Polyimide foam precursor and its use in reinforcing open-cell materials

    公开(公告)号:US4830883A

    公开(公告)日:1989-05-16

    申请号:US209757

    申请日:1988-06-22

    申请人: Kyu W. Lee

    发明人: Kyu W. Lee

    摘要: Open-cell structures are filled with polyimide foam formed in place by the use of a foam precursor in powdered form comprised of a combination of (a) the reaction product of an excess of organic polyisocyanate and a member selected from the group consisting of furfuryl alcohol and condensation products thereof, and (b) an organic polycarboxylic compound containing two carboxylic anhydride groups. The precursor is prepared by combining the species under conditions which favor the reaction of the furfuryl alcohol with the polyisocyanate, but not the polyimide-forming reaction. The polyimide-forming reaction itself is then performed by adding preselected amounts of the powdered precursor, depending on the desired ultimate density of the foam, to each cell of the open-cell structure, then heating to initiate the polyimide reaction, and permitting the carbon dioxide generated by the reaction to escape while confining the resulting foam to the cells.

    Preparation of polyamideimide from diisocyanate with alkali metal
lactamate catalyst
    72.
    发明授权
    Preparation of polyamideimide from diisocyanate with alkali metal lactamate catalyst 失效
    用二异氰酸酯与碱金属氨基甲酸酯催化剂制备聚酰胺酰亚胺

    公开(公告)号:US4094864A

    公开(公告)日:1978-06-13

    申请号:US769312

    申请日:1977-02-17

    申请人: Besir K. Onder

    发明人: Besir K. Onder

    摘要: The use of certain catalysts provide for an improved process for the preparation of soluble polyimides, polyamides, and polyamideimides. The catalysts are compounds of formula ##STR1## WHEREIN M represents an alkali metal, and n is an integer from 2 to 5 inclusive. The improved process comprises reacting organic diisocyanates with polycarboxylic compounds consisting of tetracarboxylic acids or the intramolecular dianhydrides thereof, tricarboxylic acids or the monoanhydrides thereof, dicarboxylic acids, and mixtures thereof, in the presence of said catalysts. The polymers are obtained in solution at low reaction temperatures and short reaction times thereby avoiding side-reactions which otherwise would be detrimental to polymer molecular weight and ultimate polymer properties.

    摘要翻译: 使用某些催化剂提供了制备可溶性聚酰亚胺,聚酰胺和聚酰胺酰亚胺的改进方法。 催化剂是式(I)的化合物,其中M表示碱金属,n是2-5的整数。 改进的方法包括在所述催化剂存在下,将有机二异氰酸酯与由四羧酸或其分子内二酸酐,三羧酸或其一酸酐,二羧酸及其混合物组成的多元羧酸化合物反应。 聚合物在低反应温度和较短的反应时间下在溶液中得到,从而避免副反应,否则这将对聚合物分子量和最终聚合物性能有害。

    Polyimide precursor and method and composition for preparing it
    73.
    再颁专利
    Polyimide precursor and method and composition for preparing it 失效
    聚酰亚胺前体及其制备方法和组合物

    公开(公告)号:USRE29134E

    公开(公告)日:1977-02-08

    申请号:US573285

    申请日:1975-04-30

    IPC分类号: C08G18/34 C08G73/10

    摘要: A composition is disclosed of a dianhydride and a tetracarboxylic acid in the proportions of about 50 to about 70 mole % dianhydride to about 30 to about 50 mole % tetracarboxylic acid, a stoichiometric amount of an aromatic diisocyanate, and a solvent for the dianhydride, the tetracarboxylic acid, and the diisocyanate. A polyimide precursor is prepared by heating the composition at about 30.degree. to 70.degree. C until the evolution of carbon dioxide substantially ceases, and then at about 30.degree. to about 100.degree. C until its viscosity is about Q to about Z6 on the Gardner-Holdt viscosity scale at 18% solids. The polyimide precursor can be spread on a substrate and cured to produce a polyimide film or coated on a wire and cured to produce a polyimide wire enamel.

    Modified polyimide and method for producing modified polyimide
    75.
    发明授权
    Modified polyimide and method for producing modified polyimide 失效
    改性聚酰亚胺及改性聚酰亚胺的制造方法

    公开(公告)号:US08779085B2

    公开(公告)日:2014-07-15

    申请号:US13266925

    申请日:2010-04-30

    IPC分类号: C08G69/36

    摘要: The present invention discloses a method of producing a modified polyimide comprising a polycarbonate, which modified polyimide has excellent electric properties and adhesion as well as excellent heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; and the modified polyimide. Also disclosed are a composition comprising the modified polyimide and used thereof. According to the method in which an isocyanate-terminated oligomer comprising a polycarbonate component having excellent flexibility is allowed to react with a tetracarboxylic dianhydride to synthesize a tetracarboxylic dianhydride oligomer comprising the polycarbonate component and the thus obtained oligomer is then further allowed to react with an aromatic diamine and aromatic tetracarboxylic dianhydride to produce a polyimide block copolymer, by selecting the aromatic diamine from a wide range of selectable aromatic diamines, an excellent modified polyimide satisfying all of the above-described various characteristics can be produced.

