公开(公告)号：US12146691B2

公开(公告)日：2024-11-19

申请号：US18097055

申请日：2023-01-13

Applicant: INERTECH IP LLC

Inventor： Ming Zhang ,  John Costakis

IPC: F25B25/00 ,  F25B7/00 ,  F25B49/02 ,  H05K7/20

Abstract: The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.

公开(公告)号：US20240295334A1

公开(公告)日：2024-09-05

申请号：US18600741

申请日：2024-03-10

Applicant: INERTECH IP LLC

Inventor： Ken Nguyen

IPC: F24F9/00 ,  F24F13/02 ,  H05K7/20

CPC classification number: F24F9/00 ,  F24F13/0254 ,  H05K7/20709 ,  H05K7/20745 ,  F24F2009/002

Abstract: An air curtain containment system and assembly for data centers forms an air curtain over the server cabinets thereby separating hot air in a hot aisle from cool ambient air. The air curtain containment system includes ducts which include a hot air intake section that receives hot air discharged from servers, which are disposed in server cabinets. The ducts include heat exchangers for cooling the hot air and at least one air curtain discharge section. A housing is coupled to a wall of the ducts, and includes a cooling edge device fan. The cooling edge device fan is disposed along the ducts, and is configured to draw the hot air for cooling through the heat exchangers. An air curtain fan assembly is disposed along the ducts. The air curtain fan assembly expels cold air through the air curtain discharge section, and thereby forms an air curtain over the server cabinets.

公开(公告)号：US20240247818A1

公开(公告)日：2024-07-25

申请号：US18407422

申请日：2024-01-08

Applicant: Inertech IP LLC

Inventor： John Costakis ,  Ming Zhang ,  Earl Keisling ,  Ken Nguyen

IPC: F24F5/00 ,  F24F11/46 ,  F24F11/83 ,  F24F11/84 ,  F24F11/85 ,  F24F13/22 ,  F24F110/12 ,  F24F140/50 ,  F25B23/00 ,  F25B25/00 ,  F28C1/00

CPC classification number: F24F5/0007 ,  F24F5/0003 ,  F24F5/001 ,  F24F5/0035 ,  F24F11/83 ,  F24F11/84 ,  F24F11/85 ,  F25B23/006 ,  F25B25/00 ,  F25B25/005 ,  F24F11/46 ,  F24F2013/225 ,  F24F2110/12 ,  F24F2140/50 ,  F25B2339/041 ,  F25B2339/047 ,  F25B2700/197 ,  F25B2700/21163 ,  F28C2001/006 ,  Y02B30/54

Abstract: The cooling systems and methods of the present disclosure involve modular fluid coolers and chillers configured for optimal power and water use based on environmental conditions and client requirements. The fluid coolers include wet media, a first fluid circuit for distributing fluid across wet media, an air to fluid heat exchanger, and an air to refrigerant heat exchanger. The chillers, which are fluidly coupled to the fluid coolers via pipe cages, include a second fluid circuit in fluid communication with the air to fluid heat exchanger and a refrigerant circuit in thermal communication with the second fluid circuit and in fluid communication with the air to refrigerant heat exchanger. Pipe cages are coupled together to allow for expansion of the cooling system when additional cooling capacity is needed. The fluid coolers and chillers are configured to selectively operate in wet or dry free cooling mode, partial free cooling mode, or mechanical cooling mode.

公开(公告)号：US12048128B2

公开(公告)日：2024-07-23

申请号：US15701093

申请日：2017-09-11

Applicant: INERTECH IP LLC

Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell

IPC: H05K7/20 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20

CPC classification number: H05K7/20827 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H05K7/20218 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20754 ,  H05K7/20818 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

公开(公告)号：US11940227B2

公开(公告)日：2024-03-26

申请号：US17856654

申请日：2022-07-01

Applicant: INERTECH IP LLC

Inventor： Ming Zhang ,  Ken Nguyen ,  Doron Shapiro ,  John Costakis

IPC: F28D7/00 ,  B23K1/00 ,  B23P15/26 ,  F28D1/047 ,  F28D1/053 ,  F28F1/02 ,  F28F1/12 ,  F28F9/013 ,  F28F9/02 ,  F28F21/08 ,  G06F1/20 ,  H05K7/20

