PHOTOSENSITIVE COMPOSITION
    72.
    发明申请

    公开(公告)号:US20230034267A1

    公开(公告)日:2023-02-02

    申请号:US17787288

    申请日:2020-12-23

    Abstract: The photosensitive composition according to the present invention is a photosensitive composition including a semiconductor particle (A), a photopolymerizable compound (C) and a photopolymerization initiator (D), in which the photosensitive composition satisfies any one or more of the following (a) to (c): (a) the photosensitive composition further includes a stabilizer (E), and a content of the stabilizer (E) is 8% by mass or more based on the total amount of the photosensitive composition; (b) the photopolymerizable compound (C) includes a (meth)acrylate compound (C1) having a molecular weight of 180 or less; and (c) the photopolymerizable compound (C) includes a compound (C2) having a vinyl ether group and a (meth)acryloyl group in the same molecule.

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