公开(公告)号：US20020037680A1

公开(公告)日：2002-03-28

申请号：US09852179

申请日：2001-05-09

Applicant: NEC Corporation

Inventor： Yoshihiro Hayashi ,  Takahiro Onodera ,  Yamato Samitsu ,  Kiyoshi Tanaka ,  Naoki Sasaki

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/105 ,  B24B37/042

Abstract: In an apparatus for polishing a substrate, including a polishing platen for mounting the substrate thereon, a polishing head, a polishing pad adhered to a bottom face of the polishing head, and a rocking section for rocking. I.e., moving the polishing head in the horizontal direction with respect to the polishing platen, a control circuit controls a load of the polishing pad applied to the substrate in accordance with a contact area of the polishing pad to the substrate.

Abstract translation: 在用于抛光基板的装置中，包括用于将基板安装在其上的抛光台板，抛光头，粘附到抛光头底面的抛光垫和用于摇摆的摇摆部分。 即，相对于研磨台板沿水平方向移动抛光头，控制电路根据抛光垫与基板的接触面积来控制施加到基板上的抛光垫的载荷。

公开(公告)号：US20020025758A1

公开(公告)日：2002-02-28

申请号：US09927528

申请日：2001-08-13

Applicant: STAR MICRONICS CO., LTD.

Inventor： Yoshihiro Sei ,  Takehisa Kajiyama ,  Nobuyuki Endo ,  Kunihisa Shibazaki

IPC: B24B049/00 ,  B24B001/00 ,  B24B051/00

CPC classification number: G05B19/182 ,  G05B2219/35525 ,  G05B2219/50008 ,  G05B2219/50015 ,  G05B2219/50087 ,  G05B2219/50088 ,  G05B2219/50336 ,  Y02P90/265

Abstract: The movement position of the roughing tool is calculated, in S109, by adding the finishing allowance to the movement position of the finishing tool so that the path of the roughing tool is shifted in the direction perpendicular to the rotation center axis of the main spindle rotation motor from the path of the finishing tool by the finishing allowance. Then, a gap between the movement position of the roughing tool in the direction of the rotation center axis of the main spindle rotation motor and the workpiece W is calculated, and when the gap is not larger than a predetermined value G, in S113, the movement position of the roughing tool is corrected in the direction perpendicular to the rotation center axis of the main spindle rotation motor so that the roughing tool does not cut in the inside of the finishing portion of the workpiece. The movement position of the roughing tool is corrected so that the movement speed of the roughing tool in the direction perpendicular to the rotation center axis of the main spindle rotation motor is a predetermined value.

Abstract translation: 计算粗加工工具的移动位置，在S109中，通过将加工余量加到精加工工具的移动位置，使得粗加工工具的路径沿与主轴旋转的旋转中心轴垂直的方向移动 电机从修整工具的路径通过精加工余量。 然后，计算粗加工工具在主轴旋转马达的旋转中心轴方向的移动位置与工件W之间的间隙，当间隙不大于规定值G时，在S113中， 在与主轴旋转马达的旋转中心轴垂直的方向上校正粗加工工具的移动位置，使得粗加工工具在工件的精加工部分的内部不切割。 校正粗加工工具的移动位置，使得粗加工工具在与主轴旋转马达的旋转中心轴线垂直的方向上的移动速度为预定值。

公开(公告)号：US20020019195A1

公开(公告)日：2002-02-14

申请号：US09731857

申请日：2000-12-08

Inventor： Masahiro Asano ,  Katsumi Nagasaka ,  Toshiya Hayashi ,  Hisatoshi Kojima

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B5/185 ,  B23F19/007 ,  B24B19/009 ,  B24B49/16

Abstract: A gear grinding machine and a gear grinding method, in which a gear-shaped grinding stone is caused to engage a gear-like workpiece and one of the gear-shaped grinding stone and the gear-like workpiece is reciprocated relatively to the other in axial direction thereby to grind the tooth flanks of the workpiece, are disclosed. The rotational resistance is applied by a brake unit to the rotationally driven side. The grinding resistance and the rotational resistance interfering with the relative reciprocal motion are detected by torque sensors and input to a control unit, the average value of each of the signals is compared with a reference value by an arithmetic unit and, in the case where there is a difference between the average value and the reference value, the rotational resistance is changed by activating the brake unit. Thus, a high machining accuracy can be maintained even when the sharpness of the grinding stone is reduced.

