公开(公告)号：US07784009B2

公开(公告)日：2010-08-24

申请号：US11923833

申请日：2007-10-25

申请人： Roger A. Booth, Jr. ,  Kangguo Cheng ,  Jack A. Mandelman ,  William R. Tonti

发明人： Roger A. Booth, Jr. ,  Kangguo Cheng ,  Jack A. Mandelman ,  William R. Tonti

IPC分类号： G06F17/50

CPC分类号： H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： Electrically programmable fuses for an integrated circuit and design structures thereof are presented, wherein the electrically programmable fuse has a first terminal portion and a second terminal portion interconnected by a fuse element. The first terminal portion and the second terminal portion reside over a first support and a second support, respectively, with the first support and the second support being spaced apart, and the fuse element bridging the distance between the first terminal portion over the first support and the second terminal portion over the second support. The fuse, first support and second support define a π-shaped structure in elevational cross-section through the fuse element. The first terminal portion, second terminal portion and fuse element are coplanar, with the fuse element residing above a void. The design structure for the fuse is embodied in a machine-readable medium for designing, manufacturing or testing a design of the fuse.

摘要翻译： 提出了用于集成电路的电可编程保险丝及其设计结构，其中电可编程熔丝具有由熔丝元件互连的第一端子部分和第二端子部分。 第一端子部分和第二端子部分分别驻留在第一支撑件和第二支撑件上，第一支撑件和第二支撑件间隔开，并且熔丝元件将第一端子部分之间的距离跨越第一支撑件和 在第二支撑件上方的第二端子部分。 保险丝，第一支撑件和第二支撑件通过保险丝元件在垂直截面中限定了一个“形”结构。 第一端子部分，第二端子部分和熔丝元件是共面的，其中熔丝元件位于空隙之上。 保险丝的设计结构体现在用于设计，制造或测试保险丝设计的机器可读介质中。

公开(公告)号：US07777296B2

公开(公告)日：2010-08-17

申请号：US11566865

申请日：2006-12-05

申请人： Haining S. Yang ,  Jack A. Mandelman

发明人： Haining S. Yang ,  Jack A. Mandelman

IPC分类号： H01L23/525

CPC分类号： H01L29/0665 ,  B82Y10/00 ,  H01L21/28525 ,  H01L21/76805 ,  H01L21/7682 ,  H01L21/76876 ,  H01L21/76879 ,  H01L23/5256 ,  H01L29/0673 ,  H01L29/0676 ,  H01L2221/1063 ,  H01L2221/1094 ,  H01L2924/0002 ,  H01L2924/00

摘要： A nano-fuse structural arrangement, includes, for example, a semiconductor substrate having an electrically conductive region formed thereon; an electrically conductive elongated nano-structure having a maximum diameter of less than approximately 50 nm and a maximum length of approximately 250 nm and being formed on the electrically conductive region; a barrier having barrier parts completely spaced from and completely surrounding elongated outer surfaces of the nano-structure, the spaces between the barrier and surfaces consisting essentially of a vacuum and being approximately equally spaced, so that the electrically conductive elongated nano-structure is blowable responsive to an electrical current flowable there through in a range of approximately 4 μA to approximately 120 μA.

摘要翻译： 纳米熔丝结构布置包括例如其上形成有导电区域的半导体衬底; 导电细长纳米结构，其具有小于约50nm的最大直径和约250nm的最大长度，并且形成在导电区域上; 阻挡层具有与纳米结构的细长外表面完全间隔开并且完全包围细长外表面的阻挡部分，阻挡层和表面之间的空间基本上由真空构成，并且大致等间隔，使得导电细长纳米结构是可发射的 到大约4μA至大约120μA的范围内可流过的电流。

