公开(公告)号：US07738263B2

公开(公告)日：2010-06-15

申请号：US12007972

申请日：2008-01-17

申请人： Yoichi Kitamura ,  Minoru Hashimoto ,  Tatsuya Kaneko

发明人： Yoichi Kitamura ,  Minoru Hashimoto ,  Tatsuya Kaneko

IPC分类号： H05K9/00

CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/15165 ,  H01L2924/16153 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/341 ,  H05K9/0056 ,  H05K2201/10371 ,  H05K2203/043 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49171 ,  H01L2924/15153 ,  H01L2924/00 ,  H01L2224/05599

摘要： A circuit module containing a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder, the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pads, and the dents being joined to the ceramic substrate pads with solder.

摘要翻译： 一种电路模块，其包含用于承载电子部件的陶瓷载体基板，设置在陶瓷载体基板的表面上的陶瓷基板焊盘，以及具有用焊料与陶瓷基板焊盘接合的空腔和底面的盖， 具有邻近腔体的突起的盖子，以及与腔体相邻的突起，其间插入突起，突起与陶瓷载体衬底接触，距离陶瓷衬底焊盘具有规定的距离，并且凹陷接合到陶瓷衬底焊盘 用焊料。

公开(公告)号：US20100113111A1

公开(公告)日：2010-05-06

申请号：US12614132

申请日：2009-11-06

申请人： Alfred Y. Wong ,  Robert Moreno ,  Karl Richard Shields ,  Rong Wang

发明人： Alfred Y. Wong ,  Robert Moreno ,  Karl Richard Shields ,  Rong Wang

IPC分类号： H04W88/02

CPC分类号： H04B1/3838 ,  H01Q1/243 ,  H01Q1/245 ,  H01Q1/48 ,  H01Q5/371 ,  H01Q9/0407 ,  H01Q15/14 ,  H04B1/3883 ,  H05K9/0056

摘要： An advanced antenna or set of antennae for a wireless device is provided by embedding the antennae into the battery case or generally the largest surface area of a wireless phone. The antenna connections are made through the battery's connections to the wireless device. The antenna design can be compact and located in any area of the battery. The antenna design can be thin and flat, located at the back surface of the battery or the large rear surface of a wireless phone, facing away from the user. An RF shielding device can be embedded into the battery and configured in relation to the antenna such that the RF field intensity and the consequent specific absorption rate for the user is lowered while the outgoing signals of the wireless device remain fully adequate for the function of the wireless device. This feature is preserved for a multi-band operation because a digital phase shifter is used between two radiating antennae. An external case is used as a complement to the wireless phone to provide additional antennae, power and capability.

摘要翻译： 通过将天线嵌入电池壳体或通常是无线电话的最大表面积来提供用于无线设备的先进天线或一组天线。 天线连接通过电池与无线设备的连接进行。 天线设计可以紧凑，位于电池的任何区域。 天线设计可以薄而平坦，位于电池的背面或无线电话的大后表面，远离用户。 RF屏蔽装置可以嵌入电池中并且相对于天线被配置，使得RF场强度和随之而来的用户特定吸收率降低，而无线装置的输出信号保持足够的功能， 无线设备。 由于在两个辐射天线之间使用数字移相器，因此该特性被保留用于多频带操作。 使用外部盒子作为无线电话的补充，以提供额外的天线，功率和能力。

公开(公告)号：US20090228608A1

公开(公告)日：2009-09-10

申请号：US12380598

申请日：2009-02-27

申请人： Paul A. Nysen ,  Kevin Wolentarski ,  Pedro A. Gutierrez ,  Chih-Chuan Yen ,  Todd Van Cleave

发明人： Paul A. Nysen ,  Kevin Wolentarski ,  Pedro A. Gutierrez ,  Chih-Chuan Yen ,  Todd Van Cleave

IPC分类号： G06F3/00 ,  G06F13/36 ,  G06F13/14

CPC分类号： H04B7/10 ,  H01Q1/22 ,  H01Q1/243 ,  H01Q1/50 ,  H01Q9/0407 ,  H01Q9/24 ,  H01Q13/10 ,  H01Q21/28 ,  H04B5/0081 ,  H04B15/02 ,  H05K9/0056

摘要： The present invention provides an apparatus for coupling a radio communication device to a host system. The apparatus comprises a housing including a counterpoise operatively coupled to the radio communication device. The apparatus also comprises a signal pathway operatively coupling the radio communication device to the host system. The apparatus thereby provides a counterpoise for the radio communication device which is external to both the host system and the radio communication device.

