PREFERENTIALLY DEPOSITED LUBRICANT TO PREVENT ANTI-STICTION IN MICROMECHANICAL SYSTEMS
    71.
    发明申请
    PREFERENTIALLY DEPOSITED LUBRICANT TO PREVENT ANTI-STICTION IN MICROMECHANICAL SYSTEMS 有权
    优选沉积润滑剂以防止微生物系统中的反抗

    公开(公告)号:US20070117244A1

    公开(公告)日:2007-05-24

    申请号:US11556145

    申请日:2006-11-02

    CPC classification number: B81C1/0096 B81B3/0005 B81C2201/112 B82Y30/00

    Abstract: Embodiments of the present invention generally relate to a device that has an improved usable lifetime due to the presence of a lubricant that reduces the likelihood of stiction occurring between the various moving parts in an electromechanical device. Embodiments of the present invention also generally include a device, and a method of forming a device, that has one or more surfaces or regions that have a volume of lubricant disposed thereon that acts as a ready supply of “fresh” lubricant to prevent stiction occurring between interacting components found within the device. In one aspect, components within the volume of lubricant form a gas or vapor phase that reduces the chances of stiction-related failure in the formed device. In one example, aspects of this invention may be especially useful for fabricating and using micromechanical devices, such as MEMS devices, NEMS devices, or other similar thermal or fluidic devices.

    Abstract translation: 本发明的实施例总体上涉及一种由于存在降低在机电装置中的各种运动部件之间出现静电的可能性的润滑剂而具有改善的使用寿命的装置。 本发明的实施例还通常包括一种装置和一种形成装置的方法,其具有一个或多个表面或区域,其具有设置在其上的润滑剂体积,其用作即将供应的“新鲜”润滑剂以防止发生粘连 在设备内发现的互动组件之间。 在一个方面,润滑剂体积内的组分形成气体或气相,其降低了所形成的装置中与静电相关的故障的机会。 在一个示例中,本发明的方面对于制造和使用诸如MEMS器件,NEMS器件或其它类似的热或流体器件的微机械器件可能特别有用。

    Method of operating a micromechanical device that contains anti-stiction gas-phase lubricant
    72.
    发明申请
    Method of operating a micromechanical device that contains anti-stiction gas-phase lubricant 有权
    操作含有抗静电气相润滑剂的微机械装置的方法

    公开(公告)号:US20070115531A1

    公开(公告)日:2007-05-24

    申请号:US11389423

    申请日:2006-03-24

    Abstract: One embodiment of an micromechanical device includes a first contact surface, a moveable component having a second contact surface, where the second contact surface interacts with the first contact surface during device operation, and a gas-phase lubricant disposed between the first contact surface and the second contact surface, where the gas-phase lubricant is adapted to reduce stiction-related forces between the first contact surface and the second contact surface. One advantage of the disclosed device is that a gas-phase lubricant has a high diffusion rate and, therefore, is self-replenishing, meaning that it can quickly move back into a contact region after being physically displaced from the region by the contacting surfaces of the device during operation. Consequently, the gas-phase lubricant is more reliable than conventional solid or liquid lubricants in preventing stiction-related device failures.

    Abstract translation: 微机械装置的一个实施例包括第一接触表面,具有第二接触表面的可移动部件,其中第二接触表面在器件操作期间与第一接触表面相互作用,以及气相润滑剂,其设置在第一接触表面和 第二接触表面,其中气相润滑剂适于减小第一接触表面和第二接触表面之间的静摩擦力。 所公开的装置的一个优点是气相润滑剂具有高扩散速率,因此是自补充的,这意味着它可以在通过接触区域的接触表面物理移位之后迅速地移回接触区域 该设备在运行期间。 因此,气相润滑剂比传统的固体或液体润滑剂在防止与静脉相关的装置故障方面更可靠。

    System and method of providing a regenerating protective coating in a MEMS device
    73.
    发明申请
    System and method of providing a regenerating protective coating in a MEMS device 失效
    在MEMS器件中提供再生保护涂层的系统和方法

    公开(公告)号:US20060077150A1

    公开(公告)日:2006-04-13

    申请号:US11134028

    申请日:2005-05-20

    Inventor: Jeffrey Sampsell

    Abstract: In various embodiments of the invention, a regenerating protective coating is formed on at least one surface of an interior cavity of a MEMS device. Particular embodiments provide a regenerating protective coating on one or more mirror surfaces of an interferometric light modulation device, also known as an iMoD in some embodiments. The protective coating can be regenerated through the addition of heat or energy to the protective coating.