公开(公告)号：US07700466B2

公开(公告)日：2010-04-20

申请号：US11828740

申请日：2007-07-26

申请人： Roger A. Booth, Jr. ,  Kangguo Cheng ,  Jack A. Mandelman

发明人： Roger A. Booth, Jr. ,  Kangguo Cheng ,  Jack A. Mandelman

IPC分类号： H01L21/425 ,  H01L21/76 ,  H01L21/20 ,  H01L21/36 ,  H01L21/3205 ,  H01L21/4763 ,  H01L21/302 ,  H01L21/461

CPC分类号： H01L29/7391 ,  H01L23/485 ,  H01L29/66356 ,  Y10S438/926 ,  Y10S438/979

摘要： In one embodiment, a mandrel and an outer dummy spacer may be employed to form a first conductivity type region. The mandrel is removed to form a recessed region wherein a second conductivity type region is formed. In another embodiment, a mandrel is removed from within shallow trench isolation to form a recessed region, in which an inner dummy spacer is formed. A first conductivity type region and a second conductivity region are formed within the remainder of the recessed region. An anneal is performed so that the first conductivity type region and the second conductivity type region abut each other by diffusion. A gate electrode is formed in self-alignment to the p-n junction between the first and second conductivity regions. The p-n junction controlled by the gate electrode, which may be sublithographic, constitutes an inventive tunneling effect transistor.

摘要翻译： 在一个实施例中，可以使用心轴和外部虚拟间隔件来形成第一导电类型区域。 去除心轴以形成其中形成第二导电类型区域的凹陷区域。 在另一个实施例中，心轴从浅沟槽隔离中移除以形成凹陷区域，其中形成内部虚拟间隔物。 第一导电类型区域和第二导电区域形成在凹陷区域的其余部分内。 进行退火，使得第一导电类型区域和第二导电类型区域通过扩散彼此邻接。 栅电极形成为与第一和第二导电区域之间的p-n结自对准。 由栅电极控制的可能是亚光刻的p-n结构成本发明的隧道效应晶体管。

公开(公告)号：US20090115448A1

公开(公告)日：2009-05-07

申请号：US11934825

申请日：2007-11-05

申请人： Wagdi W. Abadeer ,  Louis Lu-Chen Hsu ,  Jack A. Mandelman

发明人： Wagdi W. Abadeer ,  Louis Lu-Chen Hsu ,  Jack A. Mandelman

IPC分类号： H03K17/16

CPC分类号： H03K19/0005 ,  H03J3/185 ,  H03L7/08 ,  H03L7/0805 ,  H03L7/0891

摘要： A design structure for an impedance matcher that automatically matches impedance between a driver and a receiver. The design structure for an impedance matcher includes a phase-locked loop (PLL) circuit that locks onto a data signal provided by the driver. The impedance matcher also includes tunable impedance matching circuitry responsive to one or more voltage-controlled oscillator control signals within the PLL circuit so as to generate an output signal that is impedance matched with the receiver.

摘要翻译： 用于阻抗匹配器的设计结构，其自动匹配驱动器和接收器之间的阻抗。 阻抗匹配器的设计结构包括锁定到由驱动器提供的数据信号的锁相环（PLL）电路。 阻抗匹配器还包括响应于PLL电路内的一个或多个压控振荡器控制信号的可调阻抗匹配电路，以产生与接收器阻抗匹配的输出信号。

公开(公告)号：US07521776B2

公开(公告)日：2009-04-21

申请号：US11618346

申请日：2006-12-29

申请人： Ethan H. Cannon ,  Toshiharu Furukawa ,  Charles Koburger, III ,  Jack A. Mandelman ,  William Tonti

发明人： Ethan H. Cannon ,  Toshiharu Furukawa ,  Charles Koburger, III ,  Jack A. Mandelman ,  William Tonti

IPC分类号： H01L29/04

CPC分类号： H01L27/1203 ,  H01L21/26506 ,  H01L21/823807 ,  H01L21/823878 ,  H01L29/1083

摘要： Novel semiconductor structures and methods are disclosed for forming a buried recombination layer underneath the bulk portion of a hybrid orientation technology by implanting at least one recombination center generating element to reduce single event upset rates in CMOS devices thereabove. The crystalline defects in the buried recombination layer caused by the recombination center generating elements are not healed even after a high temperature anneal and serve as recombination centers where holes and electrons generated by ionizing radiation are collected by. Multiple buried recombination layers may be formed. Optionally, one such layer may be biased with a positive voltage to prevent latchup by collecting electrons.