摘要翻译： 本发明提供了一种用于将无线电通信设备耦合到主机系统的装置。 该装置包括壳体，其包括可操作地耦合到该无线电通信装置的平衡电路。 该装置还包括将无线电通信装置可操作地耦合到主机系统的信号路径。 因此，该装置为主机系统和无线电通信装置两者外部的无线电通信装置提供平衡。

公开(公告)号：US20080188098A1

公开(公告)日：2008-08-07

申请号：US11670952

申请日：2007-02-02

申请人： Ronald D. Boesch ,  Edwin John Nealis ,  Costel Nicolae

发明人： Ronald D. Boesch ,  Edwin John Nealis ,  Costel Nicolae

IPC分类号： H05K1/14

CPC分类号： H05K13/04 ,  H01L2924/0002 ,  H05K9/0056 ,  Y10T29/49146 ,  H01L2924/00

摘要： Microwave or millimeter wave module packaging having a module with a baseplate, transition board and cover. The baseplate includes microwave or millimeter wave components attached thereto. The transition board includes a first connector attached to a first side thereof and operatively connected to the components, and a second connector attached to a second side thereof and operatively connected to the components through the board. The cover and baseplate form a cavity containing the board and components, and the second connector may be operatively connected to a third connector such as a printed circuit board disposed outside of the cavity and on a higher level assembly. The transition board may further include a fourth connector operatively connected to the components for providing a signal to an external component or device or receiving a signal from an external component or device.

摘要翻译： 微波或毫米波模块封装，具有带底板，过渡板和盖板的模块。 底板包括附在其上的微波或毫米波分量。 过渡板包括附接到其第一侧并且可操作地连接到部件的第一连接器，以及连接到其第二侧并通过板可操作地连接到部件的第二连接器。 盖和底板形成包含板和部件的空腔，并且第二连接器可以可操作地连接到第三连接器，例如设置在空腔外部的印刷电路板和更高级组件。 过渡板还可以包括可操作地连接到组件的第四连接器，用于向外部组件或设备提供信号或从外部组件或设备接收信号。

公开(公告)号：US06727781B2

公开(公告)日：2004-04-27

申请号：US09953404

申请日：2001-09-17

申请人： Akihiko Saito

发明人： Akihiko Saito

IPC分类号： H03H1106

CPC分类号： H05K9/0056 ,  H01L2924/1617

摘要： Disclosed is a high frequency (HF) amplifier to be used at a high frequency, typically in the range of 9 GHz to 12 GHz, in which coupling of input side and output side is prevented to achieve high gain without influence on the fidelity of amplification. The HF amplifier comprises a metal case consisting of a box type container and a lid, an amplifying element installed on a dielectric, insulating board at the bottom of the case, and leads connected to the input circuit and the output circuit of the amplifying element and extending outside through both the end walls of the case. The HF amplifier is characterized by disposition of an electromagnetic wave-absorbing sheet or sheets inside of at least one of both the side walls, the ceiling, and both the end walls so as to prevent electromagnetic coupling.

摘要翻译： 公开了在高频（通常在9GHz至12GHz）的范围内使用的高频（HF）放大器，其中防止输入侧和输出侧的耦合实现高增益而不影响放大的保真度 。 HF放大器包括由盒式容器和盖子组成的金属外壳，安装在壳体底部的电介质绝缘板上的放大元件和连接到放大元件的输入电路和输出电路的引线，以及 通过外壳的两端延伸到外面。 HF放大器的特征在于在两个侧壁，天花板和两个端壁中的至少一个中设置电磁波吸收片或片，以防止电磁耦合。

公开(公告)号：US20020079115A1

公开(公告)日：2002-06-27

申请号：US09953404

申请日：2001-09-17

发明人： Akihiko Saito

IPC分类号： H05K009/00

CPC分类号： H05K9/0056 ,  H01L2924/1617

摘要： Disclosed is a high frequency (HF) amplifier to be used at a high frequency, typically in the range of 9 GHz to 12 GHz, in which coupling of input side and output side is prevented to achieve high gain without influence on the fidelity of amplification. The HF amplifier comprises a metal case consisting of a box type container and a lid, an amplifying element installed on a dielectric, insulating board at the bottom of the case, and leads connected to the input circuit and the output circuit of the amplifying element and extending outside through both the end walls of the case. The HF amplifier is characterized by disposition of an electromagnetic wave-absorbing sheet or sheets inside of at least one of both the side walls, the ceiling, and both the end walls so as to prevent electromagnetic coupling.

摘要翻译： 公开了在高频（通常在9GHz至12GHz）的范围内使用的高频（HF）放大器，其中防止输入侧和输出侧的耦合实现高增益而不影响放大的保真度 。 HF放大器包括由盒式容器和盖子组成的金属外壳，安装在壳体底部的电介质绝缘板上的放大元件和连接到放大元件的输入电路和输出电路的引线，以及 通过外壳的两端延伸到外面。 HF放大器的特征在于在两个侧壁，天花板和两个端壁中的至少一个中设置电磁波吸收片或片，以防止电磁耦合。

公开(公告)号：US20020074142A1

公开(公告)日：2002-06-20

申请号：US09928521

申请日：2001-08-13

发明人： Joseph M. Katz

IPC分类号： H05K009/00

CPC分类号： H05K9/0043 ,  H01Q1/245 ,  H01Q1/526 ,  H04B1/3838 ,  H04B1/3888 ,  H05K9/0056

摘要： A radiation protection shield for electronic devices is provided to shield a user from electro-magnetic and microwave radiation emitted from an electronic device. The radiation shield may be inexpensively manufactured by punching or die cutting sheets of material. Fastening components are provided which allow the shield to be adjustably fitted on a variety of differently sized and configured electronic devices. An additional shielding member is also provided for enhanced shielding in the area of the electronic device adjacent an antenna.

