公开(公告)号：US20090082571A1

公开(公告)日：2009-03-26

申请号：US12289750

申请日：2008-11-03

申请人： Toshiro Sasaki ,  Takashi Ando ,  Takahiro Imai ,  Dai Kubota ,  Eiki Shitara ,  Kunio Atsumi

发明人： Toshiro Sasaki ,  Takashi Ando ,  Takahiro Imai ,  Dai Kubota ,  Eiki Shitara ,  Kunio Atsumi

IPC分类号： C07D513/04

CPC分类号： C07D513/04 ,  C07F9/6561 ,  Y02P20/55

摘要： The present invention relates to compounds represented by formula (1) and a process for producing the same. The use of these compounds can realize the production of carbapenem derivatives having potent antimicrobial activity and a wide antimicrobial spectrum in a safe and cost-effective manner.

摘要翻译： 本发明涉及由式（1）表示的化合物及其制备方法。 这些化合物的使用可以以安全和成本有效的方式实现具有有效抗微生物活性和广谱抗菌谱的碳青霉烯衍生物的生产。

公开(公告)号：US07481682B2

公开(公告)日：2009-01-27

申请号：US12026644

申请日：2008-02-06

申请人： Masakazu Murakami ,  Takahiro Imai ,  Tamaki Takabayashi ,  Takenobu Yabu ,  Syougo Tomita ,  Seiichi Ueno ,  Katsunori Takeda

发明人： Masakazu Murakami ,  Takahiro Imai ,  Tamaki Takabayashi ,  Takenobu Yabu ,  Syougo Tomita ,  Seiichi Ueno ,  Katsunori Takeda

IPC分类号： H01R13/502

CPC分类号： H01R13/514 ,  H01R4/185 ,  H01R13/6658 ,  H01R31/08 ,  H01R2201/26

摘要： A joint connector according to the present invention is provided with a circuit board, a male connector having male terminals provided on the circuit board at a predetermined interval and standing in one direction and a direction that crosses the one direction, the male terminals being selectively connected by a copper foil circuit, and a female connector in which female connector elements each having female terminals inserted and interlocked in female terminal holders are stacked, wherein the male connector and the female connector are fit to each other. This achieves cost reduction and improvement in work efficiency in electric wire connection by attaining easy electric wire connection and branching.

公开(公告)号：US20080311023A1

公开(公告)日：2008-12-18

申请号：US10584927

申请日：2005-05-26

申请人： Yoshiyuki Yamamoto ,  Kiichi Meguro ,  Takahiro Imai

发明人： Yoshiyuki Yamamoto ,  Kiichi Meguro ,  Takahiro Imai

IPC分类号： C01B31/06

CPC分类号： C30B25/105 ,  C30B25/20 ,  C30B29/04 ,  Y10T428/24355

摘要： A single crystal diamond grown by vapor phase synthesis, wherein when one main surface is irradiated with a linearly polarized light considered to be the synthesis of two mutually perpendicular linearly polarized light beams, the phase difference between the two mutually perpendicular linearly polarized light beams exiting another main surface on the opposite side is, at a maximum, not more than 50 nm per 100 μm of crystal thickness over the entire crystal. This single crystal diamond is of a large size and high quality unattainable up to now, and has characteristics that are extremely desirable in semiconductor device substrates and are applied to optical components of which low strain is required.

摘要翻译： 通过气相合成生长的单晶金刚石，其中当被认为是两个相互垂直的线偏振光的合成的线偏振光照射一个主表面时，两个相互垂直的线偏振光束离开另一个的相位差 在整个晶体上，相对侧的主表面最大为每100微米的晶体厚度不大于50nm。 这种单晶金刚石迄今为止不具有大尺寸和高质量，并且具有在半导体器件基板中非常需要的特性，并且被应用于需要低应变的光学部件。

公开(公告)号：US20080200075A1

公开(公告)日：2008-08-21

申请号：US12026644

申请日：2008-02-06

申请人： Masakazu Murakami ,  Takahiro Imai ,  Tamaki Takabayashi ,  Takenobu Yabu ,  Syougo Tomita ,  Seiichi Ueno ,  Katsunori Takeda

发明人： Masakazu Murakami ,  Takahiro Imai ,  Tamaki Takabayashi ,  Takenobu Yabu ,  Syougo Tomita ,  Seiichi Ueno ,  Katsunori Takeda

IPC分类号： H01R13/502

CPC分类号： H01R13/514 ,  H01R4/185 ,  H01R13/6658 ,  H01R31/08 ,  H01R2201/26

摘要： A joint connector according to the present invention is provided with a circuit board, a male connector having male terminals provided on the circuit board at a predetermined interval and standing in one direction and a direction that crosses the one direction, the male terminals being selectively connected by a copper foil circuit, and a female connector in which female connector elements each having female terminals inserted and interlocked in female terminal holders are stacked, wherein the male connector and the female connector are fit to each other. This achieves cost reduction and improvement in work efficiency in electric wire connection by attaining easy electric wire connection and branching.