    摘要翻译: 本发明公开了一种改性聚酰亚胺的制造方法,该改性聚酰亚胺具有优异的电性能和粘合性,耐热性,柔软性,弯曲性,低翘曲性,耐化学性和储存稳定性优异。 和改性聚酰亚胺。 还公开了包含改性聚酰亚胺并使用的组合物。 根据其中含有具有优异柔性的聚碳酸酯组分的异氰酸酯封端的低聚物与四羧酸二酐反应以合成包含聚碳酸酯组分的四羧酸二酐低聚物和由此得到的低聚物进一步与芳族化合物反应的方法 二胺和芳香族四羧酸二酐以制备聚酰亚胺嵌段共聚物,通过从宽范围的可选择的芳族二胺中选择芳族二胺,可以制备出满足所有上述各种特性的优异的改性聚酰亚胺。

    Polyimide precursor composition, use of the of the same, and production method of the same
    76.
    发明授权
    Polyimide precursor composition, use of the of the same, and production method of the same 有权
    聚酰亚胺前体组合物,其使用方法及其制备方法相同

    公开(公告)号:US08729402B2

    公开(公告)日:2014-05-20

    申请号:US12992450

    申请日:2009-05-14

    申请人: Yoshihide Sekito

    发明人: Yoshihide Sekito

    摘要: An object of the present invention is to provide (i) a polyimide precursor composition which is curable at a low temperature (not more than 250° C.) and which has a low viscosity despite having a high concentration, and a production method thereof, (ii) a polyimide coating film obtained from the polyimide precursor composition and having good properties, and a production method thereof, (iii) a photosensitive resin composition prepared by use of the polyimide precursor composition, and a production method thereof. The object of the present invention can be attained by a polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and an isocyanate compound having a specific structure, or optionally a diamine.

    摘要翻译: 本发明的目的是提供(i)聚酰亚胺前体组合物及其制造方法,该聚酰亚胺前体组合物在低温(不高于250℃)下可固化并且尽管浓度高,但粘度低。 (ii)由聚酰亚胺前体组合物获得并具有良好性能的聚酰亚胺涂膜及其制备方法,(iii)使用聚酰亚胺前体组合物制备的感光性树脂组合物及其制备方法。 本发明的目的可以通过含有具有特定结构的酰亚胺化四羧酸和具有特定结构的异氰酸酯化合物或任选的二胺的聚酰亚胺前体组合物来实现。

    CARBOXYL GROUP-CONTAINING POLYIMIDE, THERMOSETTING RESIN COMPOSITION AND FLEXIBLE METAL-CLAD LAMINATE
    78.
    发明申请
    CARBOXYL GROUP-CONTAINING POLYIMIDE, THERMOSETTING RESIN COMPOSITION AND FLEXIBLE METAL-CLAD LAMINATE 有权
    含羧基的聚酰亚胺,热固性树脂组合物和柔性金属层压板

    公开(公告)号:US20130310486A1

    公开(公告)日:2013-11-21

    申请号:US13979750

    申请日:2012-05-30

    申请人: Tetsuo Kawakusu

    发明人: Tetsuo Kawakusu

    IPC分类号: C08L79/08

    摘要: The present invention aims to provide a carboxyl group-containing polyimide, and prepolymer thereof which give a cured product highly satisfying thermosetting property, PCT resistance, solvent resistance and peel strength at the same time. The present invention relates to a terminal acid anhydride group-containing imide prepolymer which is characterized by being produced by reacting an acid anhydride group in a tetracarboxylic acid dianhydride with an isocyanate group in a diisocyanate compound, and a carboxyl group-containing polyimide which is characterized in having such a structure where the chain of said terminal acid anhydride group-containing imide prepolymer is extended via a polyol compound. The present invention also relates to a thermosetting resin composition and a flexible metal-clad laminate which utilize such carboxyl group-containing polyimide.

    摘要翻译: 本发明的目的在于提供一种含羧基的聚酰亚胺及其预聚物,其同时给出高度满足热固性,PCT耐性,耐溶剂性和剥离强度的固化产物。 本发明涉及含有末端含酸酐基的酰亚胺预聚物,其特征在于通过使二羧酸二异氰酸酯化合物中的四羧​​酸二酐中的酸酐基与异氰酸酯基反应而生成,以及含羧基的聚酰亚胺,其特征在于 具有通过多元醇化合物延伸所述含末端含酸酐基的酰亚胺预聚物的链的结构。 本发明还涉及使用这种含羧基的聚酰亚胺的热固性树脂组合物和柔性覆金属层压板。

    Resin composition for filling discharge gap and electrostatic discharge protector
    80.
    发明授权
    Resin composition for filling discharge gap and electrostatic discharge protector 失效
    用于填充放电间隙和静电放电保护器的树脂组合物

    公开(公告)号:US08350660B2

    公开(公告)日:2013-01-08

    申请号:US13130174

    申请日:2009-11-10

    IPC分类号: H01C7/10

    摘要: The present invention provides an electrostatic discharge protector capable of taking measures for electrostatic discharge against electronic wiring boards having various designs freely, simply and easily, having excellent accuracy of regulating an operating voltage and capable of being downsized and decreased on its cost, and also provides a resin composition for a discharge gap capable of preparing the electrostatic discharge protector. The resin composition for filling a discharge gap of an electrostatic discharge protector comprises a resin having a urethane structure represented by the formula (1): wherein plural R's are each independently an alkylene group of 1 to 18 carbon atoms, X is a bivalent organic group and m and n are each independently an integer of 1 to 20. The electrostatic discharge protector is obtainable by filling the discharge gap with the resin composition. The discharge gap has a width of 2 to 10 μm.

    摘要翻译: 本发明提供一种静电放电保护器,其能够自由地,简单且容易地对具有各种设计的电子布线板进行静电放电的措施,其具有极好的调节工作电压的精度并能够以其成本进行小型化和降低,并且还提供 一种用于制备静电放电保护器的用于放电间隙的树脂组合物。 用于填充静电放电保护器的放电间隙的树脂组合物包括具有由式(1)表示的氨基甲酸酯结构的树脂:其中多个R各自独立地为1至18个碳原子的亚烷基,X为二价有机基团 m和n各自独立地为1〜20的整数。通过用树脂组合物填充放电间隙可获得静电放电保护器。 放电间隙的宽度为2〜10μm。