摘要翻译： 提供了一种用于电子设备的辐射防护罩，用于屏蔽用户免受从电子设备发射的电磁和微波辐射。 可以通过冲压或模切材料片廉价地制造辐射屏蔽。 提供紧固部件，其允许屏蔽件可调节地安装在各种不同尺寸和配置的电子设备上。 还提供了附加的屏蔽构件，用于在与天线相邻的电子设备的区域中增强屏蔽。

公开(公告)号：US5412340A

公开(公告)日：1995-05-02

申请号：US151187

申请日：1993-11-12

申请人： Sadao Tanikoshi

发明人： Sadao Tanikoshi

IPC分类号： H03F3/60 ,  H05K9/00 ,  H03F3/19

CPC分类号： H05K9/0056

摘要： The present invention provides a shield structure for shielding a microwave circuit device, which can establish a reliable electric contact between the ground wiring patterns of a circuit substrate, and can completely prevent external noise from entering into the circuit, with the use of a light and compact shield case. A circuit substrate has microwave components mounted thereon, ground patterns formed on peripheral portions of the upper surface of the substrate, and a ground pattern formed in the lower surface of the substrate along the entire periphery thereof. A shield case main body receiving the circuit substrate comprises a case main body, a top plate, and a bottom plate. The thickness of the case main body increases from a predetermined position such that it contacts the ground patterns. The bottom plate is coupled integral with the case main body with the circuit substrate interposed therebetween, in a state where the circuit substrate is received in the body. The shield case bottom plate has a surface, which is opposed to the lower surface of the circuit substrate and has a continuous groove formed therein along the periphery thereof. A shield line, which consists of an elastic conductor with a diameter greater than the depth of the groove, fills the continuous groove. The top plate is coupled integral with the upper surface of the shield case main body.

摘要翻译： 本发明提供了一种用于屏蔽微波电路器件的屏蔽结构，该屏蔽结构可以在电路基板的接地布线图形之间建立可靠的电接触，并且可以通过使用光而完全防止外部噪声进入电路 紧凑型盾构箱 电路基板具有安装在其上的微波部件，形成在基板的上表面的周边部分上的接地图案和沿其整个周边形成在基板的下表面中的接地图案。 接收电路基板的屏蔽壳主体包括壳体主体，顶板和底板。 壳体主体的厚度从预定位置增加，使得其接触地面图案。 在电路基板被容纳在体内的状态下，底板与壳体主体一体地配置有电路基板。 屏蔽壳底板具有与电路基板的下表面相对的表面，并且沿着其周边形成有连续的槽。 由直径大于槽深度的弹性导体构成的屏蔽线填充连续槽。 顶板与屏蔽壳主体的上表面结合成一体。

公开(公告)号：US5001298A

公开(公告)日：1991-03-19

申请号：US423269

申请日：1989-10-18

申请人： Ruey Hwang Jong

发明人： Ruey Hwang Jong

IPC分类号： H05K9/00

CPC分类号： H05K9/0056 ,  H05K9/0073

摘要： An improved radio-wave insulating device for a high frequency signal distributor, comprising a cover 2a and a case body 3a. The case body 3a is provided with a plurality of protuberances 32a which slightly outsizes the corresponding notches 22a of the cover 2a. Thus when the cover 2a is mounted in place in the case body 3a, a force, which results from the deformation of the protuberances 32a in the notches 22a, is provided parallel to the corresponding side of the cover, thus ensuring a firm engagement between the cover and the case body, without causing the bulging-out of the case body.

摘要翻译： 一种用于高频信号分配器的改进的无线电波绝缘装置，包括盖2a和壳体3a。 壳体3a设置有多个突起32a，其稍微超过盖2a的相应的凹口22a。 因此，当将盖2a安装在壳体3a中的适当位置时，由凹口22a中的突起32a的变形产生的力平行于盖的相应侧设置，从而确保 盖和壳体，而不会引起壳体的膨胀。

公开(公告)号：US4455448A

公开(公告)日：1984-06-19

申请号：US326757

申请日：1981-12-02

申请人： Robert W. Bertolina

发明人： Robert W. Bertolina

IPC分类号： H01P1/00 ,  H05K5/00 ,  H05K9/00

CPC分类号： H05K9/0056

摘要： A microwave device is housed in a plastic injected molded body which has been plated with an electrical conductor to provide shielding. Holes through the walls of the housing are plated and cooperatively function with electrical conductors as coaxial input and output lines.

摘要翻译： 微波装置被容纳在塑料注射成型体中，其已经被电导体提供屏蔽。 通过外壳的墙壁的孔被电镀并与作为同轴输入和输出线的电导体协同工作。