摘要翻译： 根据本发明的接头连接器设置有电路板，阳连接器，具有以预定间隔设置在电路板上的阳端子，并且沿一个方向和与该一个方向交叉的方向竖立，阳端子被选择性地连接 通过铜箔电路和阴连接器，其中，阴连接器元件各自具有插入并互锁在阴端子保持器中的阴端子，其中阳连接器和阴连接器彼此配合。 通过实现容易的电线连接和分支，可实现电线连接的成本降低和工作效率的提高。

公开(公告)号：US07413935B2

公开(公告)日：2008-08-19

申请号：US11033259

申请日：2005-01-12

申请人： Takahiro Imai

发明人： Takahiro Imai

IPC分类号： H01L21/00

CPC分类号： H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method of fabricating a semiconductor device includes hardening resin at a temperature that is less than or equal to the boiling point of the resin and until the hardening reaction ratio of the resin has reached at least 80%, the resin being disposed between a wiring board which has an interconnecting pattern and a semiconductor chip which has a plurality of electrodes and which is mounted on the wiring board in such a manner that the electrodes are in contact with the interconnecting pattern. A eutectic alloy joint is then formed between the electrodes and the interconnecting pattern.

摘要翻译： 一种制造半导体器件的方法包括在小于或等于树脂沸点的温度下固化树脂，直到树脂的硬化反应比达到至少80％，树脂被布置在布线板 其具有互连图案和具有多个电极并且以使得电极与互连图案接触的方式安装在布线板上的半导体芯片。 然后在电极和互连图案之间形成共晶合金接头。

公开(公告)号：US07407549B2

公开(公告)日：2008-08-05

申请号：US10980152

申请日：2004-11-04

申请人： Kiichi Meguro ,  Yoshiyuki Yamamoto ,  Takahiro Imai

发明人： Kiichi Meguro ,  Yoshiyuki Yamamoto ,  Takahiro Imai

IPC分类号： C30B29/02

CPC分类号： C30B29/04 ,  C30B25/20

摘要： A diamond single crystal composite substrate which are constructed from a plurality of diamond single crystal substrates with uniform plane orientations disposed side by side and integrated overall by growing diamond single crystals thereon by vapor phase synthesis, in which the deviation of the plane orientation of the main plane of each of said plurality of diamond single crystal substrates, excluding one diamond single crystal substrate, from the {100} plane is less than 1 degree, the deviation of the plane orientation of the main plane of the excluded one substrate from the {100} plane is 1 to 8 degrees, said one diamond single crystal substrate is disposed in the outermost circumferential part when the diamond single crystal substrates are disposed side by side, and is disposed so that the direction in the main plane of said one substrate faces in the outer circumferential direction of the disposed substrates, and diamond single crystals are then grown by vapor phase synthesis so that the diamond single crystal grown from said one diamond single substrate is caused to cover the diamond single crystals grown on the other substrates, to achieve an overall integration.

摘要翻译： 一种金刚石单晶复合基板，其由具有均匀平面取向的多个金刚石单晶基板构成，并且通过气相合成在其上生长金刚石单晶整体并入，其中主体的平面取向偏离 从{100}平面除去一个金刚石单晶衬底的所述多个金刚石单晶衬底中的每一个的平面的面积小于1度，排除的一个衬底的主平面的平面取向与{100 }平面为1〜8度，当金刚石单晶基板并排配置时，所述一个金刚石单晶基板配置在最外周部，并且配置成使得在所述一个的主平面中的<100>方向 衬底在所设置的衬底的外周方向上面对，然后通过气相合成生长金刚石单晶 使得从所述一个金刚石单个衬底生长的金刚石单晶被覆盖在其它衬底上生长的金刚石单晶，以实现整体的整合。

公开(公告)号：US20080042144A1

公开(公告)日：2008-02-21

申请号：US11889389

申请日：2007-08-13

申请人： Natsuo Tatsumi ,  Akihiko Namba ,  Yoshiki Nishibayashi ,  Takahiro Imai

发明人： Natsuo Tatsumi ,  Akihiko Namba ,  Yoshiki Nishibayashi ,  Takahiro Imai

IPC分类号： H01L29/15

CPC分类号： H01J63/02 ,  H01J1/3044 ,  H01J1/308

摘要： The present invention relates to an electron emitting device having a structure for efficiently emitting electrons. The electron emitting device has a substrate comprised of an n-type diamond, and a pointed projection provided on the substrate. The projection comprises a base provided on the substrate side, and an electron emission portion provided on the base and emitting electrons from the tip thereof. The base is comprised of an n-type diamond. The electron emission portion is comprised of a p-type diamond. The length from the tip of the projection (electron emission portion) to the interface between the base and the electron emission portion is preferably 100 nm or less.

