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公开(公告)号：US20210116244A1
公开(公告)日：2021-04-22
申请号：US17138392
申请日：2020-12-30
Applicant: INVENSENSE, INC.
Inventor： Doruk Senkal , Robert Hennessy , Houri Johari-Galle , Joseph Seeger
IPC: G01C19/5712 , G01C19/5747 , G01C19/5762
Abstract: In a first aspect, the angular rate sensor comprises a substrate and a rotating structure anchored to the substrate. The angular rate sensor also includes a drive mass anchored to the substrate and an element coupling the drive mass and the rotating structure. The angular rate sensor further includes an actuator for driving the drive mass into oscillation along a first axis in plane to the substrate and for driving the rotating structure into rotational oscillation around a second axis normal to the substrate; a first transducer to sense the motion of the rotating structure in response to a Coriolis force in a sense mode; and a second transducer to sense the motion of the sensor during a drive mode. In a second aspect the angular rate sensor comprises a substrate and two shear masses which are parallel to the substrate and anchored to the substrate via flexible elements. In further embodiments, a dynamically balanced 3-axis gyroscope architecture is provided. Various embodiments described herein can facilitate providing linear and angular momentum balanced 3-axis gyroscope architectures for better offset stability, vibration rejection, and lower part-to-part coupling.
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公开(公告)号：US10958838B2
公开(公告)日：2021-03-23
申请号：US16679046
申请日：2019-11-08
Applicant: InvenSense, Inc.
Inventor： William Kerry Keal
Abstract: In a method of electronic image stabilization, a processor buffers image data into a memory buffer, the image data being obtained by the processor from an image sensor disposed in an electronic device. The processor obtains motion data from a motion sensor disposed in the electronic device, wherein the motion data corresponds with a time of capture of the image data. The processor analyzes the motion data to determine a stabilization correction to apply to the image data. The processor applies the determined stabilization correction to the image data to achieve stabilized image data. The determined stabilization correction is applied, and the stabilized image data is achieved, by the processor without requiring a transfer of the image data from the memory buffer to a graphics processing unit. The stabilized image data is output.
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公开(公告)号：US10935509B2
公开(公告)日：2021-03-02
申请号：US16786361
申请日：2020-02-10
Applicant: INVENSENSE, INC.
Inventor： Fang Liu , Peter Hartwell , Martin Lim , Yushi Yang
Abstract: The present invention relates to methods for detecting gases in an environment using chemical and thermal sensing. In one embodiment, a method includes exposing a chemiresistor embedded within a sensor pixel to a gas in an environment; setting a heater embedded within the sensor pixel to a sensing temperature, the sensing temperature being greater than room temperature; measuring an electrical resistance of the chemiresistor in response to setting the heater to the sensing temperature; and in response to a difference between the electrical resistance of the chemiresistor and a reference electrical resistance being less than a threshold, supplying a fixed power input to the heater embedded within the sensor pixel and measuring a temperature of the sensor pixel relative to a reference temperature.
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公开(公告)号：US10906802B2
公开(公告)日：2021-02-02
申请号：US16440816
申请日：2019-06-13
Applicant: InvenSense, Inc.
Inventor： Daesung Lee , Dongyang Kang , Chienlu Chang , Bongsang Kim , Alan Cuthbertson
Abstract: Provided herein is a method including fusion bonding a handle wafer to a first side of a device wafer. Standoffs are formed on a second side of the device wafer. A first hardmask is deposited on the second side. A second hardmask is deposited on the first hardmask. A surface of the second hardmask is planarized. A photoresist is deposited on the second hardmask, wherein the photoresist includes a MEMS device pattern. The MEMS device pattern is etched into the second hardmask. The MEMS device pattern is etched into the first hardmask, wherein the etching stops before reaching the device wafer. The photoresist and the second hardmask are removed. The MEMS device pattern is further etched into the first hardmask, wherein the further etching reaches the device wafer. The MEMS device pattern is etched into the device wafer. The first hardmask is removed.
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85.发明申请公开(公告)号：US20210025914A1
公开(公告)日：2021-01-28
申请号：US17071782
申请日：2020-10-15
Applicant: INVENSENSE, INC.
Inventor： William Kerry Keal , James Lim , Sinan Karahan
Abstract: A method includes generating motion data by receiving a gyroscope data from a gyroscope sensor, performing integration using the gyroscope data and generating an integrated gyroscope data using a first processor. The method further includes receiving a data from one or more sensors, other than the gyroscope sensor, and performing sensor fusion using the integrated gyroscope data and the data to generate motion data using a second processor.