    Abstract translation: 在本发明的各种实施例中,在MEMS器件的内腔的至少一个表面上形成再生保护涂层。 具体实施例在一些实施例中在干涉式光调制装置的一个或多个镜面上提供再生保护涂层,也称为iMoD。 保护涂层可以通过加热或能量再生到保护涂层上。

    Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
    74.
    发明授权
    Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants 有权
    通过用多个顺序蚀刻剂去除牺牲层来制造微机械装置的方法

    公开(公告)号:US06800210B2

    公开(公告)日:2004-10-05

    申请号:US10154150

    申请日:2002-05-22

    Abstract: An etching method, such as for forming a micromechanical device, is disclosed. One embodiment of the method is for releasing a micromechanical structure, comprising, providing a substrate; providing a sacrificial layer directly or indirectly on the substrate; providing one or more micromechanical structural layers on the sacrificial layer; performing a first etch to remove a portion of the sacrificial layer, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of the sacrificial layer; performing a second etch to remove additional sacrificial material in the sacrificial layer, the second etch comprising providing a gas that chemically but not physically etches the additional sacrificial material. Another embodiment of the method is for etching a silicon material on or within a substrate, comprising: performing a first etch to remove a portion of the silicon, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of silicon; performing a second etch to remove additional silicon, the second etch comprising providing an etchant gas that chemically but not physically etches the additional silicon.

    Abstract translation: 公开了一种诸如用于形成微机械装置的蚀刻方法。 该方法的一个实施例是用于释放微机械结构,包括:提供衬底; 在衬底上直接或间接提供牺牲层; 在所述牺牲层上提供一个或多个微机械结构层; 执行第一蚀刻以去除牺牲层的一部分,所述第一蚀刻包括提供蚀刻剂气体并激发蚀刻剂气体,以允许蚀刻剂气体在物理或化学和物理上移除牺牲层的该部分; 执行第二蚀刻以去除牺牲层中的附加牺牲材料,第二蚀刻包括提供化学上但不物理蚀刻附加牺牲材料的气体。 该方法的另一实施例是用于在衬底上或衬底内蚀刻硅材料,包括:执行第一蚀刻以去除硅的一部分,第一蚀刻包括提供蚀刻剂气体并激发蚀刻剂气体以允许蚀刻剂 物理或化学和物理的气体去除硅的部分; 执行第二蚀刻以去除附加的硅,第二蚀刻包括提供蚀刻剂气体,其化学地但不物理地蚀刻附加的硅。

    Micromachine and manufacturing method therefor
    76.
    发明申请
    Micromachine and manufacturing method therefor 审中-公开
    微机械及其制造方法

    公开(公告)号:US20030227035A1

    公开(公告)日:2003-12-11

    申请号:US10446374

    申请日:2003-05-28

    CPC classification number: B81B3/0008 B81B2201/045 B81C2201/112

    Abstract: In a micromachine according to this invention, a polyimide film is formed on the surface of each electrode. The polyimide film is formed as follows. A substrate having each electrode and a counterelectrode are dipped in an electrodeposition polyimide solution, and a positive voltage is applied to the electrode. A material dissolved in the electrodeposition polyimide solution is deposited on a surface of the positive-voltage-applied electrode that is exposed in the solution, thus forming a polyimide film on the surface.

