uniform or non-uniform along the length of the bight portion. The exposed surface of the stainless steel portion can be provided with a ceramic coating to electrically insulate bight portion from the elements to be soldered. The legs of the U-shaped laminate are adapted to be connected to an electric power source through the copper and aluminum layers thereof.

摘要翻译： 适于在回流焊接操作中同时加热多个间隔的电气元件的电加热焊接装置包括具有大致U形横截面的细长金属层压体，其具有可以平行或发散的两个侧部之间的弯曲部分。 该层压板包括一层铜层与一层不锈钢之间的铝层，其中层层压在一起。 铜和铝层在弯曲部分被去除以暴露不锈钢层并且形成用于接触多个间隔开的电气元件的发热区域，该电气元件是耐腐蚀的并且通过焊料不可润湿。 与暴露的不锈钢弯曲部分相邻的铜和铝层的边缘被成形为沿着弯曲部分的长度赋予可选择的温度分布，均匀或不均匀。 不锈钢部分的暴露表面可以设置有陶瓷涂层，以将弯曲部分与要焊接的元件电绝缘。 U形层压体的腿部通过其铜和铝层连接到电源。

公开(公告)号：US4081658A

公开(公告)日：1978-03-28

申请号：US681264

申请日：1976-04-28

申请人： Hans Hugo Ammann

发明人： Hans Hugo Ammann

IPC分类号： B23K3/047 ,  H05B3/00 ,  B23K3/02

CPC分类号： B23K3/0471

摘要： A tool adapted to simultaneously heat a plurality of spaced electrical elements for soldering includes an elongated heat generating member connected between spaced, parallel, relatively massive and high conductivity rectangular cross section bars. An arcuate lower portion of the heat generating member disposed between the bars is adapted to contact the surface to be soldered. Electrical current applied to one end of one bar and to the opposite end of the other bar is directed uniformly through the heat generating member transverse to the elongated dimension thereof to provide a uniform temperature to all the spaced elements. Upon discontinuation of the electrical current the relatively massive bars are operative to rapidly remove heat from the heat generating member.

公开(公告)号：US3576969A

公开(公告)日：1971-05-04

申请号：US3576969D

申请日：1969-09-02

申请人： IBM

发明人： SURTY ROHINTON J ,  TROLLMANN CONRAD

IPC分类号： B23K3/047 ,  H01L21/00 ,  H05K3/34 ,  B23K3/02 ,  H05B3/10

CPC分类号： H01L21/67144 ,  B23K3/0471 ,  H05K3/3421 ,  H05K3/3494 ,  Y10T29/49121 ,  Y10T29/49144 ,  Y10T29/49155

摘要： Disclosed is a device for simultaneously soldering numerous integrated circuit chip leads to a circuit board. The device is characterized by having a heating tip made of refractory, electrically insulative, thermally conductive, material. Fused to this tip is a coat of penetrating metallic paste. The paste is disposed on the tip in an electrically continuous path. Heating is accomplished by passing current through this metallic paste path.

公开(公告)号：US1026456A

公开(公告)日：1912-05-14

申请号：US1912678543

申请日：1912-02-19

申请人： RAMBAUD GEORGE G

发明人： RAMBAUD GEORGE G

CPC分类号： B23K3/0471