摘要翻译： 本发明涉及具有有效发射电子的结构的电子发射器件。 电子发射器件具有由n型金刚石构成的基板和设置在基板上的尖突起。 突起包括设置在基板侧的基座和设置在基座上并从其尖端发射电子的电子发射部分。 底座由n型钻石组成。 电子发射部分由p型金刚石构成。 从突起（电子发射部分）的尖端到基底和电子发射部分之间的界面的长度优选为100nm以下。

公开(公告)号：US07314540B2

公开(公告)日：2008-01-01

申请号：US10547381

申请日：2004-05-25

申请人： Yuichiro Seki ,  Kenji Izumi ,  Takahiro Imai

发明人： Yuichiro Seki ,  Kenji Izumi ,  Takahiro Imai

IPC分类号： C25B11/12

CPC分类号： C02F1/46109 ,  C02F2001/46133 ,  C02F2001/46138 ,  C25B11/0442 ,  Y10T428/30

摘要： A diamond electrode having a sufficiently low resistance is disclosed which is realized by increasing the amount of boron added thereto. A method for producing a high-performance, high-durability electrode is also disclosed by which adhesiveness between a diamond coating and a substrate and separation resistance during electrolysis are sufficiently increased. An electrode composed of a substrate and a diamond layer coating the substrate is characterized in that the electrode is composed of a base coated with diamond and the diamond contains boron in such an amount that the boron concentration is not less than 10,000 ppm but not more than 100,000 ppm. The base is preferably made of an insulating material.

摘要翻译： 公开了具有足够低电阻的金刚石电极，其通过增加添加到其中的硼的量来实现。 还公开了一种用于制造高性能，高耐久性电极的方法，其中金刚石涂层和基板之间的粘合性以及电解过程中的分离电阻充分增加。 由基材和涂覆基材的金刚石层组成的电极的特征在于，电极由涂有金刚石的基底组成，金刚石含有硼，其含量不低于10,000ppm但不大于 100,000 ppm。 基部优选由绝缘材料制成。

公开(公告)号：US07307377B2

公开(公告)日：2007-12-11

申请号：US10952477

申请日：2004-09-29

申请人： Natsuo Tatsumi ,  Akihiko Namba ,  Yoshiki Nishibayashi ,  Takahiro Imai

发明人： Natsuo Tatsumi ,  Akihiko Namba ,  Yoshiki Nishibayashi ,  Takahiro Imai

IPC分类号： H01J1/02

CPC分类号： H01J63/02 ,  H01J1/3044 ,  H01J1/308

摘要： The present invention relates to an electron emitting device having a structure for efficiently emitting electrons. The electron emitting device has a substrate comprised of an n-type diamond, and a pointed projection provided on the substrate. The projection comprises a base provided on the substrate side, and an electron emission portion provided on the base and emitting electrons from the tip thereof. The base is comprised of an n-type diamond. The electron emission portion is comprised of a p-type diamond. The length from the tip of the projection (electron emission portion) to the interface between the base and the electron emission portion is preferably 100 nm or less.

摘要翻译： 本发明涉及具有有效发射电子的结构的电子发射器件。 电子发射器件具有由n型金刚石构成的衬底和设置在衬底上的尖突起。 突起包括设置在基板侧的基座和设置在基座上并从其尖端发射电子的电子发射部分。 底座由n型钻石组成。 电子发射部分由p型金刚石构成。 从突起（电子发射部分）的尖端到基底和电子发射部分之间的界面的长度优选为100nm以下。

公开(公告)号：US20070202753A1

公开(公告)日：2007-08-30

申请号：US10665833

申请日：2003-09-18

申请人： Masakazu Murakami ,  Takahiro Imai ,  Tamaki Takabayashi ,  Takenobu Yabu ,  Syougo Tomita ,  Seiichi Ueno ,  Katsunori Takeda

发明人： Masakazu Murakami ,  Takahiro Imai ,  Tamaki Takabayashi ,  Takenobu Yabu ,  Syougo Tomita ,  Seiichi Ueno ,  Katsunori Takeda

IPC分类号： H01R13/514

CPC分类号： H01R13/514 ,  H01R4/185 ,  H01R13/6658 ,  H01R31/08 ,  H01R2201/26

摘要： A joint connector according to the present invention is provided with a circuit board, a male connector having male terminals provided on the circuit board at a predetermined interval and standing in one direction and a direction that crosses the one direction, the male terminals being selectively connected by a copper foil circuit, and a female connector in which female connector elements each having female terminals inserted and interlocked in female terminal holders are stacked, wherein the male connector and the female connector are fit to each other. This achieves cost reduction and improvement in work efficiency in electric wire connection by attaining easy electric wire connection and branching.

摘要翻译： 根据本发明的接头连接器设置有电路板，阳连接器，具有以预定间隔设置在电路板上的阳端子，并且沿一个方向和与该一个方向交叉的方向竖立，阳端子被选择性地连接 通过铜箔电路和阴连接器，其中，阴连接器元件各自具有插入并互锁在阴端子保持器中的阴端子，其中阳连接器和阴连接器彼此配合。 通过实现容易的电线连接和分支，可实现电线连接的成本降低和工作效率的提高。