    Abstract translation: 在根据本发明的微型机器中,在每个电极的表面上形成聚酰亚胺膜。 聚酰亚胺膜如下形成。 将具有每个电极和反电极的基板浸渍在电沉积聚酰亚胺溶液中,并向电极施加正电压。 溶解在电沉积聚酰亚胺溶液中的材料沉积在暴露在溶液中的正电压施加电极的表面上,从而在表面上形成聚酰亚胺膜。

    Electrostatically charged microstructures
    77.
    发明授权
    Electrostatically charged microstructures 失效
    静电荷微结构

    公开(公告)号:US06597048B1

    公开(公告)日:2003-07-22

    申请号:US09828991

    申请日:2001-04-10

    Applicant: Edwin C. Kan

    Inventor: Edwin C. Kan

    CPC classification number: B81B3/0008 B81C1/00976 B81C2201/112 G11C23/00

    Abstract: A process and apparatus for injecting electrostatic charges into opposing elements of MEMS structures to produce repulsing forces between the elements. These forces tend to produce controlled spacing between components to prevent sticking and to provide friction-free relative movement.

    Abstract translation: 一种用于将静电电荷注入到MEMS结构的相对元件中以在元件之间产生排斥力的工艺和装置。 这些力倾向于在部件之间产生受控的间隔,以防止粘附并提供无摩擦的相对运动。

    Method of manufacturing acceleration sensor
    78.
    发明申请
    Method of manufacturing acceleration sensor 失效
    制造加速度传感器的方法

    公开(公告)号:US20030124786A1

    公开(公告)日:2003-07-03

    申请号:US10308029

    申请日:2002-12-03

    Abstract: Provided is a method of manufacturing an acceleration sensor capable of preventing bonding of a movable electrode and a fixed electrode. A stain film 8 for reducing bonding adsorption force is formed on side surfaces of a movable electrode 1, fixed electrodes 2a and 2b and a frame portion 7. In the case in which the movable electrode 1 and the fixed electrodes 2a and 2b are to be formed of a silicon substrate, it is preferable that an insulating film having irregular bonding of silicon atoms and oxygen atoms and irregular bonding of silicon atoms and nitrogen atoms should be employed for the stain film 8, for example. The formation of the stain film 8 can suppress the bonding between the movable electrode 1 and the fixed electrodes 2a and 2b even if Coulomb force is generated between both electrodes when the silicon substrate and a back side substrate 4 are joined by using an anode junction method.

    Abstract translation: 提供一种制造能够防止可动电极和固定电极的接合的加速度传感器的方法。 在可动电极1,固定电极2a,2b和框架部分7的侧面上形成用于降低结合吸附力的污渍膜8.在可动电极1和固定电极2a和2b将成为 由硅基板形成,例如,优选使用具有硅原子和氧原子的不规则键合的绝缘膜以及硅原子和氮原子的不规则键合。 即使通过使用阳极接合方法将硅基板和背面基板4接合时,即使在两个电极之间产生库仑力也可以抑制可动电极1和固定电极2a和2b之间的接合 。

    Etch process for etching microstructures
    80.
    发明申请
    Etch process for etching microstructures 失效
    用于蚀刻微结构的蚀刻工艺

    公开(公告)号:US20030071015A1

    公开(公告)日:2003-04-17

    申请号:US10265598

    申请日:2002-10-08

    Abstract: A two-step method of releasing microelectromechanical devices from a substrate is disclosed. The first step comprises isotropically etching a silicon oxide layer sandwiched between two silicon-containing layers with a gaseous hydrogen fluoride-water mixture, the overlying silicon layer to be separated from the underlying silicon layer or substrate for a time sufficient to form an opening but not to release the overlying layer, and the second step comprises adding a drying agent to substitute for moisture remaining in the opening and to dissolve away any residues in the opening that can cause stiction.

    Abstract translation: 公开了一种从基板释放微机电装置的两步法。 第一步包括用夹杂在两个含硅层之间的氧化硅层与氟化氢 - 水气体混合物进行各向同性蚀刻,所述上层硅层将从底层硅层或衬底分离足以形成开口但不 以释放上覆层,第二步骤包括加入干燥剂以代替残留在开口中的水分,并溶解开口中可能导致静电的残留物。

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