Abstract translation: 一种齿轮磨床和齿轮磨削方法，其中使齿轮磨石与齿轮状工件接合，并且齿轮状磨石和齿轮状工件中的一个相对于另一个在轴向上往复运动 方向，从而磨削工件的齿面。 旋转阻力由制动单元施加到旋转驱动侧。 磨削阻力和与相对往复运动相抵消的旋转阻力由转矩传感器检测并输入到控制单元，每个信号的平均值与运算单元的基准值进行比较，在 是平均值和基准值的差，通过启动制动单元来改变旋转阻力。 因此，即使减小研磨石的清晰度，也能够保持高的加工精度。

公开(公告)号：US20020002026A1

公开(公告)日：2002-01-03

申请号：US09916428

申请日：2001-07-26

Inventor： Charles J. Molnar

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/245 ,  B24B37/013 ,  B24B37/042 ,  B24B37/20 ,  B24B49/16 ,  B24D3/346 ,  B65H2701/3772 ,  H01L21/31053

Abstract: A method of using a finishing element and using organic lubricating films for finishing semiconductor wafers is described. The lubricants in the finishing element can be transferred to operative finishing interface forming lubricating film. The organic lubricating film thickness can be controlled to improve finishing and reduce unwanted surface defects. Differential organic lubricating film methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer and organic lubricating film methods of finishing.

公开(公告)号：US20010051490A1

公开(公告)日：2001-12-13

申请号：US09760623

申请日：2001-01-16

Applicant: NCRx Optical Solutions, Inc.

Inventor： Larry K. Siders ,  Donald F. Baechtel

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B13/04 ,  B24B1/00 ,  B24B9/14 ,  B24B9/146 ,  B24B9/148 ,  B24B13/0031 ,  B24B13/005 ,  B24B13/0055 ,  B24B13/01 ,  B24B13/02 ,  B24B13/06 ,  B24B27/0076 ,  B24B51/00

Abstract: A method and system for the manufacture of ophthalmic lenses comprising a computer (102) and a CNC machining platform (104) in operative connection with the computer. The CNC machining platform includes a mounting stage (110), a block (106) in releasable connection with the mounting stage, and a machining tool (112). When an unfinished lens blank (108) is properly mounted on the block, the computer is operative to direct the CNC machining platform to perform both back surface generation and patternless edging of the lens blank in one machining cycle. The computer is further operative to direct the CNC machining platform to machine a lap tool for each lens and machine a block for receiving each lens. The block is machined by the platform to include scribe lines for facilitating proper alignment of lens blank.

Abstract translation: 一种用于制造眼镜片的方法和系统，包括与计算机有效连接的计算机（102）和CNC加工平台（104）。 CNC加工平台包括安装台（110），与安装台可释放地连接的块（106）和加工工具（112）。 当未完成的镜头坯料（108）正确地安装在块上时，计算机可操作以指导CNC加工平台在一个加工周期中执行镜片坯料的背面生成和无图案磨边。 计算机进一步操作以指导CNC加工平台为每个镜头加工搭接工具，并加工用于接收每个镜片的块。 该块由平台加工以包括用于促进透镜坯料的适当对准的划线。

公开(公告)号：US20010041500A1

公开(公告)日：2001-11-15

申请号：US09873483

申请日：2001-06-04

Applicant: Micron Technology, Inc.

Inventor： Michael B. Ball

IPC: B24B049/00 ,  B24B001/00 ,  B24B051/00

CPC classification number: H01L21/67017 ,  Y10T137/0318 ,  Y10T137/7759 ,  Y10T137/86389

Abstract: A method of conserving a facility delivered to a machine during the machine's idle mode is herein described. In one embodiment, the method is directed to a method for conserving coolant water delivery to a semiconductor wafer grinding machine. The system monitors the status of the grinder to determine whether the grinder is active or idle. After the system determines the grinder has entered idle mode, the system reduces the flow of water to the machine. In one embodiment, the flow is simply reduced while, in another embodiment, the flow is terminated. A delay circuit in the system may delay the reduction of the flow rate until some point after entering idle mode. Periodically throughout the idle mode, the system increases the flow of coolant water to the grinder to ensure the temperature of all grinder components remains consistent. The duty cycle of the coolant flow may be adjusted to optimize water conservation and machine readiness.