CPC classification number: F28D7/0066 ,  B23K1/0012 ,  B23P15/26 ,  F28D1/0478 ,  F28D1/05391 ,  F28F1/022 ,  F28F1/12 ,  F28F1/128 ,  F28F9/013 ,  F28F9/02 ,  F28F21/084 ,  G06F1/20 ,  H05K7/20654 ,  H05K7/2079 ,  F28F2225/08 ,  F28F2275/04 ,  G06F2200/201

Abstract: A cooling system includes a heat exchanger having one or more rows of multiple flat tubes, louvered fins disposed between pairs of flat tubes, and special header tube connections to form a counter flow heat exchanger. Heat exchangers having multiple rows may be placed near or close to the server racks and may be in fluid communication with an outdoor heat exchanger having one or more rows. A single-phase fluid is pumped through a fluid circuit or loop, which includes the heat exchangers at the server racks and the outdoor heat exchanger. The single-phase fluid circuit including the heat exchangers at the IT racks may alternatively be in thermal communication with a water circuit that includes an outdoor fluid cooler. The flat tubes can be formed tubes with one or more channels, or extruded tubes with multiple channels. The heat exchangers include header tubes/connections, which facilitate easy fabrication and connection between rows and inlet/outlet, and lower the pressure drop.

公开(公告)号：US20230221046A1

公开(公告)日：2023-07-13

申请号：US18097055

申请日：2023-01-13

Applicant: INERTECH IP LLC

Inventor： Ming Zhang ,  John Costakis

IPC: F25B25/00 ,  F25B49/02 ,  H05K7/20 ,  F25B7/00

CPC classification number: F25B25/005 ,  F25B49/02 ,  H05K7/20827 ,  F25B7/00 ,  F25B2500/18

Abstract: The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.

公开(公告)号：US11547019B2

公开(公告)日：2023-01-03

申请号：US16928633

申请日：2020-07-14

Applicant: Inertech IP LLC

Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell

IPC: H05K7/20 ,  F21V33/00 ,  F21W131/40

Abstract: An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.

公开(公告)号：US20220352748A1

公开(公告)日：2022-11-03

申请号：US17697905

申请日：2022-03-17

Applicant: Inertech IP LLC

Inventor： Jakob CARNEMARK ,  Robert S. STONE

IPC: H02J9/08 ,  H02J9/06

Abstract: Electrical systems for providing uninterruptible power to a critical load. One electrical system includes a ring bus, multiple power blocks including one or more generators electrically coupled to the ring bus, and uninterruptible power supplies (UPSs) electrically coupled to the ring bus. In some aspects, the electrical system includes a UPS switchgear electrically coupled between the ring bus and the UPSs. In other aspects, the UPSs are electrically coupled together in parallel. Another electrical system includes a utility switchgear, UPS blocks electrically coupled together in parallel and electrically coupled to the utility switchgear via transformers, low voltage (LV) power blocks electrically coupled to the UPS blocks, and medium voltage (MV) switchgear electrically coupled to the UPS blocks via transformers. Each of the LV power blocks include one or more generators.

公开(公告)号：US20220316786A1

公开(公告)日：2022-10-06

申请号：US17720730

申请日：2022-04-14

Applicant: INERTECH IP LLC

Inventor： Gerald McDonnell ,  Ming Zhang ,  John Costakis ,  Earl Keisling

IPC: F25D17/02 ,  F25B25/00

Abstract: The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.

公开(公告)号：US10951032B2

公开(公告)日：2021-03-16

申请号：US15715872

申请日：2017-09-26

Applicant: Inertech IP LLC

Inventor： Subrata K. Mondal

IPC: H02J3/32 ,  H02J3/18 ,  H02M7/483 ,  H02J7/34 ,  H02M1/00

Abstract: Systems and methods for supplying power (both active and reactive) at a medium voltage from a DCSTATCOM to an IT load without using a transformer are disclosed. The DCSTATCOM includes an energy storage device, a two-stage DC-DC converter, and a multi-level inverter, each of which are electrically coupled to a common negative bus. The DC-DC converter may include two stages in a bidirectional configuration. One stage of the DC-DC converter uses a flying capacitor topology. The voltages across the capacitors of the flying capacitor topology are balanced and switching losses are minimized by fixed duty cycle operation. The DC-DC converter generates a high DC voltage from a low or high voltage energy storage device such as batteries and/or ultra-capacitors. The multi-level, neutral point, diode-clamped inverter converts the high DC voltage into a medium AC voltage using a space vector pulse width modulation (SVPWM) technique.