摘要:
A metal matrix composite is disclosed that includes graphene nanoplatelets dispersed in a metal matrix. The composite provides for improved thermal conductivity. The composite may be formed into heat spreaders or other thermal management devices to provide improved cooling to electronic and electrical equipment and semiconductor devices.
摘要:
A heat pipe includes an evaporation section, a condensation section and a connecting section connecting with the evaporation section and the condensation section. The evaporation section defines a plurality of dents at an outer wall thereof to increase rough degree of the outer wall of the evaporation section. The dents are provided to prevent solder from separation from the evaporation section during soldering process soldering the evaporation section to a heat sink.
摘要:
In an embodiment of the invention, a slot is disposed at a side of a fin. Both sides of the slot separately extend two positioning portions. After a heat pipe is placed in the slot, a mold presses the fin to make the positioning portions bent inwards. The heat pipe is gripped by the deformed positioning portions. In another embodiment, peripheries of the positioning portions are formed into guiding grooves separately, and the mold is provided with two protrusions corresponding to the guiding grooves. The guiding grooves are inserted by the protrusions when the mold is pressing the fin. The part between the positioning portions and slot is inwards deformed to grip the heat pipe.
摘要:
A method (100) and an apparatus for manufacturing a heat-dissipation device (10) with a vacuum chamber and a working fluid therein are disclosed. The method includes the following steps: vacuuming a hollow metal casing (12) through a first open end (121) thereof until an interior of the casing reaches a predetermined vacuum degree; sealing the first open end; filling a predetermined quantity of working fluid into the casing through a second open end (123) thereof; and sealing the second open end. The apparatus includes a vacuum pump, a liquid-storage tank and a set of processing device, as used respectively for the above vacuuming, liquid-filling and sealing steps. By this apparatus, the heat-dissipation device can be manufactured at a same place without the requirement to shift the casing from one place to another place during the manufacture of the heat-dissipation device.
摘要:
A method for manufacturing a plate-type heat pipe includes the steps of: offering a top plate, a base plate, a wick structure adhered to the base plate; securing the top plate onto the base plate to make the top plate contact with the base plate; offering a microwave oven which includes a cover and a heating member located at a center portion of the cover, the cover defining an opening at a side thereof to allow microwave to enter the cover, the heating member defining a chamber; putting the secured top and base plates into the chamber of the heating member and turning on the microwave oven to make the microwave produced by the microwave oven enter the cover, the heating member absorbing the microwave and transforming the microwave to heat energy to heat the plate-type heat pipe, whereby the base and top plates are heated and hermetically assembled together.
摘要:
A heat pipe includes a body with working fluid contained therein and a sealing structure forming on an end of the body. The sealing structure includes a single layer sealing portion formed at a distal end thereof. The sealing structure further comprises a two layer sealing portion connecting the single layer sealing portion to the body. The single layer and two layer sealing portions and the body are made of the same metallic material. A method for sealing the heat pipe, includes the steps of: (1) providing a metallic pipe with an end sealed and an opposite open portion; (2) pressing the open portion of the pipe to form a two layer sealing portion; (3) melting at least one part of the two layer sealing portion to form a single layer sealing portion.
摘要:
A sealed structure of a circular tubular heat pipe is formed on a distal opening of a heat pipe. A pressed recess portion recessed inwards from one side of a wall portion is formed on the distal opening. The wall portion of the distal opening is pressed from the pressed recess portion to the other side of the wall portion and is sealed therewith, thereby forming a flattened section of the heat pipe. The flattened section deflects toward one side of the body of the heat pipe, and it has two wing portions bending obliquely toward the pressed recess portion. The tip of one of the wing portions is brought into contact with the outside of the tip of the other wing portion, so that the flattened section forms a curled portion that reduces gradually from bottom to top.
摘要:
A method for embedding a heat pipe into a slot of heat-conducting seat is disclosed. The method has the exposed portion of the heat pipe be flat and coplanar with the surface of the heat-conducting seat after the heat pipe is embedded into the slot of the seat. The method utilizes a power press machine with multiple stamping dies to progressively press the heat pipe.
摘要:
A heat dissipation device includes a heat sink (10) and a first heat pipe (20) enclosing a bottom edge of the heat sink. The heat sink includes a base (12) defining a first passage (120) extending therethrough. The first heat pipe includes a first transferring section (22) extending in the first passage and totally embedded in the base and a pair of first dissipating sections (24) extending from the first transferring section. The first dissipating sections of the first heat pipe are attached on an outer periphery of the base. The first transferring section of the first heat pipe absorbs heat in the middle of the base and transfers it to the first dissipating sections to evenly distribute the heat throughout the whole base.