公开(公告)号：US20180257927A1

公开(公告)日：2018-09-13

申请号：US15453846

申请日：2017-03-08

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Jaime Scott Zahorian

IPC: B81C1/00 ,  B81B7/00 ,  B06B1/06 ,  B06B1/02

CPC classification number: B81C1/00238 ,  B06B1/0292 ,  B06B1/0622 ,  B81B7/008 ,  B81B2201/038 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2201/013 ,  B81C2203/0118 ,  B81C2203/0792

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US20180210073A1

公开(公告)日：2018-07-26

申请号：US15934150

申请日：2018-03-23

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston

IPC: G01S7/524 ,  H03K19/0175 ,  G01S7/521

CPC classification number: G01S7/524 ,  A61B8/4483 ,  A61B8/54 ,  G01S7/5202 ,  G01S7/5208 ,  G01S7/52096 ,  G01S7/521 ,  H03K19/017545

Abstract: Apparatus and methods are provided directed to a device, including at least one ultrasonic transducer, a multi-level pulser coupled to the at least one ultrasonic transducer; the multi-level pulser including a plurality of input terminals configured to receive respective input voltages, an output terminal configured to provide an output voltage, and a signal path between a first input terminal and the output terminal including a first transistor having a first conductivity type coupled to a first diode and, in parallel, a second transistor having a second conductivity type coupled to a second diode.

公开(公告)号：US09958537B2

公开(公告)日：2018-05-01

申请号：US15645771

申请日：2017-07-10

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston

IPC: A61B8/00 ,  G01S7/524 ,  G01S7/521 ,  H03K19/0175

CPC classification number: G01S7/524 ,  A61B8/4483 ,  A61B8/54 ,  G01S7/5202 ,  G01S7/5208 ,  G01S7/52096 ,  G01S7/521 ,  H03K19/017545

Abstract: Apparatus and methods are provided directed to a device, including at least one ultrasonic transducer, a multi-level pulser coupled to the at least one ultrasonic transducer; the multi-level pulser including a plurality of input terminals configured to receive respective input voltages, an output terminal configured to provide an output voltage, and a signal path between a first input terminal and the output terminal including a first transistor having a first conductivity type coupled to a first diode and, in parallel, a second transistor having a second conductivity type coupled to a second diode.

公开(公告)号：US09944514B2

公开(公告)日：2018-04-17

申请号：US15626801

申请日：2017-06-19

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: H01L29/84 ,  B81C1/00 ,  B06B1/02 ,  G01N29/24 ,  H04R19/00 ,  B81B7/00

CPC classification number: B81C1/00301 ,  B06B1/02 ,  B06B1/0292 ,  B81B7/007 ,  B81C1/00134 ,  B81C1/00158 ,  B81C1/00246 ,  B81C2201/0195 ,  B81C2203/0735 ,  B81C2203/0771 ,  G01N29/2406 ,  H01L29/84 ,  H04R19/005

Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.

公开(公告)号：US09910018B2

公开(公告)日：2018-03-06

申请号：US15177977

申请日：2016-06-09

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston

IPC: H01L29/84 ,  H01L21/30 ,  G01N29/24 ,  B81C1/00 ,  B06B1/02 ,  A61B8/00 ,  B81B7/00

CPC classification number: G01N29/2406 ,  A61B8/4483 ,  B06B1/0292 ,  B81B7/007 ,  B81B2201/0271 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/0792 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/146 ,  H01L2924/1461

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US09910017B2

公开(公告)日：2018-03-06

申请号：US15177899

申请日：2016-06-09

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston

IPC: H01L21/00 ,  H01L21/30 ,  G01N29/24 ,  B81C1/00 ,  B06B1/02 ,  A61B8/00 ,  B81B7/00

CPC classification number: G01N29/2406 ,  A61B8/4483 ,  B06B1/0292 ,  B81B7/007 ,  B81B2201/0271 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/0792 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/146 ,  H01L2924/1461

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US20180003678A1

公开(公告)日：2018-01-04

申请号：US15689863

申请日：2017-08-29

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston

IPC: G01N29/24 ,  B81C1/00 ,  A61B8/00 ,  B06B1/02 ,  B81B7/00

CPC classification number: G01N29/2406 ,  A61B8/4483 ,  B06B1/0292 ,  B81B7/007 ,  B81B2201/0271 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/0792 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/146 ,  H01L2924/1461

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US20170264307A1

公开(公告)日：2017-09-14

申请号：US15605469

申请日：2017-05-25

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston

IPC: H03M1/00 ,  H03M1/12 ,  H03M1/46 ,  A61B8/00

CPC classification number: H03M1/002 ,  A61B8/4483 ,  A61B8/4494 ,  A61B8/54 ,  H03M1/125 ,  H03M1/462

Abstract: An ultrasound device including an asynchronous successive approximation analog-to-digital converter and method are provided. The device includes at least one ultrasonic transducer, a plurality of asynchronous successive-approximation-register (SAR) analog-to-digital converters (ADC) coupled to the at least one ultrasonic transducer, at least one asynchronous SAR in the plurality having a sample and hold stage, a digital-to-analog converter (DAC), a comparator, and control circuitry, wherein a DAC update event following at least one bit conversion is synchronized to a corresponding DAC update event of at least one other ADC in the plurality of ADCs.

公开(公告)号：US20170225196A1

公开(公告)日：2017-08-10

申请号：US15581511

申请日：2017-04-28

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B06B1/02 ,  G10K9/12 ,  B81B7/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: B06B1/02 ,  B06B1/0292 ,  B81B3/0021 ,  B81B7/0077 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/015 ,  B81C1/00158 ,  B81C2201/013 ,  B81C2203/0118 ,  B81C2203/0735 ,  B81C2203/0771 ,  G10K9/12 ,  G10K11/18

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

公开(公告)号：US20170163225A1

公开(公告)日：2017-06-08

申请号：US14957395

申请日：2015-12-02

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Keith G. Fife ,  Nevada J. Sanchez ,  Andrew J. Casper ,  Tyler S. Ralston

IPC: H03F3/16 ,  A61B8/00 ,  A61B5/00

CPC classification number: H03F3/16 ,  A61B5/6801 ,  A61B8/4444 ,  A61B8/5207 ,  G01S7/52025 ,  H03F1/086 ,  H03F3/45183 ,  H03F2200/408 ,  H03F2200/555 ,  H03F2203/45471 ,  H03F2203/45504 ,  H03F2203/45631 ,  H03F2203/45634 ,  H03F2203/45646 ,  H03F2203/45648 ,  H03F2203/45674 ,  H03F2203/45686 ,  H03F2203/45692 ,  H03F2203/45726

Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.