公开(公告)号：US20010029154A1

公开(公告)日：2001-10-11

申请号：US09853740

申请日：2001-05-10

Inventor： Thad Lee Brunelli

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B53/017 ,  B24B49/14 ,  B24B53/013 ,  H01L21/30625

Abstract: A method and apparatus for controlling a polishing characteristic of a polishing pad used in planarization of a substrate. The method preferably includes controlling the temperature of a planarizing surface of the polishing pad so that waste matter accumulations on the planarizing surface soften and/or become more soluble, and/or material comprising the planarizing surface attains approximately its glass transition temperature. The waste matter accumulations and/or a portion of the planarizing surface are in this way softened and more easily removed. The planarizing surface is either heated directly by directing a flow of heated planarizing liquid or heated air to the planarizing surface or indirectly by heating a support surface beneath the polishing pad or by heating the air proximate to the polishing pad.

Abstract translation: 一种用于控制用于平坦化基板的抛光垫的抛光特性的方法和装置。 该方法优选包括控制抛光垫的平坦化表面的温度，使得平坦化表面上的废物积聚软化和/或变得更易溶解，和/或包括平坦化表面的材料达到大致其玻璃化转变温度。 废物积聚和/或平坦化表面的一部分以这种方式软化并且更容易地去除。 通过将加热的平面化液体或加热空气的流引导到平坦化表面或间接地通过加热抛光垫下方的支撑表面或通过加热靠近抛光垫的空气来直接加热平坦化表面。

公开(公告)号：US20040242122A1

公开(公告)日：2004-12-02

申请号：US10747723

申请日：2003-12-29

Inventor： Jens Kramer ,  Uwe Gunter Stoeckgen ,  Jens Kunath

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00 ,  B24B007/19

CPC classification number: B24B53/017 ,  B24B49/10

Abstract: In a system and a method according to the present invention, a sensor signal, such as a motor current signal, from a drive assembly of a pad conditioning system is used to estimate the status of one or more consumables in a CMP system.

Abstract translation: 在根据本发明的系统和方法中，使用来自焊盘调节系统的驱动组件的诸如电动机电流信号的传感器信号来估计CMP系统中的一种或多种消耗品的状态。

公开(公告)号：US20040209548A1

公开(公告)日：2004-10-21

申请号：US10828017

申请日：2004-04-20

Inventor： Michael J. Joslyn

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/04 ,  B24B57/02

Abstract: Machines with solution dispensers and methods of using such machines for chemical-mechanical planarization and/or electrochemicalnullmechanical planarization/deposition of microelectronic workpieces. One embodiment of such a machine includes a table having a support surface, a processing pad on the support surface, and a carrier assembly having a head configured to hold a microelectronic workpiece. The carrier assembly can further include a drive assembly that manipulates the head. The machine can also include a solution dispenser separate from the head. The solution dispenser can include a support extending over the pad and a fluid discharge unit or distributor carried by the support. The fluid discharge unit is configured to discharge a planarizing solution onto a plurality of separate locations across the pad.

公开(公告)号：US20040185751A1

公开(公告)日：2004-09-23

申请号：US10765147

申请日：2004-01-28

Inventor： Masayuki Nakanishi ,  You Ishii ,  Kenro Nakamura

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B9/065 ,  B24B21/002

Abstract: A substrate processing apparatus is used for removing surface irregularities occurring on the peripheral portion (a bevel portion, an edge portion, and a notch) of a substrate such as a semiconductor wafer and films deposited as a contaminant on the peripheral portion of such a substrate. The substrate processing apparatus includes an edge-portion polisher for pressing a polishing tape against an edge portion of a substrate and making a relative movement between the polishing tape and the substrate to polish the edge portion of the substrate, and a bevel-portion polisher for pressing a polishing tape against a bevel portion of the substrate and making a relative movement between the polishing tape and the substrate to polish the bevel portion of the substrate.

Abstract translation: 基板处理装置用于去除在诸如半导体晶片的基板和作为污染物沉积的薄膜的周边部分（斜面部分，边缘部分和凹口）上出现的表面凹凸，并在这种基板的周边部分上 。 基板处理装置包括：边缘部分抛光机，用于将抛光带压靠在基板的边缘部分上，并使抛光带和基板之间的相对运动抛光基板的边缘部分;以及斜面部分抛光机， 将研磨带压在衬底的斜面部分上，并在研磨带和衬底之间进行相对运动，以抛光衬底的斜面部分。