摘要翻译： 公开了新的半导体结构和方法，用于通过在至少一个复合中心产生元件上植入至少一个复合中心产生元件以减少上述CMOS器件中的单一事件镦粗率来在混合取向技术的本体部分之下形成掩埋复合层。 由复合中心产生元件引起的掩埋复合层中的晶体缺陷即使在高温退火之后也不会愈合，并且用作通过电离辐射产生的空穴和电子的复合中心。 可以形成多个掩埋复合层。 可选地，一个这样的层可以被正电压偏置以通过收集电子来阻止闭锁。

公开(公告)号：US07514323B2

公开(公告)日：2009-04-07

申请号：US11164513

申请日：2005-11-28

申请人： David M. Dobuzinsky ,  Herbert L. Ho ,  Jack A. Mandelman ,  Yoichi Otani

发明人： David M. Dobuzinsky ,  Herbert L. Ho ,  Jack A. Mandelman ,  Yoichi Otani

IPC分类号： H01L29/00

CPC分类号： H01L29/792 ,  H01L21/26586 ,  H01L27/115 ,  H01L27/11568 ,  H01L29/7926

摘要： A semiconductor memory device in which a vertical trench semiconductor-oxide-nitride-oxide-semiconductor (SONOS) memory cell is created in a semiconductor-on-insulator (SOI) substrate is provided that allows for the integration of dense non-volatile random access memory (NVRAM) cells in SOI-based complementary metal oxide semiconductor (CMOS) technology. The trench is processed using conventional trench processing and it is processed near the beginning of the inventive method that allows for the fabrication of the memory cell to be fully separated from SOI logic processing.

摘要翻译： 提供一种半导体存储器件，其中在绝缘体上半导体（SOI）衬底中形成垂直沟槽半导体氧化物 - 氮化物 - 氧化物半导体（SONOS）存储单元，其允许将致密的非易失性随机存取 基于SOI的互补金属氧化物半导体（CMOS）技术的存储器（NVRAM）单元。 使用常规沟槽处理处理沟槽，并且在本发明方法的开始附近处理允许将存储单元的制造完全从SOI逻辑处理分离开来的处理。

公开(公告)号：US20090072290A1

公开(公告)日：2009-03-19

申请号：US11857770

申请日：2007-09-19

申请人： Kangguo Cheng ,  Louis C. Hsu ,  Jack A. Mandelman ,  William Tonti

发明人： Kangguo Cheng ,  Louis C. Hsu ,  Jack A. Mandelman ,  William Tonti

IPC分类号： H01L21/70 ,  H01L27/108

CPC分类号： H01L27/1203 ,  H01L21/84 ,  H01L27/0629 ,  H01L27/10861 ,  H01L28/60

摘要： An isolated shallow trench isolation portion is formed in a top semiconductor portion of a semiconductor-on-insulator substrate along with a shallow trench isolation structure. A trench in the shape of a ring is formed around a doped top semiconductor portion and filled with a conductive material such as doped polysilicon. The isolated shallow trench isolation portion and the portion of a buried insulator layer bounded by a ring of the conductive material are etched to form a cavity. A capacitor dielectric is formed on exposed semiconductor surfaces within the cavity and above the doped top semiconductor portion. A conductive material portion formed in the trench and above the doped top semiconductor portion constitutes an inner electrode of a capacitor, while the ring of the conductive material, the doped top semiconductor portion, and a portion of a handle substrate abutting the capacitor dielectric constitute a second electrode.

摘要翻译： 孤立的浅沟槽隔离部分形成在绝缘体上半导体衬底的顶部半导体部分以及浅沟槽隔离结构中。 环形形状的沟槽形成在掺杂顶部半导体部分周围，并填充有诸如掺杂多晶硅的导电材料。 隔离的浅沟槽隔离部分和由导电材料的环限定的掩​​埋绝缘体层的部分被蚀刻以形成空腔。 在空腔内的暴露的半导体表面上和掺杂的顶部半导体部分之上形成电容器电介质。 形成在沟槽中并且在掺杂顶部半导体部分上方的导电材料部分构成电容器的内部电极，而导电材料的环，掺杂的顶部半导体部分和与电容器电介质邻接的手柄衬底的一部分构成一个 第二电极。

公开(公告)号：US20090008705A1

公开(公告)日：2009-01-08

申请号：US11773607

申请日：2007-07-05

申请人： Huilong Zhu ,  Thomas W. Dyer ,  Jack A. Mandelman ,  Werner Rausch

发明人： Huilong Zhu ,  Thomas W. Dyer ,  Jack A. Mandelman ,  Werner Rausch

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/7842 ,  H01L29/66795 ,  H01L29/785

摘要： A silicon containing fin is formed on a semiconductor substrate. A silicon oxide layer is formed around the bottom of the silicon containing fin. A gate dielectric is formed on the silicon containing fin followed by formation of a gate electrode. While protecting the portion of the semiconductor fin around the channel, a bottom portion of the silicon containing semiconductor fin is etched by a isotropic etch leaving a body strap between the channel of a finFET on the silicon containing fin and an underlying semiconductor layer underneath the silicon oxide layer. The fin may comprise a stack of inhomogeneous layers in which a bottom layer is etched selectively to a top semiconductor layer. Alternatively, the fin may comprise a homogeneous semiconductor material and the silicon containing fin may be protected by dielectric films on the sidewalls and top surfaces of the silicon containing fin.