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Patent Agency Ranking
公开(公告)号：US20210019488A1
公开(公告)日：2021-01-21
申请号：US16741390
申请日：2020-01-13
Applicant: InvenSense, Inc.
Inventor： Quy CHAU , Mei-Lin CHAN
IPC: G06K9/00
Abstract: An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers, wherein the two-dimensional array of ultrasonic transducers is substantially flat, a contact layer having a non-uniform thickness overlying the two-dimensional array of ultrasonic transducers, and an array controller configured to control activation of ultrasonic transducers during an imaging operation. During the imaging operation, the array controller is configured to control a transmission frequency of activated ultrasonic transducers during the imaging operation, wherein a plurality of transmission frequencies are used during the imaging operation to account for an impact of an interference pattern caused by the non-uniform thickness of the contact layer, and is configured to capture at least one fingerprint image using the plurality of transmission frequencies.
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公开(公告)号：US10891461B2
公开(公告)日：2021-01-12
申请号：US15601934
申请日：2017-05-22
Applicant: INVENSENSE, INC.
Inventor： Fang Liu , Peter Hartwell , Martin Lim
Abstract: Facilitating live fingerprint detection utilizing an integrated ultrasound and infrared (IR) sensor is presented herein. A fingerprint sensor can comprise a first substrate comprising the IR sensor, and a second substrate comprising an ultrasonic transducer. The second substrate is attached to a top portion of the first substrate, and a temperature output of the IR sensor facilitates a determination that a fingerprint output of the ultrasonic transducer corresponds to a finger. The IR sensor can comprise polysilicon comprising a thermopile and an array of photonic crystals thermally coupled to the thermopile.
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公开(公告)号：US10860831B2
公开(公告)日：2020-12-08
申请号：US16679067
申请日：2019-11-08
Applicant: InvenSense, Inc.
Inventor： Bruno W. Garlepp , Michael H. Perrott , Michael Daneman , James Christian Salvia , Nikhil Apte
IPC: G06K9/00
Abstract: A method for generating an image is provided. The method comprises capturing a first set of image pixels by an ultrasonic sensor comprising an array of ultrasonic transducers using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of transmit signals routed to a plurality of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of image pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of transmit signals routed to the plurality of ultrasonic transducers. The second beamforming pattern is different than the first beamforming pattern. The second set of image pixels corresponds to an edge region of the ultrasonic sensor. The method additionally comprises combining the first set of image pixels and the second set of image pixels to form the image. An electronic device and a method of generating an image of a fingerprint with a fingerprint sensor are also provided.
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公开(公告)号：US10852135B2
公开(公告)日：2020-12-01
申请号：US16514368
申请日：2019-07-17
Applicant: InvenSense, Inc.
Inventor： Alireza Shirvani , Michael Perrott
IPC: G01C19/56
Abstract: A device includes a proof mass of a sensor, capacitive elements, an electrode circuitry, a time multiplexing circuitry, a sense circuitry, and a force feedback circuitry. The proof mass moves from a first position to a second position responsive to an external actuation. The capacitive elements change capacitive charge in response thereto. The electrode circuitry coupled to the capacitive elements generates a charge signal. The time multiplexing circuitry pass the charge signal during a sensing time period and prevents the charge signal from passing through during a forcing time period. The sense circuitry generates a sensed signal from the charge signal. The force feedback circuitry applies a charge associated with the sensed signal to the electrode circuitry during the forcing time period. The electrode circuitry applies the charge received from the force feedback circuitry to the capacitive elements, moving the proof mass from the second position to another position.
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公开(公告)号：US20200367858A1
公开(公告)日：2020-11-26
申请号：US16879519
申请日：2020-05-20
Applicant: InvenSense, Inc.
Inventor： Leonardo BALDASARRE , Mei-Lin CHAN
Abstract: An ultrasonic transducer device including a substrate, an edge support structure connected to the substrate, and a membrane connected to the edge support structure such that a cavity is defined between the membrane and the substrate, the membrane configured to allow movement at ultrasonic frequencies. The membrane includes a first piezoelectric layer having a first surface and a second surface, a second piezoelectric layer having a first surface and a second surface, wherein the second surface of the first piezoelectric layer faces the first surface of the second piezoelectric layer, a first electrode coupled to the first surface of the first piezoelectric layer, a second electrode coupled to the second surface of the second piezoelectric layer, and a third electrode between the first piezoelectric layer and the second piezoelectric layer.
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