摘要:
The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.
摘要:
Method and apparatus for electrically charactering an integrated circuit (IC) are described. In an example, a data line in conductive interconnect of the IC is identified that is failing. First and second vertical trenches are milled in the IC along the data line to expose respective first and second cross-sections of the conductive interconnect having the data line. First and second probes are placed in contact with the data line in the first and second vertical trenches, respectively. A determination is made whether the data line is open or shorted between the first and second vertical trenches using an electrical measurement device coupled to the first and second probes.
摘要:
A probe card assembly can comprise a first source of compliance and a second source of compliance. The probe card assembly can further comprise a controller, which can be configured to apportion a total compliance demand placed on the probe card assembly between the first source of compliance and the second source of compliance.
摘要:
An apparatus for maintaining a conductivity of electrical contacts of a test contactor for testing electronic devices comprises a rotary turret disk having a plurality of test stands operative to hold respective electronic devices, the electronic devices being rotatable by the rotary turret disk to a position of the test contactor to be contacted by the electrical contacts during testing. At least one contactor maintenance stand comprising a maintenance component is located between adjacent test stands on the rotary turret disk, wherein the electrical contacts of the test contactor are adapted to engage the maintenance component so as to automatically clean the electrical contacts and/or verify the conductivity thereof.
摘要:
A test system may be provided in which devices under test undergo various types of testing. A first test location may have test equipment for testing input/output devices in the devices under test. A second test location may have test equipment for testing wireless communications circuitry in the devices under test. A mobile storage cart having shelves may be used to store the devices under test and to convey the devices under test between test locations. The storage cart may be configured to engage with a stationary frame structure at a test location. Actuators underneath the storage cart may be used to position the storage cart in a desired location. Distance sensors may be used to obtain status information about each shelf in the storage cart. A computer-controlled loading structure may be used to load the devices under test from the storage cart into test enclosures.
摘要:
A test system may be provided in which devices under test (DUTs) are loaded into test trays. Test trays may be tested at test stations. Test trays may be moved between test stations using a conveyor belt system. Each test station may include test equipment for testing DUTs and automated loading equipment for latching incoming test trays moving along the conveyor belt. The automated loading equipment may include a first movable arm configured to pick up a test tray from the conveyor belt and a second movable arm. The first arm may hand off (transfer) the test tray to the second arm. The second arm may move the test tray towards associated test equipment for testing. Upon completion of testing, the second arm may drop off the test tray onto the conveyor belt. Multiple layers of test stations may be stacked on top of each other for improved test throughput.
摘要:
Method and apparatus for electrical testing of a device under test (DUT) that employs a connection board with signal contacts for applying test signals and a space transformer that has low pitch contacts arranged on one or more circumferential shelves that define an enclosure in the space transformer. The apparatus has a substrate with fine pitch contacts positioned such that these are within the enclosure. A set of wire bonds is used for pitch reduction by interconnecting the fine pitch contacts with the low pitch contacts arranged on the shelves. The probes are connected to the fine pitch contacts and are used to apply the test signals to a DUT by contacting its pads. In some embodiments, the fine pitch contacts may be embodied by plugs or by blind metal vias.
摘要:
The present invention discloses a pad structure and a method for testing a integrated circuit. The structure includes the first pads and the second pads, where the first pads are distributed over a peripheral portion of the integrated circuit and connected with lead-out wires of the integrated circuit, and the second pads are connected with a metal line at a circuit portion in the integrated circuit and are sized larger than the minimum characteristic dimension of the metal line and of the integrated circuit and smaller than the size of the first pads. The pad structure and method can position a test portion with improved efficiency. Correspondingly, a probe can be used to position the test portion with improved accuracy as well.
摘要:
A probe is made to contact an electrode terminal in an electric circuit or an electronic part for an electric measurement of the electric circuit or the electronic part. The probe includes a terminal portion which is brought in contact with the electrode terminal at one end of the probe, a spring portion in which U-shaped unit portions are arrayed in a zigzag formation, and a housing portion which surrounds the spring portion. The probe is formed of a sheet of a sheet-metal plate which is bent multiple times, the sheet-metal plate having a predetermined configuration in which a portion corresponding to the terminal portion, a portion corresponding to the spring portion, and a portion corresponding to the housing portion are continuously linked together.
摘要:
Techniques for configuring a test system that enable simple specification of a degree of concurrency in testing separate functional portions of a semiconductor device. For a test flow with multiple sub-flows; the pins accessed in connection with each sub-flow may define a flow domain. Site regions, each associated with a flow domain, may be defined. Tester sites may be associated with each of these flow domain specific site regions and independently operating resources may be assigned to these tester sites. A second portion of the defined site regions may be associated with tester sites, but resources assigned to these site regions may be accessed from multiple flow domains. Test blocks, even if not developed for concurrent execution, may be executed concurrently using resources in the flow domain specific site regions. Flexibility is provided to share resources through the use of the second portion of the site regions.