-
公开(公告)号：US20220277963A1
公开(公告)日：2022-09-01
申请号：US17575913
申请日：2022-01-14
Applicant: KCTech Co., Ltd.
Inventor： Hee Sung Chae , Seung Eun Lee , Geun Sik Yun
IPC: H01L21/306 , H01L21/687 , H01L21/67 , H01L21/677 , H01L21/673
Abstract: A substrate polishing system may include a substrate transfer unit comprising a shaft to rotate on a rotation axis perpendicular to a ground and at least one transfer arm to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit by rotation of the shaft, and at least one carrier to perform polishing the substrate transferred by the substrate transfer unit.
-
公开(公告)号：US20220274228A1
公开(公告)日：2022-09-01
申请号：US17579189
申请日：2022-01-19
Applicant: KCTECH CO., LTD.
Inventor： Hee Sung CHAE , Seung Eun LEE , Geun Sik YUN
Abstract: A substrate polishing system may include a substrate transfer unit to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit in a circle by a rotational motion, at least one carrier to perform polishing on the substrate received from the substrate transfer unit, and a loader to load the substrate which is seated on the substrate transfer unit to the carrier or unload a substrate placed on the carrier to the substrate transfer unit.
-
公开(公告)号：US11407081B2
公开(公告)日：2022-08-09
申请号：US16416736
申请日：2019-05-20
Applicant: KCTECH CO., LTD.
Inventor： Jong-Tae Joo , Sang Hyun Kim , Ho Cheon Jeong , Jae Yeol Kim
IPC: B24B37/005 , B24B37/30
Abstract: The present invention relates to a substrate polishing system comprising a polishing pad covered on the polishing platen; a plurality of substrate carriers including a first substrate carrier which moves in a state in which a substrate is mounted and performs a polishing process in a state in which the substrate is in contact with the polishing pad on the polishing pad; a monitoring unit of displaying the information including the identity, position of at least one of the substrate carriers; and a control unit of outputting a warning signal and/or changes the operation of operating devices when an error occurs in real time thereby improving the monitoring efficiency and operation reliability of the polishing process of the substrate.
-
公开(公告)号：US20220111486A1
公开(公告)日：2022-04-14
申请号：US17495818
申请日：2021-10-07
Applicant: KCTECH CO., LTD.
Inventor： Hee Sung CHAE , Seung Eun LEE , Geun Sik YUN
Abstract: A substrate processing system includes a front-end module, a first processing line including a first polishing line and a first cleaning line, a second processing line including a second polishing line and a second cleaning line and disposed in parallel to the first processing line, a first stage disposed between the first cleaning line and the second cleaning line, a first retransfer robot configured to transfer a substrate from the front-end module to the first stage, a second stage disposed between the first polishing line and the second polishing line, and a second retransfer robot configured to transfer the substrate between at least two locations of the first cleaning line, the second cleaning line, the first stage, and the second stage.
-
Patent Agency Ranking
公开(公告)号：US20220111485A1
公开(公告)日：2022-04-14
申请号：US17495816
申请日：2021-10-07
Applicant: KCTECH CO., LTD.
Inventor： Hee Sung CHAE , Seung Eun LEE , Geun Sik YUN
Abstract: A substrate processing system includes a front-end module, a first processing line including a first polishing line and a first cleaning line, a second processing line including a second polishing line and a second cleaning line and disposed in parallel to the first processing line, a first stage disposed between the first processing line and the second processing line, and a first retransfer robot configured to transfer a substrate from the front-end module to the first stage.
-
公开(公告)号：US20210380842A1
公开(公告)日：2021-12-09
申请号：US17293236
申请日：2019-05-29
Applicant: KCTECH CO., LTD.
Inventor： Kwang Soo PARK , Jun Ha HWANG , Soo Wan CHOI , Nak Hyun CHOI
Abstract: The present disclosure relates to a polishing slurry composition and a method of producing the same. The polishing slurry composition according to one embodiment of the present disclosure includes: abrasive particles dispersed so as to have positively-charged particle surfaces; a first dispersant including a nonionic linear polymer; and a second dispersant including an anionic coiling polymer, wherein the polishing slurry composition satisfies the following Expressions 1 and 2: [Expression 1] 4≤log(milling energy)
-
公开(公告)号：US20210269675A1
公开(公告)日：2021-09-02
申请号：US17184620
申请日：2021-02-25
Applicant: KCTECH CO., LTD.
Inventor： Jin Sook HWANG , Hyun Goo KONG , In Seol HWANG
Abstract: A slurry composition for chemical mechanical polishing (CMP) is provided. The slurry composition for CMP includes abrasive particles, an oxidizer, and a carbon polishing inhibitor.
-
公开(公告)号：US20210189178A1
公开(公告)日：2021-06-24
申请号：US17123115
申请日：2020-12-16
Applicant: KCTECH CO., LTD.
Inventor： Gi Joo SHIN , Jung Yoon KIM , Kwang Soo PARK , Soo Wan CHOI
Abstract: A polishing slurry composition enabling implementation of multi-selectivity is provided. The polishing slurry composition includes: a polishing liquid including abrasive particles; and an additive liquid, in which the additive liquid includes a polymer having an amide bond, and a cationic polymer.
-
公开(公告)号：US20180330956A1
公开(公告)日：2018-11-15
申请号：US15773904
申请日：2016-08-08
Applicant: KCTECH CO., LTD.
Inventor： Kyunam PARK
IPC: H01L21/304 , H01L21/306 , H01L21/67 , H01L21/02
Abstract: Provided are a chemical mechanical polishing apparatus and a control method thereof. The chemical mechanical polishing apparatus includes a plurality of polishing platens provided with a polishing pad on an upper surface thereof, and a polishing platen transferring unit for transferring the plurality of polishing platens to different process positions according to a predetermined process sequence. Here, different processes are performed at different process positions.
-
-
-
-
-
-
-
-
Search Results
89
records
(took 0.019 seconds)
