摘要:
A non-volatile semiconductor memory device comprises first and second sub-memory arrays and a strapping line disposed between the first and second sub-memory arrays. A programming operation of the first sub-memory array is performed by simultaneously applying a programming voltage to odd and even bit lines connected to memory cells within the first sub-memory array.
摘要:
A flash memory device comprises a plurality of memory blocks. A selected memory block among the plurality of memory blocks includes 2n pages of data. The selected memory block includes different types of memory cells capable of storing different numbers of bits.
摘要:
A ferroelectric memory device includes a microelectronic substrate and a plurality of ferroelectric capacitors on the substrate, arranged as a plurality of rows and columns in respective row and column directions. A plurality of parallel plate lines overlie the ferroelectric capacitors and extend along the row direction, wherein a plate line contacts ferroelectric capacitors in at least two adjacent rows. The plurality of plate lines may include a plurality of local plate lines, and the ferroelectric memory device may further include an insulating layer disposed on the local plate lines and a plurality of main plate lines disposed on the insulating layer and contacting the local plate lines through openings in the insulating layer. In some embodiments, ferroelectric capacitors in adjacent rows share a common upper electrode, and respective ones of the local plate lines are disposed on respective ones of the common upper electrodes. Ferroelectric capacitors in adjacent rows may share a common ferroelectric dielectric region. Related fabrication methods are discussed.
摘要:
A stacked ferroelectric memory device has selection transistors including a first gate structure, a first impurity region, a second impurity region, a first insulating interlayer covering the selection transistors, bit line structures electrically connected to the first impurity regions, a second insulating interlayer covering the bit line structures, doped single crystalline silicon plugs formed through the first and the second insulating interlayers, each of which contacts the second impurity region and has a height greater than that of the bit line structures, active patterns disposed on the plugs and the second insulating interlayer, each of which contacts the plugs, and ferroelectric transistors disposed on the active patterns, each of which has a second gate structure including a ferroelectric layer pattern and a conductive pattern, a third impurity region and a fourth impurity region. The ferroelectric memory device performs a random access operation and has a high degree of integration.
摘要:
A ferroelectric memory device includes a microelectronic substrate and a plurality of ferroelectric capacitors on the substrate, arranged as a plurality of rows and columns in respective row and column directions. A plurality of parallel plate lines overlie the ferroelectric capacitors and extend along the row direction, wherein a plate line contacts ferroelectric capacitors in at least two adjacent rows. The plurality of plate lines may include a plurality of local plate lines, and the ferroelectric memory device may further include an insulating layer disposed on the local plate lines and a plurality of main plate lines disposed on the insulating layer and contacting the local plate lines through openings in the insulating layer. In some embodiments, ferroelectric capacitors in adjacent rows share a common upper electrode, and respective ones of the local plate lines are disposed on respective ones of the common upper electrodes. Ferroelectric capacitors in adjacent rows may share a common ferroelectric dielectric region. Related fabrication methods are discussed.
摘要:
Non-volatile memory devices include a floating gate having a lower portion and a pair of walls extending upward from opposite edges of the lower portion to define a void. An overlap area between adjacent floating gates is decreased by a side area of the void defined by the lower portion and the walls, so that a parasitic electrostatic capacitance can be reduced.
摘要:
A ferroelectric random access memory device including a pulse generator circuit capable of generating a pulse signal in response to an address transition. A chip enable buffer circuit activates a chip enable flag signal in response to a first transition of the pulse signal. A row selector circuit selects and drives one of the rows in response to the address. The row selector circuit also generates a flag signal indicating a selection of a plate line. A control circuit activates a plate control signal in response to the activation of a write enable signal, and deactivates the plate control signal in response to a second transition of the pulse signal. A plate line of a selected row is re-activated according to activation of the plate control signal and is deactivated according to deactivation of the plate control signal.
摘要:
A semiconductor memory device and a method for manufacturing the same are provided. The semiconductor memory device includes an oxide layer for isolating individual devices which define device areas so that a cell area and a peripheral circuit area are separated from each other on a semiconductor substrate, a plurality of MOS transistors, which are comprised of source areas, drain areas, and gates that are formed in the cell area and the peripheral circuit area, a bit line, which is formed on the plurality of MOS transistors and is electrically connected to the MOS transistor, a stack-shaped capacitor, which is comprised of a first electrode, a dielectric layer, and a second electrode between which the MOS transistors and the bit line in the cell area is interposed, a guard-ring pattern, which are interposed between the cell area and the peripheral circuit area, surrounds the cell area and is apart from the peripheral circuit area, and a contact fill for plate electrode, which is formed in the guard-ring pattern and is in contact with the second electrode that is formed on the internal sidewall and the bottom of the guard-ring pattern. The guard-ring pattern is formed in a boundary between the cell area and the peripheral circuit area while surrounding the cell area, and thereby step caused by manufacture of the stack-shaped capacitor are removed during a manufacturing process, and the contact fill for plate electrode is formed in the guard-ring pattern, and thereby the ground resistance of the capacitor is reduced, and the electrical characteristics of the memory device are improved.
摘要:
A conductive portion connects a lower conductive layer formed on a semiconductor substrate provided in a first interlayer insulating layer to an upper conductive layer formed on the lower conductive layer, and provided in a second interlayer insulating layer. This portion is divided into at least one plug and a pad. At least one plug is formed in a first interlayer insulating layer and the lower part of a second interlayer insulating layer. The second interlayer insulating layer is divided into a plurality of interlayer insulating layers so that upper and lower widths of the divided plugs formed in the divided portion of the second interlayer insulating layer are not greatly different from each other. The pad formed on the upper portion of the second interlayer insulating layer has an upper width such that the upper conductive layer connected to the pad is not undesirably connected to an adjacent upper conductive layer via the pad.
摘要:
A ferroelectric memory device along with a method of forming the same are provided. A first interlayer insulating layer is formed on a semiconductor substrate. A buried contact structure is formed on the first interlayer insulating layer. The buried contact structure is electrically connected to the substrate through a first contact hole extending through the first interlayer insulating layer. A blocking layer covers or encapsulates the buried contact structure and the first interlayer insulating layer. A second interlayer insulating layer is formed on the blocking layer. A ferroelectric capacitor formed on the second interlayer insulating layer and is electrically connected to the buried contact structure through a second contact hole that penetrates the second interlayer insulating layer and the blocking layer.