摘要翻译： 在半导体衬底上形成含硅翅片。 在含硅翅片的底部周围形成氧化硅层。 在含硅鳍上形成栅电介质，形成栅电极。 在保护半导体翅片周围的通道的部分的同时，通过各向同性的蚀刻蚀刻含硅半导体鳍片的底部部分，从而在含硅鳍片上的finFET的通道和硅下方的下面的半导体层之间留下体带 氧化层。 翅片可以包括不均匀层的堆叠，其中底层被选择性地蚀刻到顶部半导体层。 或者，翅片可以包括均匀的半导体材料，并且含硅翅片可以由含硅翅片的侧壁和顶表面上的电介质膜保护。

公开(公告)号：US07288804B2

公开(公告)日：2007-10-30

申请号：US11372380

申请日：2006-03-09

申请人： Roger A. Booth, Jr. ,  Kangguo Cheng ,  Jack A. Mandelman ,  William R. Tonti

发明人： Roger A. Booth, Jr. ,  Kangguo Cheng ,  Jack A. Mandelman ,  William R. Tonti

IPC分类号： H01L27/10

CPC分类号： H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： Electrically programmable fuse structures for an integrated circuit and methods of fabrication thereof are presented, wherein the electrically programmable fuse has a first terminal portion and a second terminal portion interconnected by a fuse element. The first terminal portion and the second terminal portion reside over a first support and a second support, respectively, with the first support and the second support being spaced apart, and the fuse element bridging the distance between the first terminal portion over the first support and the second terminal portion over the second support. The fuse, first support and second support define a α-shaped structure in elevational cross-section through the fuse element. The first terminal portion, second terminal portion and fuse element are coplanar, with the fuse element residing above a void, which in one embodiment is filed by a thermally insulating dielectric material that surrounds the fuse element.

摘要翻译： 提出了用于集成电路的电可编程熔丝结构及其制造方法，其中电可编程熔丝具有由熔丝元件互连的第一端子部分和第二端子部分。 第一端子部分和第二端子部分分别驻留在第一支撑件和第二支撑件上，第一支撑件和第二支撑件间隔开，并且熔丝元件将第一端子部分之间的距离跨越第一支撑件和 在第二支撑件上方的第二端子部分。 保险丝，第一支撑件和第二支撑件在通过熔断元件的正面横截面中限定了α形结构。 第一端子部分，第二端子部分和熔丝元件是共面的，其中熔丝元件位于空隙上方，在一个实施例中，熔断元件由围绕熔丝元件的绝热介电材料覆盖。

公开(公告)号：US07262451B2

公开(公告)日：2007-08-28

申请号：US10541660

申请日：2003-01-08

申请人： Jack A. Mandelman ,  Jeffrey P. Gambino ,  Geng Wang

发明人： Jack A. Mandelman ,  Jeffrey P. Gambino ,  Geng Wang

IPC分类号： H01L27/108

CPC分类号： H01L27/10894 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/02639 ,  H01L21/3081 ,  H01L27/10864

摘要： Semiconductor devices are fabricated in a strained layer region and strained layer-free region of the same substrate. A first semiconductor device, such as a memory cell, e.g. a deep trench storage cell, is formed in a strained layer-free region of the substrate. A strained layer region is selectively formed in the same substrate. A second semiconductor device (66, 68, 70), such as an FET, e.g. an MOSFET logic device, is formed in the strained layer region.

摘要翻译： 半导体器件制造在同一衬底的应变层区域和无应变层的层中。 第一半导体器件，例如存储器单元，例如 在衬底的无应变层的区域中形成深沟槽存储单元。 在相同的衬底中选择性地形成应变层区域。 第二半导体器件（66,68,70），例如FET，例如， 一个MOSFET逻辑器件，形成在应变层区域中。