Abstract:
An inkjet printer having a rolling mechanism for flattening ink droplets is disclosed. The inkjet printer includes a carriage track being connected to a work platform of the inkjet printer, a printing module slidably mounted upon the carriage track to allow lateral movement, and at least one rolling mechanism disposed on the sidewall of a inkjet printhead assembly of the printing module or independently mounted upon the carriage track, wherein the rolling mechanism can roll over the surface of print media and flatten the ink droplets thereon before drying, to form printed image layers with uniform thickness for increasing image quality and reliability of the inkjet printer.
Abstract:
Disclosed is a method for providing a protective film over a capacitor. The method includes the steps of providing a capacitor with a first leg, a second leg and a shell, spraying paint onto the shell so that the thickness of the paint over the shell is even, and drying the paint so that the paint is turned into a protective film over the shell.
Abstract:
An exemplary dual-band antenna includes a first antenna unit and a second antenna unit for receiving /sending radio frequency signals corresponding generating a low resonant frequency and a high resonant frequency. The first antenna unit is perpendicularly connected to the second antenna unit. The second antenna unit includes a feed portion, two slots, two gaps and two grounding sheets. The feed portion is electrically connected to the first antenna unit and is used to receive radio frequency signals. The slots are adjacent to one side of the first antenna unit and are defined at the both sides of the feed portion, and the slots are connected with the feed portion and used to radiate radio frequency signals. The gaps extend away from a position of the first antenna unit and are defined at the both sides of the feed portion, and each gap communicates with corresponding slot. The grounding sheets are symmetrically positioned at both sides of the feed portion.
Abstract:
An electrical fuse structure is disclosed. The electrical fuse structure includes a fuse element disposed on surface of a semiconductor substrate, a cathode electrically connected to one end of the fuse element, and an anode electrically connected to another end of the fuse element. Specifically, a compressive stress layer is disposed on at least a portion of the fuse element.
Abstract:
A driving circuit, which can realize the driving waveforms for a PDP without staying at ground potential includes having one side, the X side, of an panel equivalent capacitor Cp of the PDP coupled directly to ground with the Y side of the equivalent capacitor having a Scan IC 99 connected to a plurality of switches, each switch coupled to a different voltage source. One of the switches is bi-directional and coupled to ground.
Abstract:
A self-drilling screw with multi-drilling portions mainly comprises a shank, a head and a drilling portion separately disposed on both ends of the shank, and a thread section spiraled on the shank. Wherein, at least one sub-drilling portion formed amid the drilling portion and the thread section further defines a sequence of indentations and prominent areas, and each indentation generates a cutting surface outwardly extended from one side thereof so as to converge the cutting surface with the adjacent prominent area at a cutting ridge. Accordingly, the application of the cutting ridges and the indentations facilitates the drilling portion with the chipping capability and renders an appropriate guidance to redundant debris, thereby efficiently achieving a swift screwing and the lowered screwing resistance to promote the screwing efficiency.
Abstract:
The present invention relates to a phase change memory and a method of fabricating a phase change memory. The phase change memory includes a heater structure disposed on a phase change material pattern, wherein the heater structure is in a tapered shape with a bottom portion contacting the phase change material pattern. The fabrication of the phase change memory is compatible with the fabrication of logic devices, and accordingly an embedded phase change memory can be fabricated.
Abstract:
A fabrication method of a thin film transistor includes providing a substrate at first. Thereafter, a first gate is formed on the substrate. An insulator is then formed to cover the first gate and a portion of the substrate. After that, a channel structure is formed on the insulator above the first gate. In addition, a metal layer is formed to cover the channel structure and a portion of the insulator. Next, the metal layer is patterned, and at least the metal layer on two sidewalls of the channel structure is retained to form a source and a drain, respectively. Moreover, a passivation layer is formed to at least cover the source, the drain and a portion of the insulator.
Abstract:
A band-pass filter includes a plurality of resonators, a feedback capacitive device and a grounding inductance device. A first end of each resonator is connected to a first node, and a second end of each resonator is connected to a second node. The feedback capacitive device is formed on the feedback circuit from the first node to the second node. The grounding inductance device is connected to the second node and ground. In an embodiment, the resonator essentially consists of a capacitive device and an inductance device.